JP6098457B2 - 点灯装置及び点灯装置を備えた灯具 - Google Patents

点灯装置及び点灯装置を備えた灯具 Download PDF

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Publication number
JP6098457B2
JP6098457B2 JP2013193395A JP2013193395A JP6098457B2 JP 6098457 B2 JP6098457 B2 JP 6098457B2 JP 2013193395 A JP2013193395 A JP 2013193395A JP 2013193395 A JP2013193395 A JP 2013193395A JP 6098457 B2 JP6098457 B2 JP 6098457B2
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JP
Japan
Prior art keywords
lighting device
heat
circuit
heat sink
circuit element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013193395A
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English (en)
Japanese (ja)
Other versions
JP2015060709A5 (enExample
JP2015060709A (ja
Inventor
加藤 公一
公一 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2013193395A priority Critical patent/JP6098457B2/ja
Priority to DE112014004286.2T priority patent/DE112014004286B4/de
Priority to PCT/JP2014/004486 priority patent/WO2015040805A1/ja
Priority to US14/889,169 priority patent/US10054301B2/en
Publication of JP2015060709A publication Critical patent/JP2015060709A/ja
Publication of JP2015060709A5 publication Critical patent/JP2015060709A5/ja
Application granted granted Critical
Publication of JP6098457B2 publication Critical patent/JP6098457B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30Driver circuits
    • H05B45/37Converter circuits
    • H05B45/3725Switched mode power supply [SMPS]
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/60Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1306Field-effect transistor [FET]
    • H01L2924/13091Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
JP2013193395A 2013-09-18 2013-09-18 点灯装置及び点灯装置を備えた灯具 Expired - Fee Related JP6098457B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013193395A JP6098457B2 (ja) 2013-09-18 2013-09-18 点灯装置及び点灯装置を備えた灯具
DE112014004286.2T DE112014004286B4 (de) 2013-09-18 2014-09-02 Beleuchtungsvorrichtung und Beleuchtungsgerät mit dieser Beleuchtungsvorrichtung
PCT/JP2014/004486 WO2015040805A1 (ja) 2013-09-18 2014-09-02 点灯装置及び点灯装置を備えた灯具
US14/889,169 US10054301B2 (en) 2013-09-18 2014-09-02 Lighting device and lighting appliance having the lighting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013193395A JP6098457B2 (ja) 2013-09-18 2013-09-18 点灯装置及び点灯装置を備えた灯具

Publications (3)

Publication Number Publication Date
JP2015060709A JP2015060709A (ja) 2015-03-30
JP2015060709A5 JP2015060709A5 (enExample) 2015-08-27
JP6098457B2 true JP6098457B2 (ja) 2017-03-22

Family

ID=52688476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013193395A Expired - Fee Related JP6098457B2 (ja) 2013-09-18 2013-09-18 点灯装置及び点灯装置を備えた灯具

Country Status (4)

Country Link
US (1) US10054301B2 (enExample)
JP (1) JP6098457B2 (enExample)
DE (1) DE112014004286B4 (enExample)
WO (1) WO2015040805A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7016054B2 (ja) * 2018-01-12 2022-02-04 パナソニックIpマネジメント株式会社 電源装置、前照灯、及び移動体
JP7603916B2 (ja) 2021-09-21 2024-12-23 東芝ライテック株式会社 車両用照明装置、および車両用灯具

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100321883B1 (ko) 1993-11-12 2002-06-20 구사마 사부로 반도체소자의실장구조및실장방법과,액정표시장치
JP2002304902A (ja) * 2001-04-04 2002-10-18 Matsushita Electric Works Ltd 光源装置
JP2003304026A (ja) 2002-04-09 2003-10-24 Sumitomo Electric Ind Ltd 光モジュール
JP2007012856A (ja) 2005-06-30 2007-01-18 Toyoda Gosei Co Ltd Led装置及びled装置用筐体
JP4857635B2 (ja) * 2005-07-25 2012-01-18 豊田合成株式会社 Ledランプユニット
JP2008135235A (ja) * 2006-11-27 2008-06-12 Matsushita Electric Works Ltd 放電灯点灯装置
JP2009231135A (ja) 2008-03-24 2009-10-08 Toshiba Lighting & Technology Corp 照明装置
DE102008031256A1 (de) 2008-07-02 2010-01-07 Osram Gesellschaft mit beschränkter Haftung Beleuchtungseinheit für Fahrzeugscheinwerfer und Fahrzeugscheinwerfer
JP2010049830A (ja) * 2008-08-19 2010-03-04 Toyoda Gosei Co Ltd Led照明装置
JP5575624B2 (ja) * 2010-12-06 2014-08-20 シチズンホールディングス株式会社 照明ユニット及び照明装置
JP5549583B2 (ja) 2010-12-27 2014-07-16 株式会社デンソー 点灯装置および灯具
JP2012174436A (ja) * 2011-02-18 2012-09-10 Toshiba Corp 照明ユニット及び照明装置
DE102011004746B4 (de) 2011-02-25 2023-09-28 Osram Gmbh Halbleiter-Leuchtmodul und Fahrzeugleuchte
US9134003B2 (en) 2011-06-13 2015-09-15 Koito Manufacturing Co., Ltd. Automotive headlamp, heat radiating mechanism, light-emitting apparatus and light source fixing member
JP2013193395A (ja) 2012-03-22 2013-09-30 Fuji Xerox Co Ltd 印刷システム、及び、印刷プログラム

Also Published As

Publication number Publication date
DE112014004286T5 (de) 2016-06-09
DE112014004286B4 (de) 2019-04-25
US20160131349A1 (en) 2016-05-12
US10054301B2 (en) 2018-08-21
JP2015060709A (ja) 2015-03-30
WO2015040805A1 (ja) 2015-03-26

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