DE112014004286B4 - Beleuchtungsvorrichtung und Beleuchtungsgerät mit dieser Beleuchtungsvorrichtung - Google Patents

Beleuchtungsvorrichtung und Beleuchtungsgerät mit dieser Beleuchtungsvorrichtung Download PDF

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Publication number
DE112014004286B4
DE112014004286B4 DE112014004286.2T DE112014004286T DE112014004286B4 DE 112014004286 B4 DE112014004286 B4 DE 112014004286B4 DE 112014004286 T DE112014004286 T DE 112014004286T DE 112014004286 B4 DE112014004286 B4 DE 112014004286B4
Authority
DE
Germany
Prior art keywords
lighting device
circuit
heat sink
heat
light source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE112014004286.2T
Other languages
German (de)
English (en)
Other versions
DE112014004286T5 (de
Inventor
Koichi Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of DE112014004286T5 publication Critical patent/DE112014004286T5/de
Application granted granted Critical
Publication of DE112014004286B4 publication Critical patent/DE112014004286B4/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H05B45/37—Converter circuits
    • H05B45/3725—Switched mode power supply [SMPS]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
DE112014004286.2T 2013-09-18 2014-09-02 Beleuchtungsvorrichtung und Beleuchtungsgerät mit dieser Beleuchtungsvorrichtung Expired - Fee Related DE112014004286B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013193395A JP6098457B2 (ja) 2013-09-18 2013-09-18 点灯装置及び点灯装置を備えた灯具
JP2013-193395 2013-09-18
PCT/JP2014/004486 WO2015040805A1 (ja) 2013-09-18 2014-09-02 点灯装置及び点灯装置を備えた灯具

Publications (2)

Publication Number Publication Date
DE112014004286T5 DE112014004286T5 (de) 2016-06-09
DE112014004286B4 true DE112014004286B4 (de) 2019-04-25

Family

ID=52688476

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112014004286.2T Expired - Fee Related DE112014004286B4 (de) 2013-09-18 2014-09-02 Beleuchtungsvorrichtung und Beleuchtungsgerät mit dieser Beleuchtungsvorrichtung

Country Status (4)

Country Link
US (1) US10054301B2 (enExample)
JP (1) JP6098457B2 (enExample)
DE (1) DE112014004286B4 (enExample)
WO (1) WO2015040805A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7016054B2 (ja) * 2018-01-12 2022-02-04 パナソニックＩｐマネジメント株式会社 電源装置、前照灯、及び移動体
JP7603916B2 (ja) 2021-09-21 2024-12-23 東芝ライテック株式会社 車両用照明装置、および車両用灯具

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012138294A (ja) 2010-12-27 2012-07-19 Denso Corp 点灯装置および灯具
DE102011004746A1 (de) 2011-02-25 2012-08-30 Osram Ag Halbleiter-Leuchtmodul und Fahrzeugleuchte
JP2012174436A (ja) 2011-02-18 2012-09-10 Toshiba Corp 照明ユニット及び照明装置
JP2013193395A (ja) 2012-03-22 2013-09-30 Fuji Xerox Co Ltd 印刷システム、及び、印刷プログラム

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100321883B1 (ko) 1993-11-12 2002-06-20 구사마 사부로 반도체소자의실장구조및실장방법과,액정표시장치
JP2002304902A (ja) * 2001-04-04 2002-10-18 Matsushita Electric Works Ltd 光源装置
JP2003304026A (ja) 2002-04-09 2003-10-24 Sumitomo Electric Ind Ltd 光モジュール
JP2007012856A (ja) 2005-06-30 2007-01-18 Toyoda Gosei Co Ltd Ｌｅｄ装置及びｌｅｄ装置用筐体
JP4857635B2 (ja) * 2005-07-25 2012-01-18 豊田合成株式会社 Ｌｅｄランプユニット
JP2008135235A (ja) * 2006-11-27 2008-06-12 Matsushita Electric Works Ltd 放電灯点灯装置
JP2009231135A (ja) 2008-03-24 2009-10-08 Toshiba Lighting & Technology Corp 照明装置
DE102008031256A1 (de) 2008-07-02 2010-01-07 Osram Gesellschaft mit beschränkter Haftung Beleuchtungseinheit für Fahrzeugscheinwerfer und Fahrzeugscheinwerfer
JP2010049830A (ja) * 2008-08-19 2010-03-04 Toyoda Gosei Co Ltd Ｌｅｄ照明装置
JP5575624B2 (ja) * 2010-12-06 2014-08-20 シチズンホールディングス株式会社 照明ユニット及び照明装置
US9134003B2 (en) 2011-06-13 2015-09-15 Koito Manufacturing Co., Ltd. Automotive headlamp, heat radiating mechanism, light-emitting apparatus and light source fixing member

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012138294A (ja) 2010-12-27 2012-07-19 Denso Corp 点灯装置および灯具
JP2012174436A (ja) 2011-02-18 2012-09-10 Toshiba Corp 照明ユニット及び照明装置
DE102011004746A1 (de) 2011-02-25 2012-08-30 Osram Ag Halbleiter-Leuchtmodul und Fahrzeugleuchte
JP2013193395A (ja) 2012-03-22 2013-09-30 Fuji Xerox Co Ltd 印刷システム、及び、印刷プログラム

Also Published As

Publication number Publication date
DE112014004286T5 (de) 2016-06-09
US20160131349A1 (en) 2016-05-12
US10054301B2 (en) 2018-08-21
JP6098457B2 (ja) 2017-03-22
JP2015060709A (ja) 2015-03-30
WO2015040805A1 (ja) 2015-03-26

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R012 Request for examination validly filed
R016 Response to examination communication
R018 Grant decision by examination section/examining division
R020 Patent grant now final
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee