JP6106859B2 - 発光デバイスおよび方法 - Google Patents

発光デバイスおよび方法 Download PDF

Info

Publication number
JP6106859B2
JP6106859B2 JP2013540955A JP2013540955A JP6106859B2 JP 6106859 B2 JP6106859 B2 JP 6106859B2 JP 2013540955 A JP2013540955 A JP 2013540955A JP 2013540955 A JP2013540955 A JP 2013540955A JP 6106859 B2 JP6106859 B2 JP 6106859B2
Authority
JP
Japan
Prior art keywords
leds
string
strings
led
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013540955A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014505994A (ja
JP2014505994A5 (https=
Inventor
クリストファー ピー． ハッセル
クリストファー ピー． ハッセル
ピーター スコット アンドリュー
ピーター スコット アンドリュー
ジャス コリン レイハーザー
ジャス コリン レイハーザー
デイビッド ティー． エマーソン
デイビッド ティー． エマーソン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wolfspeed Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Publication of JP2014505994A publication Critical patent/JP2014505994A/ja
Publication of JP2014505994A5 publication Critical patent/JP2014505994A5/ja
Application granted granted Critical
Publication of JP6106859B2 publication Critical patent/JP6106859B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
JP2013540955A 2010-11-22 2011-10-31 発光デバイスおよび方法 Active JP6106859B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US41618410P 2010-11-22 2010-11-22
US61/416,184 2010-11-22
US13/104,558 US8624271B2 (en) 2010-11-22 2011-05-10 Light emitting devices
US13/104,558 2011-05-10
PCT/US2011/058603 WO2012071139A2 (en) 2010-11-22 2011-10-31 Light emitting devices and methods

Publications (3)

Publication Number Publication Date
JP2014505994A JP2014505994A (ja) 2014-03-06
JP2014505994A5 JP2014505994A5 (https=) 2015-07-02
JP6106859B2 true JP6106859B2 (ja) 2017-04-05

Family

ID=46146350

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013540955A Active JP6106859B2 (ja) 2010-11-22 2011-10-31 発光デバイスおよび方法

Country Status (6)

