JP6110305B2 - 部品実装装置、部品実装方法 - Google Patents

部品実装装置、部品実装方法 Download PDF

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Publication number
JP6110305B2
JP6110305B2 JP2013540146A JP2013540146A JP6110305B2 JP 6110305 B2 JP6110305 B2 JP 6110305B2 JP 2013540146 A JP2013540146 A JP 2013540146A JP 2013540146 A JP2013540146 A JP 2013540146A JP 6110305 B2 JP6110305 B2 JP 6110305B2
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JP
Japan
Prior art keywords
transport
lane
transport lane
mounting
component
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Active
Application number
JP2013540146A
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English (en)
Japanese (ja)
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JPWO2014174638A1 (ja
Inventor
順也 松野
順也 松野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Publication of JPWO2014174638A1 publication Critical patent/JPWO2014174638A1/ja
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Publication of JP6110305B2 publication Critical patent/JP6110305B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2013540146A 2013-04-25 2013-04-25 部品実装装置、部品実装方法 Active JP6110305B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/062248 WO2014174638A1 (ja) 2013-04-25 2013-04-25 部品実装装置、部品実装方法

Publications (2)

Publication Number Publication Date
JPWO2014174638A1 JPWO2014174638A1 (ja) 2017-02-23
JP6110305B2 true JP6110305B2 (ja) 2017-04-05

Family

ID=51791244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013540146A Active JP6110305B2 (ja) 2013-04-25 2013-04-25 部品実装装置、部品実装方法

Country Status (4)

Country Link
JP (1) JP6110305B2 (ko)
KR (1) KR101530249B1 (ko)
CN (1) CN105284200B (ko)
WO (1) WO2014174638A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019229880A1 (ja) * 2018-05-30 2019-12-05 ヤマハ発動機株式会社 部品補給管理システム及び部品実装システム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4978398B2 (ja) * 2007-09-27 2012-07-18 パナソニック株式会社 部品実装システム及び部品実装方法
JP4995846B2 (ja) * 2008-01-23 2012-08-08 パナソニック株式会社 実装条件決定方法
JP4872961B2 (ja) * 2008-04-04 2012-02-08 パナソニック株式会社 電子部品搭載装置
JP5120357B2 (ja) * 2009-10-14 2013-01-16 パナソニック株式会社 電子部品実装装置および電子部品実装方法
JP5321474B2 (ja) * 2010-01-15 2013-10-23 パナソニック株式会社 部品実装装置および部品実装方法
WO2011089681A1 (ja) * 2010-01-19 2011-07-28 パナソニック株式会社 部品実装方法及び部品実装装置
JP5450338B2 (ja) * 2010-10-05 2014-03-26 富士機械製造株式会社 電子部品実装機

Also Published As

Publication number Publication date
KR101530249B1 (ko) 2015-06-22
KR20140145944A (ko) 2014-12-24
WO2014174638A1 (ja) 2014-10-30
JPWO2014174638A1 (ja) 2017-02-23
CN105284200A (zh) 2016-01-27
CN105284200B (zh) 2018-01-09

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