JP5291687B2 - 吸着テーブル - Google Patents
吸着テーブル Download PDFInfo
- Publication number
- JP5291687B2 JP5291687B2 JP2010226091A JP2010226091A JP5291687B2 JP 5291687 B2 JP5291687 B2 JP 5291687B2 JP 2010226091 A JP2010226091 A JP 2010226091A JP 2010226091 A JP2010226091 A JP 2010226091A JP 5291687 B2 JP5291687 B2 JP 5291687B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- stage
- hollow space
- suction
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Description
吸着テーブル70では、図5における金属製のステージ51に代えて、多孔質板からなるステージ71が用いられる。多孔質板には多数の微細孔が含まれており、上面71aと下面71bとの間で通気性を有している。なお、ステージ71以外の各部分は、図5と同じ構成であるので、同符号を付して説明の一部を省略する。
したがって、基板で細孔を塞いだ状態と塞がない状態とで、大きな圧力差を生じさせることができるようになり、圧力センサで中空空間の圧力を検出すれば、基板が載置された状態か、載置されていない状態かを確実に確認することができる。
図1は、本発明にかかる吸着テーブルの一実施例を示す断面図であり、図2はその平面図である。
ステージ11は多孔質材料であればよく、例えばセラミック製の多孔質板で形成される。ステージ11の周縁を除いた中央部分の直下には、ベース12に凹部を設けるようにして中空空間14が形成してあり、ステージ11の裏面11bが中空空間14に面するようにしてある。中空空間14はステージ11側に凹部を形成するようにしてもよいし、ステージ11とベース12の両側に凹部を形成するようにしてもよい。
以上の計測を行った後、圧力センサ31を真空スイッチとして使用するときの閾値Psを設定する。具体的には圧力P1,P2の間の圧力値を閾値として設定する。ここでは閾値圧力として−30KPaを設定する。なお、できるだけ大きい基板保持力を要求する場合は、閾値PsをP1に近づけるようにする。
本実施形態では、圧力センサ31を真空スイッチとして使用したが、単に、作業者が圧力センサ31の圧力値を読み取ることで、基板の有無、リークの有無を確認するようにしてもよい。
10,40 吸着テーブル
11 ステージ
12 ベース
13 テーブル本体
14 中空空間
15 プラグ
16 外部流路
17 真空ポンプ
18 エアー源
31 圧力センサ
32 位置決め部材
33,35 細孔
Claims (4)
- 多数の微細孔が含まれる多孔質板で形成され基板が載置されるステージと、前記ステージの周縁部分を支持するベースとからなり、内部に中空空間が形成されるとともに、前記ステージの裏面が前記中空空間に面するように構成されたテーブル本体と、
前記中空空間を減圧する真空排気機構と、
前記中空空間の圧力を検出する圧力センサとを備え、
前記ステージ上の一部領域であって前記基板が載置される位置に、前記多孔質板に含まれる微細孔とは別に多孔質板を貫通して中空空間に達する細孔が形成され、当該細孔の孔径が0.5mm〜1mmであることを特徴とする吸着テーブル。 - 前記細孔の数が1つである請求項1に記載の吸着テーブル。
- 前記ステージに載置される基板を前記細孔の位置を塞ぐように誘導する位置決め機構が付設される請求項2に記載の吸着テーブル。
- 前記ステージの中央に前記細孔が形成される請求項2に記載の吸着テーブル。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010226091A JP5291687B2 (ja) | 2010-10-05 | 2010-10-05 | 吸着テーブル |
TW100126563A TWI460812B (zh) | 2010-10-05 | 2011-07-27 | Adsorption platform |
KR1020110092431A KR101313016B1 (ko) | 2010-10-05 | 2011-09-14 | 흡착 테이블 |
CN201110290659.1A CN102446800B (zh) | 2010-10-05 | 2011-09-21 | 吸附台 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010226091A JP5291687B2 (ja) | 2010-10-05 | 2010-10-05 | 吸着テーブル |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012076203A JP2012076203A (ja) | 2012-04-19 |
JP5291687B2 true JP5291687B2 (ja) | 2013-09-18 |
Family
ID=46009184