Country Link
US (2) US8624271B2 (https=)
EP (1) EP2643861A2 (https=)
JP (1) JP6106859B2 (https=)
CN (1) CN103329290B (https=)
TW (1) TWI481072B (https=)
WO (1) WO2012071139A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10134961B2 (en) 2012-03-30 2018-11-20 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10008637B2 (en) 2011-12-06 2018-06-26 Cree, Inc. Light emitter devices and methods with reduced dimensions and improved light output
US8564000B2 (en) 2010-11-22 2013-10-22 Cree, Inc. Light emitting devices for light emitting diodes (LEDs)
USD712850S1 (en) 2010-11-18 2014-09-09 Cree, Inc. Light emitter device
USD676000S1 (en) 2010-11-22 2013-02-12 Cree, Inc. Light emitting device package
USD707192S1 (en) 2010-11-18 2014-06-17 Cree, Inc. Light emitting device
USD721339S1 (en) 2010-12-03 2015-01-20 Cree, Inc. Light emitter device
US9000470B2 (en) 2010-11-22 2015-04-07 Cree, Inc. Light emitter devices
US10267506B2 (en) 2010-11-22 2019-04-23 Cree, Inc. Solid state lighting apparatuses with non-uniformly spaced emitters for improved heat distribution, system having the same, and methods having the same
US9300062B2 (en) 2010-11-22 2016-03-29 Cree, Inc. Attachment devices and methods for light emitting devices
US8624271B2 (en) 2010-11-22 2014-01-07 Cree, Inc. Light emitting devices
US8575639B2 (en) 2011-02-16 2013-11-05 Cree, Inc. Light emitting devices for light emitting diodes (LEDs)
US9490235B2 (en) 2010-11-22 2016-11-08 Cree, Inc. Light emitting devices, systems, and methods
USD706231S1 (en) 2010-12-03 2014-06-03 Cree, Inc. Light emitting device
US8809880B2 (en) 2011-02-16 2014-08-19 Cree, Inc. Light emitting diode (LED) chips and devices for providing failure mitigation in LED arrays
US8455908B2 (en) 2011-02-16 2013-06-04 Cree, Inc. Light emitting devices
USD702653S1 (en) 2011-10-26 2014-04-15 Cree, Inc. Light emitting device component
TW201312807A (zh) 2011-07-21 2013-03-16 克里股份有限公司 光發射器元件封裝與部件及改良化學抵抗性的方法與相關方法
US10211380B2 (en) 2011-07-21 2019-02-19 Cree, Inc. Light emitting devices and components having improved chemical resistance and related methods
US10686107B2 (en) 2011-07-21 2020-06-16 Cree, Inc. Light emitter devices and components with improved chemical resistance and related methods
USD705181S1 (en) 2011-10-26 2014-05-20 Cree, Inc. Light emitting device component
KR20140097284A (ko) 2011-11-07 2014-08-06 크리,인코포레이티드 고전압 어레이 발광다이오드(led) 장치, 기구 및 방법
US10043960B2 (en) * 2011-11-15 2018-08-07 Cree, Inc. Light emitting diode (LED) packages and related methods
JP2013118292A (ja) 2011-12-02 2013-06-13 Citizen Electronics Co Ltd Ｌｅｄ発光装置
US9496466B2 (en) 2011-12-06 2016-11-15 Cree, Inc. Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction
US9806246B2 (en) 2012-02-07 2017-10-31 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components, and methods
US9786825B2 (en) 2012-02-07 2017-10-10 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components, and methods
US9343441B2 (en) 2012-02-13 2016-05-17 Cree, Inc. Light emitter devices having improved light output and related methods
US9240530B2 (en) 2012-02-13 2016-01-19 Cree, Inc. Light emitter devices having improved chemical and physical resistance and related methods
US20130242538A1 (en) * 2012-03-13 2013-09-19 Shenzhen China Star Optoelectronics Technology Co Ltd. Led light bar and backlight module
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US9538590B2 (en) 2012-03-30 2017-01-03 Cree, Inc. Solid state lighting apparatuses, systems, and related methods
JP6024957B2 (ja) * 2012-09-24 2016-11-16 東芝ライテック株式会社 発光装置および照明装置
US9345091B2 (en) 2013-02-08 2016-05-17 Cree, Inc. Light emitting device (LED) light fixture control systems and related methods
US10094523B2 (en) * 2013-04-19 2018-10-09 Cree, Inc. LED assembly
USD739565S1 (en) 2013-06-27 2015-09-22 Cree, Inc. Light emitter unit
USD740453S1 (en) 2013-06-27 2015-10-06 Cree, Inc. Light emitter unit
USD771579S1 (en) * 2014-05-26 2016-11-15 Citizens Electronics Co., Ltd. Light emitting diode
JP1524801S (https=) * 2014-05-26 2015-06-01
TWI556478B (zh) * 2014-06-30 2016-11-01 億光電子工業股份有限公司 發光二極體裝置
JP6256699B2 (ja) * 2014-11-11 2018-01-10 豊田合成株式会社 発光装置
US10453825B2 (en) * 2014-11-11 2019-10-22 Cree, Inc. Light emitting diode (LED) components and methods
US9826581B2 (en) 2014-12-05 2017-11-21 Cree, Inc. Voltage configurable solid state lighting apparatuses, systems, and related methods
USD786809S1 (en) 2015-05-20 2017-05-16 Citizen Electronics Co., Ltd. Light emitting diode
JP1545462S (https=) * 2015-05-20 2016-03-14
DE112016003002T5 (de) 2015-06-30 2018-03-15 Cree, Inc. Stabilisierte Quantenpunktstruktur und Verfahren zur Herstellung einer stabilisierten Quantenpunktstruktur
JP6610866B2 (ja) 2015-08-31 2019-11-27 パナソニックＩｐマネジメント株式会社 発光装置、及び照明装置
JP6633881B2 (ja) * 2015-09-30 2020-01-22 ローム株式会社 Ｌｅｄ照明器具およびその製造方法
JP6788860B2 (ja) * 2016-08-23 2020-11-25 パナソニックＩｐマネジメント株式会社 発光装置、及び照明装置
USD823492S1 (en) 2016-10-04 2018-07-17 Cree, Inc. Light emitting device
US10804251B2 (en) 2016-11-22 2020-10-13 Cree, Inc. Light emitting diode (LED) devices, components and methods
USD831591S1 (en) * 2017-01-20 2018-10-23 Citizen Electronics Co., Ltd. Light emitting diode
USD847769S1 (en) * 2017-01-31 2019-05-07 Citizen Electronics Co., Ltd. Light emitting diode
US10260683B2 (en) 2017-05-10 2019-04-16 Cree, Inc. Solid-state lamp with LED filaments having different CCT's
US10741730B2 (en) 2017-11-10 2020-08-11 Cree, Inc. Stabilized luminescent nanoparticles comprising a perovskite semiconductor and method of fabrication
US10347799B2 (en) 2017-11-10 2019-07-09 Cree, Inc. Stabilized quantum dot composite and method of making a stabilized quantum dot composite
JP2019186505A (ja) * 2018-04-17 2019-10-24 パナソニックＩｐマネジメント株式会社 発光装置、照明装置、及び、シリコーン樹脂
US10608148B2 (en) 2018-05-31 2020-03-31 Cree, Inc. Stabilized fluoride phosphor for light emitting diode (LED) applications
USD905648S1 (en) * 2019-04-24 2020-12-22 Patrick Art Ivs LCD display
US11083059B2 (en) 2019-10-03 2021-08-03 Creeled, Inc. Lumiphoric arrangements for light emitting diode packages
CN115332417A (zh) * 2019-11-15 2022-11-11 厦门三安光电有限公司 一种发光二极管及其制作方法
CN112151519B (zh) * 2020-10-23 2025-06-20 普瑞光电(厦门)股份有限公司 板上芯片型光电器件
JP7328557B2 (ja) * 2020-11-30 2023-08-17 日亜化学工業株式会社 光源、光源装置および光源の製造方法
JP1695392S (https=) * 2020-12-02 2021-09-21
USD1000400S1 (en) * 2021-04-16 2023-10-03 Creeled, Inc. Light emitting diode package
JP7705035B2 (ja) * 2021-09-21 2025-07-09 日亜化学工業株式会社 発光装置

