WO2015151824A1 - 圧縮成形装置および圧縮成形体の製造方法 - Google Patents
圧縮成形装置および圧縮成形体の製造方法 Download PDFInfo
- Publication number
- WO2015151824A1 WO2015151824A1 PCT/JP2015/058180 JP2015058180W WO2015151824A1 WO 2015151824 A1 WO2015151824 A1 WO 2015151824A1 JP 2015058180 W JP2015058180 W JP 2015058180W WO 2015151824 A1 WO2015151824 A1 WO 2015151824A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- punch
- compression
- compression molding
- hole
- pressure surface
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B11/00—Presses specially adapted for forming shaped articles from material in particulate or plastic state, e.g. briquetting presses, tabletting presses
- B30B11/02—Presses specially adapted for forming shaped articles from material in particulate or plastic state, e.g. briquetting presses, tabletting presses using a ram exerting pressure on the material in a moulding space
- B30B11/022—Presses specially adapted for forming shaped articles from material in particulate or plastic state, e.g. briquetting presses, tabletting presses using a ram exerting pressure on the material in a moulding space whereby the material is subjected to vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/0005—Details of, or accessories for, presses; Auxiliary measures in connection with pressing for briquetting presses
- B30B15/0017—Deairing means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C43/361—Moulds for making articles of definite length, i.e. discrete articles with pressing members independently movable of the parts for opening or closing the mould, e.g. movable pistons
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
- B30B15/022—Moulds for compacting material in powder, granular of pasta form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/065—Press rams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C43/361—Moulds for making articles of definite length, i.e. discrete articles with pressing members independently movable of the parts for opening or closing the mould, e.g. movable pistons
- B29C2043/3615—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices
- B29C2043/3628—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices moving inside a barrel or container like sleeve
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/006—Pressing and sintering powders, granules or fibres
Definitions
- the present invention relates to a compression molding apparatus and a method for manufacturing a compression molded body.
- An object of the present invention is to provide a compression molding apparatus and a method for manufacturing a compression molded body that can prevent the material from partially peeling from the molded body or the powder scattering from the surface of the molded body after compression molding of the powder material. Is to provide.
- a compression molding die having a through hole and having a contact angle of water of 80 degrees or more on the inner peripheral surface of the through hole and a different through hole inlet of the through hole, respectively.
- a compression molding apparatus provided with a pressing surface for pressing a powder material by inserting, and a first punch and a second punch having a water contact angle of 80 degrees or more on the pressing surface.
- a compression mold having a through hole, a first punch provided with a first pressure surface in contact with an organic material disposed in the through hole, A second punch provided with a second pressure surface in contact with the organic material disposed in the through hole, and at least one of the first pressure surface, the second pressure surface, and the inner peripheral surface of the through hole
- a compression molding apparatus in which the contact angle of water is 80 degrees or more is provided.
- the first punch is inserted into the through hole with the first pressure surface of the first punch inserted from one of the through holes provided in the compression mold.
- the compression molding apparatus and the compression molded body manufacturing method of the present invention after the powder material is compression molded, it is possible to prevent the material from partially peeling from the molded body or the powder from being scattered from the surface of the molded body. .
- FIG. 1 It is a partial cross section schematic diagram which shows the structure of the compression molding apparatus which concerns on one Embodiment. It is a figure explaining the manufacturing method of the compression molding implemented using the compression molding apparatus which concerns on the said embodiment. It is a figure explaining the manufacturing method of the compression molding implemented using the compression molding apparatus which concerns on the said embodiment. It is a figure explaining the manufacturing method of the compression molding implemented using the compression molding apparatus which concerns on the said embodiment. It is a figure explaining the manufacturing method of the compression molding implemented using the compression molding apparatus which concerns on the said embodiment. It is a figure explaining the manufacturing method of the compression molding implemented using the compression molding apparatus which concerns on the said embodiment. It is a figure explaining the manufacturing method of the compression molding implemented using the compression molding apparatus which concerns on the said embodiment. FIG.
- FIG. 3 is a diagram for explaining a method for manufacturing a compression molded body different from the method for manufacturing a compression molded body described in FIGS. 2A to 2E.
