JP6096147B2 - 圧縮成形金型の製造方法、及び圧縮成形体の製造方法 - Google Patents

圧縮成形金型の製造方法、及び圧縮成形体の製造方法 Download PDF

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Publication number
JP6096147B2
JP6096147B2 JP2014072910A JP2014072910A JP6096147B2 JP 6096147 B2 JP6096147 B2 JP 6096147B2 JP 2014072910 A JP2014072910 A JP 2014072910A JP 2014072910 A JP2014072910 A JP 2014072910A JP 6096147 B2 JP6096147 B2 JP 6096147B2
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Japan
Prior art keywords
fluoride
nitride
compression
film
punch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2014072910A
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English (en)
Japanese (ja)
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JP2015193175A5 (https=
JP2015193175A (ja
Inventor
大麿 重久
大麿 重久
福田　雅彦
雅彦 福田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemitsu Kosan Co Ltd
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Idemitsu Kosan Co Ltd
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Publication date
Application filed by Idemitsu Kosan Co Ltd filed Critical Idemitsu Kosan Co Ltd
Priority to JP2014072910A priority Critical patent/JP6096147B2/ja
Priority to PCT/JP2015/058182 priority patent/WO2015151825A1/ja
Priority to KR1020167001174A priority patent/KR20160137938A/ko
Priority to CN201580001414.9A priority patent/CN105408081B/zh
Publication of JP2015193175A publication Critical patent/JP2015193175A/ja
Publication of JP2015193175A5 publication Critical patent/JP2015193175A5/ja
Application granted granted Critical
Publication of JP6096147B2 publication Critical patent/JP6096147B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/006—Pressing and sintering powders, granules or fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/361—Moulds for making articles of definite length, i.e. discrete articles with pressing members independently movable of the parts for opening or closing the mould, e.g. movable pistons
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
    • B30B15/022—Moulds for compacting material in powder, granular of pasta form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/04—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/361—Moulds for making articles of definite length, i.e. discrete articles with pressing members independently movable of the parts for opening or closing the mould, e.g. movable pistons
    • B29C2043/3615—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices
    • B29C2043/3628—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices moving inside a barrel or container like sleeve
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Press-Shaping Or Shaping Using Conveyers (AREA)
JP2014072910A 2014-03-31 2014-03-31 圧縮成形金型の製造方法、及び圧縮成形体の製造方法 Expired - Fee Related JP6096147B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014072910A JP6096147B2 (ja) 2014-03-31 2014-03-31 圧縮成形金型の製造方法、及び圧縮成形体の製造方法
PCT/JP2015/058182 WO2015151825A1 (ja) 2014-03-31 2015-03-19 圧縮成形金型、圧縮成形金型の製造方法、及び圧縮成形体の製造方法
KR1020167001174A KR20160137938A (ko) 2014-03-31 2015-03-19 압축 성형 금형, 압축 성형 금형의 제조 방법, 및 압축 성형체의 제조 방법
CN201580001414.9A CN105408081B (zh) 2014-03-31 2015-03-19 压缩成形模具、压缩成形模具的制造方法、及压缩成形体的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014072910A JP6096147B2 (ja) 2014-03-31 2014-03-31 圧縮成形金型の製造方法、及び圧縮成形体の製造方法

Publications (3)

Publication Number Publication Date
JP2015193175A JP2015193175A (ja) 2015-11-05
JP2015193175A5 JP2015193175A5 (https=) 2016-03-03
JP6096147B2 true JP6096147B2 (ja) 2017-03-15

Family

ID=54240156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014072910A Expired - Fee Related JP6096147B2 (ja) 2014-03-31 2014-03-31 圧縮成形金型の製造方法、及び圧縮成形体の製造方法

Country Status (4)

Country Link
JP (1) JP6096147B2 (https=)
KR (1) KR20160137938A (https=)
CN (1) CN105408081B (https=)
WO (1) WO2015151825A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016125406A1 (de) 2016-12-22 2018-06-28 Gkn Sinter Metals Engineering Gmbh Matrize für eine Presse
KR102940152B1 (ko) * 2023-07-06 2026-03-17 한국원자력연구원 양방향 압축 금형 장치
CN120228231B (zh) * 2025-04-11 2025-11-25 河南浙锻机床有限公司 自动化压力机及在金属配件加工中的应用

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0649295B2 (ja) 1989-02-01 1994-06-29 チッソ株式会社 粉体成形用離型剤及びそれを用いた成形品の製造方法
JPH03254910A (ja) * 1989-07-11 1991-11-13 Hitachi Tool Eng Ltd プラスチック成形用金型
JPH03216298A (ja) * 1990-01-19 1991-09-24 Idemitsu Kosan Co Ltd 圧縮成形方法
JP2849162B2 (ja) * 1990-02-27 1999-01-20 日本タングステン株式会社 樹脂材成形用モールド
JP3837928B2 (ja) * 1998-08-21 2006-10-25 住友電気工業株式会社 樹脂成形装置用部材及びその製造方法
JP2002001733A (ja) * 2000-06-26 2002-01-08 Fuji Dies Kk 半導体封止用樹脂のタブレット成形用金型
US7153592B2 (en) * 2000-08-31 2006-12-26 Fujitsu Limited Organic EL element and method of manufacturing the same, organic EL display device using the element, organic EL material, and surface emission device and liquid crystal display device using the material
JP3292199B2 (ja) * 2001-03-22 2002-06-17 住友電気工業株式会社 ゴム用金型、ゴム用金型の製造方法およびゴムの成形方法
US7238383B2 (en) * 2003-03-07 2007-07-03 Eastman Kodak Company Making and using compacted pellets for OLED displays
JP4582497B2 (ja) * 2004-02-27 2010-11-17 株式会社ダイヤメット 粉末成形体の成形方法
JP5516653B2 (ja) * 2006-10-06 2014-06-11 日立化成株式会社 タブレット成形金型、ならびにタブレット、光半導体素子搭載用基板の製造方法および光半導体装置。
JP2008112977A (ja) * 2006-10-06 2008-05-15 Hitachi Chem Co Ltd タブレット成形金型、ならびにタブレット、光半導体素子搭載用基板の製造方法および光半導体装置。
KR100949819B1 (ko) 2008-03-11 2010-03-30 박진연 타블릿 성형 다이 어셈블리
JP3163163U (ja) 2010-07-21 2010-09-30 株式会社ジェピア 金型
JP2012056246A (ja) * 2010-09-10 2012-03-22 Fujifilm Corp 微細な凹凸パターンを表面に有するＮｉ原盤、およびそれを用いたＮｉ複盤の製造方法
JP5725339B2 (ja) * 2011-03-25 2015-05-27 株式会社小糸製作所 熱板溶着用治具およびその製造方法、金属部材

Also Published As

Publication number Publication date
CN105408081A (zh) 2016-03-16
KR20160137938A (ko) 2016-12-02
CN105408081B (zh) 2019-03-22
JP2015193175A (ja) 2015-11-05
WO2015151825A1 (ja) 2015-10-08

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