Family Cites Families (202)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US34861A (en) 1862-04-01 Improved washing-machine
US4855194A (en) 1988-02-05 1989-08-08 The United States Of America As Represented By The United States Department Of Energy Fuel cell having electrolyte inventory control volume
US4866005A (en) 1987-10-26 1989-09-12 North Carolina State University Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide
US4946547A (en) 1989-10-13 1990-08-07 Cree Research, Inc. Method of preparing silicon carbide surfaces for crystal growth
US5210051A (en) 1990-03-27 1993-05-11 Cree Research, Inc. High efficiency light emitting diodes from bipolar gallium nitride
US5200022A (en) 1990-10-03 1993-04-06 Cree Research, Inc. Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product
JPH0738940Y2 (ja) 1991-05-13 1995-09-06 スタンレー電気株式会社 Ｌｅｄ表示灯
JP3231903B2 (ja) 1993-07-22 2001-11-26 日本電信電話株式会社 チャネル割り当て方式
US5393993A (en) 1993-12-13 1995-02-28 Cree Research, Inc. Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices
US5523589A (en) 1994-09-20 1996-06-04 Cree Research, Inc. Vertical geometry light emitting diode with group III nitride active layer and extended lifetime
CN2229178Y (zh) 1995-06-27 1996-06-19 王德明 多用桌
CN2229677Y (zh) 1995-06-28 1996-06-19 简俊弘 改良的电脑壳体
JPH10247748A (ja) * 1997-03-03 1998-09-14 Omron Corp 発光素子及び当該発光素子を用いた面光源装置
JPH10311937A (ja) 1997-05-14 1998-11-24 Japan Aviation Electron Ind Ltd 端面発光素子或は受光素子の実装構造
JP3862870B2 (ja) 1997-09-25 2006-12-27 北陸電気工業株式会社 半田レスの端子金具を備えた電気部品
JP2000251977A (ja) 1999-02-26 2000-09-14 Fujitsu Ltd 電源供給端子
US6442832B1 (en) 1999-04-26 2002-09-03 Agilent Technologies, Inc. Method for coupling a circuit board to a transmission line that includes a heat sensitive dielectric
US6548832B1 (en) 1999-06-09 2003-04-15 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
DE10016817A1 (de) 2000-04-05 2001-10-18 Mannesmann Vdo Ag Farb-Head-up Display, insbesondere für ein Fahrzeug
JP2001294083A (ja) 2000-04-14 2001-10-23 Yazaki Corp 車両の室内照明装置
CN2432021Y (zh) 2000-07-21 2001-05-30 刘勇 新型服装裁剪剪刀
US6547249B2 (en) 2001-03-29 2003-04-15 Lumileds Lighting U.S., Llc Monolithic series/parallel led arrays formed on highly resistive substrates
EP1451872B1 (de) 2001-09-13 2007-03-07 Lucea AG Leuchtdioden-leuchtpaneel und leiterplatte
JP2003303504A (ja) * 2002-04-10 2003-10-24 Meiji Natl Ind Co Ltd 発光ダイオードを用いた照明器具
US7224000B2 (en) 2002-08-30 2007-05-29 Lumination, Llc Light emitting diode component
US7244965B2 (en) 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
JP2004265986A (ja) 2003-02-28 2004-09-24 Citizen Electronics Co Ltd 高輝度発光素子及びそれを用いた発光装置及び高輝度発光素子の製造方法
JP2004311101A (ja) 2003-04-03 2004-11-04 Koito Mfg Co Ltd 車両用前照灯及び半導体発光素子
WO2005018008A1 (ja) 2003-08-19 2005-02-24 Nichia Corporation 半導体素子
US20050152145A1 (en) 2003-08-28 2005-07-14 Currie Robert M. Vehicle lighting system having an electronic module circuit and light emitting diodes
KR100541395B1 (ko) 2003-09-09 2006-01-11 삼성전자주식회사 반도체칩 적층장치, 이것을 이용한 반도체 패키지의제조방법, 그리고 이러한 방법에 의하여 제조된 반도체패키지
US6982518B2 (en) * 2003-10-01 2006-01-03 Enertron, Inc. Methods and apparatus for an LED light
US7482636B2 (en) 2003-10-15 2009-01-27 Nichia Corporation Light emitting device
JP2005183148A (ja) * 2003-12-18 2005-07-07 Tsubakimoto Chain Co 照明装置及び仕分けシステム
US20050199899A1 (en) 2004-03-11 2005-09-15 Ming-Der Lin Package array and package unit of flip chip LED
JP2005266117A (ja) 2004-03-17 2005-09-29 Rohm Co Ltd 平面ディスプレイ
JP2005276979A (ja) * 2004-03-24 2005-10-06 Matsushita Electric Ind Co Ltd Ｌｅｄ光源
US7791061B2 (en) 2004-05-18 2010-09-07 Cree, Inc. External extraction light emitting diode based upon crystallographic faceted surfaces
US7683391B2 (en) 2004-05-26 2010-03-23 Lockheed Martin Corporation UV emitting LED having mesa structure