- FIG. 3 is a diagram for explaining a method for manufacturing a compression molded body different from the method for manufacturing a compression molded body described in FIGS. 2A to 2E.
- FIG. 3 is a diagram for explaining a method for manufacturing a compression molded body different from the method for manufacturing a compression molded body described in FIGS. 2A to 2E.
- It is a graph which shows the relationship between the molded product hardness of the compression molding body which concerns on an Example, and the particle size of a powder material.
- It is a graph which shows the relationship between the molding hardness of the compression molding body which concerns on an Example, and the bulk density of a powder material.
- FIG. 1 shows a schematic diagram of a compression molding apparatus 1 according to the present embodiment.
- the compression molding apparatus 1 includes a compression molding die 2, a first punch 3, and a second punch 4 provided to face the first punch 3.
- the compression molding apparatus 1 further includes a base portion 10, two guide bars 11 erected in parallel to the base portion 10, an upper frame 12 connected to the upper end of the guide bar 11, the base portion 10, A lower movable plate 13, a middle movable plate 14 and an upper movable plate 15 supported between the upper frames 12 are provided.
- the lower movable plate 13, the middle movable plate 14, and the upper movable plate 15 are provided in parallel with each other in this order from the base portion 10 side.
- the lower movable plate 13, the middle movable plate 14 and the upper movable plate 15 are provided so as to be independently movable in the vertical direction along the guide bar 11.
- the lower movable plate 13, the middle movable plate 14, and the upper movable plate 15 are moved by a hydraulic drive mechanism such as a hydraulic cylinder (not shown), a pneumatic drive mechanism such as an air cylinder, or a mechanical drive mechanism such as a cam or crank mechanism. It is configured to be able to.
- the compression molding die 2 is attached to a substantially central portion of the middle movable plate 14 in an exchangeable manner.
- the compression mold 2 has a through hole 21 that penetrates vertically.
- the first punch 3 and the second punch 4 are inserted into the through hole 21 to form a molding chamber 22 for filling the inside of the compression mold 2 with a powder material.
- the molding chamber 22 has the shape of a compression molded body to be molded.
- the shape of the molding chamber 22, that is, the shape of the compression molded body may be a columnar shape or an elliptical column shape, and the cross section is a polygon such as a semicircular shape, a sector shape, a triangle shape, or a square shape, or an oval shape. It may be.
- the compression molded body may be a solid body or a hollow body.
- the first punch 3 and the second punch 4 compress and compress the powder material filled in the molding chamber 22 from opposite directions.
- the first punch 3 is fixed to the upper surface of the lower movable plate 13.
- the first punch 3 is configured to move in the axial direction of the through hole 21 as the lower movable plate 13 moves in the vertical direction.
- the first punch 3 is inserted from the other through hole inlet 21 b of the through hole 21.
- the second punch 4 is fixed to the lower surface of the upper movable plate 15.
- the second punch 4 is configured to move in the axial direction of the through hole 21 as the upper movable plate 15 moves in the vertical direction.
- the second punch 4 is inserted from one through hole inlet 21 a of the through hole 21.
- the first punch 3 and the second punch 4 are preferably formed slightly smaller than the through hole 21.
- a gap is formed between the side surface of the inserted first punch 3 and the side surface of the second punch 4 and the inner peripheral surface 21c of the through hole 21, and the gas degassed from the powder material in the molding chamber 22 It is preferable that it is discharged after passing through.
- a first pressurizing surface 31 and a second pressurizing surface 41 for pressurizing the powder material are provided at the respective end portions of the first punch 3 and the second punch 4.
- the first pressure surface 31 of the first punch 3 and the second pressure surface 41 of the second punch 4 are flat surfaces.
- a molding chamber 22 is formed by the first pressure surface 31 of the first punch 3, the second pressure surface 41 of the second punch 4, and the inner peripheral surface 21 c of the through hole 21 of the compression molding die 2. In a state where the molding chamber 22 is filled with the powder material, the first and second punches 3 and 4 are pressed from above and below to obtain a compression molded body.
- the contact angle of water on the first pressure surface 31 of the first punch 3, the second pressure surface 41 of the second punch 4, and the inner peripheral surface 21c of the through hole 21 of the compression mold 2 is 80 degrees or more.