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010226091A Expired - Fee Related JP5291687B2 (ja) | 2010-10-05 | 2010-10-05 | 吸着テーブル |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5291687B2 (ja) |
KR (1) | KR101313016B1 (ja) |
CN (1) | CN102446800B (ja) |
TW (1) | TWI460812B (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014033057A (ja) * | 2012-08-02 | 2014-02-20 | Murata Mfg Co Ltd | 基板吸着装置 |
KR101422355B1 (ko) * | 2012-11-21 | 2014-07-22 | 세메스 주식회사 | 버퍼 스테이지 및 이를 포함하는 다이 본딩 장치 |
JP6138503B2 (ja) * | 2013-02-04 | 2017-05-31 | 株式会社ディスコ | チャックテーブル |
CN103264303B (zh) * | 2013-05-16 | 2015-04-29 | 大连理工大学 | 低刚度薄壁腔体零件气动式精密装夹装置 |
JP2016078216A (ja) * | 2014-10-22 | 2016-05-16 | 株式会社ディスコ | バイト切削装置 |
CN106019655A (zh) * | 2016-07-26 | 2016-10-12 | 武汉华星光电技术有限公司 | 机台 |
CN106353902B (zh) * | 2016-11-08 | 2019-03-22 | 武汉华星光电技术有限公司 | 一种液晶面板移载装置及液晶面板切割系统 |
CN107608097A (zh) * | 2017-09-16 | 2018-01-19 | 合肥惠科金扬科技有限公司 | 一种面板目检喷气式治具的面板吸附台 |
JP2020066112A (ja) * | 2018-10-26 | 2020-04-30 | 株式会社ディスコ | チャックテーブル |
JP7186356B2 (ja) * | 2019-01-16 | 2022-12-09 | 株式会社東京精密 | ウェーハチャック及びウェーハ保持装置 |
JP7482825B2 (ja) * | 2021-04-19 | 2024-05-14 | 三菱電機株式会社 | 検査装置、半導体基板の検査方法、半導体基板の製造方法、および半導体装置の製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54169986U (ja) * | 1978-05-22 | 1979-11-30 | ||
JPH01170530U (ja) * | 1988-05-17 | 1989-12-01 | ||
JPH07214442A (ja) * | 1994-01-28 | 1995-08-15 | Roland D G Kk | バキューム・テーブル |
JP2000332087A (ja) * | 1999-05-25 | 2000-11-30 | Sony Corp | 基板吸着装置 |
JP2004154920A (ja) * | 2002-11-08 | 2004-06-03 | Central Glass Co Ltd | ガラス基板を吸着保持して研磨するための吸着パッド |
JP2005150177A (ja) * | 2003-11-12 | 2005-06-09 | Nitto Denko Corp | 半導体ウエハ裏面への粘着テープ貼付方法及び粘着テープ貼付装置 |
JP4851282B2 (ja) * | 2006-09-21 | 2012-01-11 | 株式会社ディスコ | 切削装置 |
-
2010
- 2010-10-05 JP JP2010226091A patent/JP5291687B2/ja not_active Expired - Fee Related
-
2011
- 2011-07-27 TW TW100126563A patent/TWI460812B/zh active
- 2011-09-14 KR KR1020110092431A patent/KR101313016B1/ko not_active IP Right Cessation
- 2011-09-21 CN CN201110290659.1A patent/CN102446800B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN102446800B (zh) | 2015-04-22 |
CN102446800A (zh) | 2012-05-09 |
KR101313016B1 (ko) | 2013-10-01 |
JP2012076203A (ja) | 2012-04-19 |
KR20120035852A (ko) | 2012-04-16 |
TW201222708A (en) | 2012-06-01 |
TWI460812B (zh) | 2014-11-11 |
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