KR101095637B1 (ko) 2004-09-23 2011-12-19 삼성전자주식회사 광 발생 장치, 이를 갖는 백라이트 어셈블리 및 백라이트어셈블리를 갖는 표시장치
DE102004047260B4 (de) 2004-09-24 2006-08-03 Siemens Ag Isolierstoffgehäuse mit Belüftungsschacht
TWD110201S1 (zh) 2004-10-14 2006-04-11 東芝照明技術股份有限公司 照明用發光體
KR101154801B1 (ko) 2004-12-03 2012-07-03 엔지케이 스파크 플러그 캄파니 리미티드 세라믹 기판 및 발광 소자 수납용 세라믹 패키지
US7352440B2 (en) 2004-12-10 2008-04-01 Asml Netherlands B.V. Substrate placement in immersion lithography
US20060139595A1 (en) 2004-12-27 2006-06-29 Asml Netherlands B.V. Lithographic apparatus and method for determining Z position errors/variations and substrate table flatness
US7821023B2 (en) 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US7939842B2 (en) 2005-01-27 2011-05-10 Cree, Inc. Light emitting device packages, light emitting diode (LED) packages and related methods
USD528672S1 (en) 2005-01-28 2006-09-19 Matsushita Electric Industrial Co., Ltd. LED module
KR100663906B1 (ko) 2005-03-14 2007-01-02 서울반도체 주식회사 발광 장치
JP2006294898A (ja) 2005-04-12 2006-10-26 Sumitomo Metal Electronics Devices Inc 発光素子収納用パッケージ
USD535262S1 (en) 2005-06-08 2007-01-16 Matsushita Electric Industrial Co., Ltd. Light emitting diode module
US7365371B2 (en) 2005-08-04 2008-04-29 Cree, Inc. Packages for semiconductor light emitting devices utilizing dispensed encapsulants
WO2007018360A1 (en) 2005-08-09 2007-02-15 Seoul Opto Device Co., Ltd. Ac light emitting diode and method for fabricating the same
US8563339B2 (en) 2005-08-25 2013-10-22 Cree, Inc. System for and method for closed loop electrophoretic deposition of phosphor materials on semiconductor devices
US7550319B2 (en) 2005-09-01 2009-06-23 E. I. Du Pont De Nemours And Company Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof
US7479660B2 (en) 2005-10-21 2009-01-20 Perkinelmer Elcos Gmbh Multichip on-board LED illumination device
US7213940B1 (en) 2005-12-21 2007-05-08 Led Lighting Fixtures, Inc. Lighting device and lighting method
JP4049186B2 (ja) 2006-01-26 2008-02-20 ソニー株式会社 光源装置
KR100819883B1 (ko) 2006-02-17 2008-04-07 삼성전자주식회사 발광소자 패키지 및 그 제조방법
JP5027427B2 (ja) 2006-02-23 2012-09-19 パナソニック株式会社 発光ダイオードを用いた白色照明装置
KR100793338B1 (ko) 2006-02-23 2008-01-11 삼성전기주식회사 발광 다이오드 모듈
JP4992250B2 (ja) 2006-03-01 2012-08-08 日亜化学工業株式会社 発光装置
KR100738933B1 (ko) 2006-03-17 2007-07-12 (주)대신엘이디 조명용 ｌｅｄ 모듈
JP4789672B2 (ja) 2006-03-29 2011-10-12 京セラ株式会社 発光装置および照明装置
CN2917018Y (zh) 2006-04-10 2007-06-27 富士康(昆山)电脑接插件有限公司 线缆连接器组件
TWI301679B (en) 2006-04-14 2008-10-01 High Power Optoelectronics Inc Semiconductor light emitting device and method of fabricating the same
TWI460880B (zh) * 2006-04-18 2014-11-11 Cree Inc 照明裝置及照明方法
CN102437152A (zh) 2006-04-24 2012-05-02 克利公司 侧视表面安装式白光led
US7655957B2 (en) 2006-04-27 2010-02-02 Cree, Inc. Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same
JP4605096B2 (ja) 2006-05-30 2011-01-05 ソニー株式会社 バックライト装置及びカラー画像表示装置
JP2007335371A (ja) 2006-06-19 2007-12-27 Harison Toshiba Lighting Corp 面照明装置
USD570506S1 (en) 2006-06-20 2008-06-03 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
US8044418B2 (en) 2006-07-13 2011-10-25 Cree, Inc. Leadframe-based packages for solid state light emitting devices
USD570797S1 (en) 2006-07-14 2008-06-10 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
USD593043S1 (en) 2006-07-14 2009-05-26 Samsung Electro-Mechanics Co., Ltd. Light emitting diode
US20080019130A1 (en) 2006-07-24 2008-01-24 Pei-Choa Wang Arrangement of Light-Emitting Diodes Of LED Lamp
US7943952B2 (en) 2006-07-31 2011-05-17 Cree, Inc. Method of uniform phosphor chip coating and LED package fabricated using method
US7804147B2 (en) 2006-07-31 2010-09-28 Cree, Inc. Light emitting diode package element with internal meniscus for bubble free lens placement
KR100793581B1 (ko) 2006-08-29 2008-01-14 엘지이노텍 주식회사 백라이트 유닛 및 이를 이용한 디스플레이 장치
US7910938B2 (en) 2006-09-01 2011-03-22 Cree, Inc. Encapsulant profile for light emitting diodes
US8425271B2 (en) 2006-09-01 2013-04-23 Cree, Inc. Phosphor position in light emitting diodes
US20080089072A1 (en) 2006-10-11 2008-04-17 Alti-Electronics Co., Ltd. High Power Light Emitting Diode Package
USD575246S1 (en) 2006-11-15 2008-08-19 Citizen Electronics Co., Ltd. Light-emitting diode unit for illuminating an object
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9159888B2 (en) 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
USD573553S1 (en) 2007-02-09 2008-07-22 Matsushita Electric Industrial Co., Ltd. Light source of light-emitting diode
US8610143B2 (en) * 2007-03-12 2013-12-17 Nichia Corporation High output power light emitting device and package used therefor
US7510400B2 (en) 2007-03-14 2009-03-31 Visteon Global Technologies, Inc. LED interconnect spring clip assembly
JP5089212B2 (ja) 2007-03-23 2012-12-05 シャープ株式会社 発光装置およびそれを用いたｌｅｄランプ、発光装置の製造方法
US7656518B2 (en) 2007-03-30 2010-02-02 Asml Netherlands B.V. Method of measuring asymmetry in a scatterometer, a method of measuring an overlay error in a substrate and a metrology apparatus
US20080258130A1 (en) 2007-04-23 2008-10-23 Bergmann Michael J Beveled LED Chip with Transparent Substrate
TWD125589S (zh) 2007-05-25 2008-10-21 松下電器產業股份有限公司 發光二極體照明光源
USD576576S1 (en) 2007-05-25 2008-09-09 Matsushita Electric Industrial Co., Ltd. Light source of light emitting diode
US7614771B2 (en) 2007-07-05 2009-11-10 Tyco Electronics Corporation Wireless controlled light emitting assembly
US7621752B2 (en) 2007-07-17 2009-11-24 Visteon Global Technologies, Inc. LED interconnection integrated connector holder package
KR101283282B1 (ko) 2007-07-25 2013-07-11 엘지이노텍 주식회사 발광 소자 패키지 및 그 제조방법
TWI478271B (zh) 2007-08-10 2015-03-21 尼康股份有限公司 Substrate bonding device and substrate bonding method
JP2009044055A (ja) 2007-08-10 2009-02-26 Toshiba Lighting & Technology Corp Ｌｅｄモジュールおよびｌｅｄ照明器具
FR2921537A1 (fr) 2007-09-20 2009-03-27 Stephane Jebabli Structure lumineuse pour aquarium d'eau douce tropicale et d'eau de mer recifale
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US7611376B2 (en) 2007-11-20 2009-11-03 Tyco Electronics Corporation LED socket
TWD128709S1 (zh) 2007-12-05 2009-05-11 西鐵城電子股份有限公司 照明物件用之發光二極體
TWD128525S1 (zh) 2007-12-05 2009-05-01 西鐵城電子股份有限公司 照明物件用之發光二極體
USD607420S1 (en) 2007-12-05 2010-01-05 Citizen Electronics Co., Ltd. Light-emitting diode for illuminating an object
CN101459211B (zh) 2007-12-11 2011-03-02 富士迈半导体精密工业（上海）有限公司 固态发光器件
US8167674B2 (en) 2007-12-14 2012-05-01 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US8049237B2 (en) 2007-12-28 2011-11-01 Nichia Corporation Light emitting device
US8058088B2 (en) 2008-01-15 2011-11-15 Cree, Inc. Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating
US8940561B2 (en) 2008-01-15 2015-01-27 Cree, Inc. Systems and methods for application of optical materials to optical elements
TWD125932S1 (zh) 2008-02-01 2008-11-11 新燈源科技有限公司 發光模組
TWI360239B (en) 2008-03-19 2012-03-11 E Pin Optical Industry Co Ltd Package structure for light emitting diode
US7833045B2 (en) 2008-03-24 2010-11-16 Avx Corporation Insulation displacement connector (IDC)
US8324723B2 (en) 2008-03-25 2012-12-04 Bridge Semiconductor Corporation Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump
US8890186B2 (en) * 2008-03-28 2014-11-18 Panasonic Corporation Molded resin product, semiconductor light-emitting source, lighting device, and method for manufacturing molded resin product
TW200945570A (en) 2008-04-18 2009-11-01 Top Crystal Technology Inc High-voltage LED circuit with multi-staged threshold voltage and diode light-emitting device thereof
KR20090011121U (ko) 2008-04-25 2009-10-29 이봉한 벌레잡이
USD622876S1 (en) 2008-04-25 2010-08-31 Toshiba Lighting & Technology Corporation Light emitting diode module
WO2009133615A1 (ja) * 2008-05-01 2009-11-05 株式会社グローバル・アイ Ｌｅｄを用いた照明器具
WO2009141982A1 (ja) * 2008-05-19 2009-11-26 株式会社 東芝 線状白色光源ならびにそれを用いたバックライトおよび液晶表示装置
CA128592S (en) 2008-05-20 2009-11-30 Philips Electronics Ltd Led module
US7667169B2 (en) 2008-05-22 2010-02-23 Omnivision Technologies, Inc. Image sensor with simultaneous auto-focus and image preview
US8461613B2 (en) 2008-05-27 2013-06-11 Interlight Optotech Corporation Light emitting device
JP2009289918A (ja) 2008-05-28 2009-12-10 Alps Electric Co Ltd 半導体発光装置
US9147812B2 (en) 2008-06-24 2015-09-29 Cree, Inc. Methods of assembly for a semiconductor light emitting device package
JP2010009972A (ja) 2008-06-27 2010-01-14 Toshiba Lighting & Technology Corp 発光モジュール及び発光装置
US7859190B2 (en) 2008-09-10 2010-12-28 Bridgelux, Inc. Phosphor layer arrangement for use with light emitting diodes
US8022626B2 (en) 2008-09-16 2011-09-20 Osram Sylvania Inc. Lighting module
US8247827B2 (en) * 2008-09-30 2012-08-21 Bridgelux, Inc. LED phosphor deposition
USD603813S1 (en) 2008-10-01 2009-11-10 Toshiba Lighting & Technology Corporation Light emitting diode module
US20100096642A1 (en) 2008-10-20 2010-04-22 Brilliant Technology Co., Ltd. Packaging struture for high power light emitting diode(led) chip
US9425172B2 (en) * 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
US7854365B2 (en) * 2008-10-27 2010-12-21 Asm Assembly Automation Ltd Direct die attach utilizing heated bond head
JP5379465B2 (ja) * 2008-12-17 2013-12-25 パナソニック株式会社 発光装置
JP2010199547A (ja) * 2009-01-30 2010-09-09 Nichia Corp 発光装置及びその製造方法
JP5283539B2 (ja) * 2009-03-03 2013-09-04 シャープ株式会社 発光装置、発光装置ユニット、および発光装置製造方法
CN101865372A (zh) 2009-04-20 2010-10-20 富准精密工业(深圳)有限公司 发光二极管灯具
US8957435B2 (en) 2009-04-28 2015-02-17 Cree, Inc. Lighting device
USD615051S1 (en) 2009-05-05 2010-05-04 Prolight Opto Technology Corporation LED package
JP2011009298A (ja) * 2009-06-23 2011-01-13 Citizen Electronics Co Ltd 発光ダイオード光源装置
KR101061246B1 (ko) 2009-07-08 2011-08-31 한성엘컴텍 주식회사 소켓 결합형의 ｌｅｄ램프
JP5366688B2 (ja) 2009-07-16 2013-12-11 日本航空電子工業株式会社 ソケット、基板組立体及びそれを備える装置
US8901829B2 (en) 2009-09-24 2014-12-02 Cree Led Lighting Solutions, Inc. Solid state lighting apparatus with configurable shunts
JP2011071242A (ja) 2009-09-24 2011-04-07 Toshiba Lighting & Technology Corp 発光装置及び照明装置
US9713211B2 (en) 2009-09-24 2017-07-18 Cree, Inc. Solid state lighting apparatus with controllable bypass circuits and methods of operation thereof
CN102032481B (zh) 2009-09-25 2014-01-08 东芝照明技术株式会社 附带灯口的照明灯及照明器具
USD630171S1 (en) 2009-10-16 2011-01-04 Everlight Electronics Co., Ltd. Light emitting diode
CN102044602A (zh) 2009-10-23 2011-05-04 亿光电子工业股份有限公司 发光二极管封装结构
USD615052S1 (en) 2009-10-27 2010-05-04 Citizen Electronics Co. Ltd. Light-emitting diode
US8337214B2 (en) 2009-11-13 2012-12-25 Cree, Inc. Electrical connectors and light emitting device package and methods of assembling the same
TWM379163U (en) 2009-11-26 2010-04-21 Truelight Corp Packaging apparatus for high power and high orientation matrix semiconductor light-emitting devices
TWM379717U (en) 2009-11-26 2010-05-01 Alliance Optotek Corp Modular illuminating device
KR101619832B1 (ko) 2009-11-30 2016-05-13 삼성전자주식회사 발광다이오드 패키지, 이를 구비한 발광다이오드 패키지 모듈과 그 제조 방법, 및 이를 구비한 헤드 램프 모듈과 그 제어 방법
US7993025B2 (en) 2009-12-01 2011-08-09 Davinci Industrial Inc. LED lamp
US8241044B2 (en) 2009-12-09 2012-08-14 Tyco Electronics Corporation LED socket assembly
CN101876406A (zh) 2009-12-14 2010-11-03 东莞市光宇新能源科技有限公司 一种大功率led灯的制作工艺
USD636899S1 (en) 2010-01-28 2011-04-26 Toshiba Lighting & Technology Corporation Light emitting diode module
US7955147B1 (en) 2010-03-15 2011-06-07 Zierick Manufacturing Corporation Surface mount (SMT) crimp terminal and method of securing wire to same
USD640997S1 (en) 2010-04-01 2011-07-05 Citizen Electronics Co., Ltd. Light-emitting diode
USD645417S1 (en) 2010-04-01 2011-09-20 Citizen Electronics Co., Ltd. Light-emitting diode
US8517572B2 (en) 2010-05-06 2013-08-27 Heathco, Llc Method and apparatus pertaining to a cone-shaped lens in combination with a lateral member
TWD145644S1 (zh) 2010-05-07 2012-03-01 日亞化學工業股份有限公司 發光二極體
JP5846408B2 (ja) 2010-05-26 2016-01-20 東芝ライテック株式会社 発光装置および照明装置
JP4676565B2 (ja) 2010-06-08 2011-04-27 シャープ株式会社 記録装置
USD658602S1 (en) 2010-06-15 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
USD658603S1 (en) 2010-06-15 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
USD658601S1 (en) 2010-06-15 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
USD665519S1 (en) 2010-06-22 2012-08-14 Toshiba Lighting & Technology Corporation Light emitting diode module
WO2012029360A1 (ja) * 2010-08-30 2012-03-08 シャープ株式会社 照明装置および表示装置
US8410679B2 (en) 2010-09-21 2013-04-02 Cree, Inc. Semiconductor light emitting devices with densely packed phosphor layer at light emitting surface
JP5612991B2 (ja) * 2010-09-30 2014-10-22 シャープ株式会社 発光装置及びこれを備えた照明装置
USD669041S1 (en) 2010-10-05 2012-10-16 Citizen Electronics Co., Ltd. Light-emitting diode
TWD141645S1 (zh) 2010-10-15 2011-07-21 艾笛森光電股份有限公司 發光二極體
USD637564S1 (en) 2010-10-19 2011-05-10 Edison Opto Corporation Light emitting diode
USD676000S1 (en) 2010-11-22 2013-02-12 Cree, Inc. Light emitting device package
USD707192S1 (en) 2010-11-18 2014-06-17 Cree, Inc. Light emitting device
USD712850S1 (en) 2010-11-18 2014-09-09 Cree, Inc. Light emitter device
USD721339S1 (en) 2010-12-03 2015-01-20 Cree, Inc. Light emitter device
US8564000B2 (en) 2010-11-22 2013-10-22 Cree, Inc. Light emitting devices for light emitting diodes (LEDs)
US8624271B2 (en) 2010-11-22 2014-01-07 Cree, Inc. Light emitting devices
US9490235B2 (en) 2010-11-22 2016-11-08 Cree, Inc. Light emitting devices, systems, and methods
US8575639B2 (en) 2011-02-16 2013-11-05 Cree, Inc. Light emitting devices for light emitting diodes (LEDs)
US9300062B2 (en) 2010-11-22 2016-03-29 Cree, Inc. Attachment devices and methods for light emitting devices
US9000470B2 (en) 2010-11-22 2015-04-07 Cree, Inc. Light emitter devices
USD650760S1 (en) 2010-11-22 2011-12-20 Cree, Inc. Light emitting device package
USD706231S1 (en) 2010-12-03 2014-06-03 Cree, Inc. Light emitting device
USD683708S1 (en) 2010-12-09 2013-06-04 Nichia Corporation Light emitting diode
US8354684B2 (en) 2011-01-09 2013-01-15 Bridgelux, Inc. Packaging photon building blocks having only top side connections in an interconnect structure
USD702653S1 (en) 2011-10-26 2014-04-15 Cree, Inc. Light emitting device component
US8809880B2 (en) 2011-02-16 2014-08-19 Cree, Inc. Light emitting diode (LED) chips and devices for providing failure mitigation in LED arrays
US8455908B2 (en) 2011-02-16 2013-06-04 Cree, Inc. Light emitting devices
US8272766B2 (en) 2011-03-18 2012-09-25 Abl Ip Holding Llc Semiconductor lamp with thermal handling system
EP2503214B1 (en) 2011-03-24 2016-05-18 OSRAM GmbH Mounting structure for solid-state light sources
US20130058099A1 (en) 2011-09-02 2013-03-07 Soraa, Inc. High Intensity Light Source with Interchangeable Optics
USD705181S1 (en) 2011-10-26 2014-05-20 Cree, Inc. Light emitting device component
KR20140097284A (ko) 2011-11-07 2014-08-06 크리,인코포레이티드 고전압 어레이 발광다이오드(led) 장치, 기구 및 방법
USD689451S1 (en) 2012-01-24 2013-09-10 Toyoda Gosei Co., Ltd. Light emitting diode
US9240530B2 (en) 2012-02-13 2016-01-19 Cree, Inc. Light emitter devices having improved chemical and physical resistance and related methods
CN104115291A (zh) 2012-02-13 2014-10-22 克利公司 改进的发光设备和方法
US9343441B2 (en) 2012-02-13 2016-05-17 Cree, Inc. Light emitter devices having improved light output and related methods
TWD159850S (zh) 2012-03-30 2014-04-11 克里股份有限公司 發光裝置之部分（三）
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
TWD159326S (zh) 2012-06-27 2014-03-11 克里股份有限公司 光發射器裝置之部分（三）

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10134961B2 (en) 2012-03-30 2018-11-20 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods

Also Published As

Publication number Publication date
TWI481072B (zh) 2015-04-11
US9209354B2 (en) 2015-12-08
TW201232813A (en) 2012-08-01
CN103329290B (zh) 2017-09-29
US20140183577A1 (en) 2014-07-03
WO2012071139A2 (en) 2012-05-31
EP2643861A2 (en) 2013-10-02
WO2012071139A3 (en) 2012-07-12
US8624271B2 (en) 2014-01-07
JP2014505994A (ja) 2014-03-06
CN103329290A (zh) 2013-09-25
US20120126257A1 (en) 2012-05-24

Similar Documents

Publication Publication Date Title
JP6106859B2 (ja) 発光デバイスおよび方法
US8455908B2 (en) Light emitting devices
US8994057B2 (en) Light emitting devices for light emitting diodes (LEDS)
US9000470B2 (en) Light emitter devices
US8564000B2 (en) Light emitting devices for light emitting diodes (LEDs)
KR101487867B1 (ko) 멀티칩 발광 다이오드 디바이스들
US9490235B2 (en) Light emitting devices, systems, and methods
US11101408B2 (en) Components and methods for light emitting diode (LED) lighting
CN104115291A (zh) 改进的发光设备和方法
US20130077299A1 (en) High voltage array light emitting diode (led) devices, fixtures and methods
CN104396036A (zh) 光发射器封装、系统、以及方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140408

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140408

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20141226

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150120

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20150416

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20150515

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150707

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151001

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20151215

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160310

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160426

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160726

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20161018

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20161025

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170110

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170207

R150 Certificate of patent or registration of utility model

Ref document number: 6106859

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250