- the contact angle of water was defined as an angle formed by a tangent drawn on the surface of the edge of the water drop and a corresponding surface by dropping a water drop on each surface. Therefore, the angle is in the range from 0 ° to 180 °.
- the contact angle of water on the first pressure surface 31, the second pressure surface 41, and the inner peripheral surface 21c is preferably 80 degrees or more and 120 degrees or less, and more preferably 80 degrees or more and 100 degrees or less. .
- the contact angles of water on the first pressure surface 31 of the first punch 3, the second pressure surface 41 of the second punch 4, and the inner peripheral surface 21c of the through hole 21 are the first pressure surface 31 and the second pressure surface.
- the contact angle of water on the surface of the membrane is the first pressure surface 31 and the second pressure surface.
- nitride films are formed on the first pressure surface 31, the second pressure surface 41, and the inner peripheral surface 21c, and the contact angle of water on these nitride film surfaces is 80 degrees or more.
- the contact angle of water on these nitride film surfaces is preferably not less than 80 degrees and not more than 120 degrees, and more preferably not less than 80 degrees and not more than 100 degrees.
- the nitride film is preferably made of a nitride selected from the group consisting of titanium aluminum nitride, titanium nitride carbide, chromium nitride, titanium nitride, titanium silicon nitride, and titanium aluminum silicon nitride.
- the nitride film can be formed by a physical vapor deposition (Physical Vapor Deposition, PVD) method, a chemical vapor deposition (CVD) method, or the like.
- the nitride film is made of titanium aluminum nitride formed by physical vapor deposition.
- the cleaning treatment include surface polishing treatment, ultrasonic cleaning treatment performed by immersing in an organic solvent, bombardment treatment with argon ions, and the like, and these treatments may be performed in combination.
- the centerline average roughness Ra of the 1st pressurization surface 31, the 2nd pressurization surface 41, and the internal peripheral surface 21c is 0.5 micrometer or less, and it is 0.1 micrometer or less. More preferred. If centerline average roughness Ra is 0.5 micrometer or less, after compression molding, it will become difficult for a powder material to adhere to these surfaces, and peeling from a compression molding body will be suppressed.
- the first pressurizing surface 31 of the first punch 3, the second pressurizing surface 41 of the second punch 4, and the center line average roughness Ra of the inner peripheral surface 21c of the through hole 21 are the first pressurizing surface 31, 2
- the center line average roughness Ra on the first pressure surface 31, the second pressure surface 41, and the inner peripheral surface 21c When a film is formed, it is the centerline average roughness Ra on the surface of the film.
- the compression molding apparatus 1 preferably has deaeration means for discharging gas from the inside of the molding chamber 22 to the outside, and at least one of the compression molding die 2, the first punch 3 and the second punch 4 serves as the deaeration means. It is preferable to have.
- the first punch 3 has a vibration device (not shown) as deaeration means. After the first punch 3 is inserted from the through-hole inlet 21b of the through-hole 21 and filling the recess formed by the inner peripheral surface 21c of the through-hole 21 and the first pressurizing surface 31 of the first punch 3, The first punch 3 is vibrated by the vibration device, thereby degassing the filled powder material and discharging it to the outside of the molding chamber 22.
- the manufacturing method of the compression molding body of this embodiment implemented using the compression molding apparatus 1 is the method of filling with a powder material and shape
- the first punch 3 is inserted with the first pressure surface 31 facing the inside of the through hole 21.
- the first pressure surface 31 is inserted until reaching the position of the predetermined depth dimension in the through hole 21. This depth dimension is set by the thickness dimension of the compression molded body.
- the powder material P is filled into the through hole 21 in which the bottom surface is formed by the first pressure surface 31.
- the first punch 3 is vibrated by the above-described vibration device to perform a deaeration process.
- the second pressurization surface 41 faces the inside of the through hole 21, the second punch 4 is inserted, and the first pressurization surface 31 is opposed to the first pressurization surface 31.
- the molding chamber 22 is formed by the inner peripheral surface 21 c of the hole 21, the first pressure surface 31, and the second pressure surface 41.
- the compression molding body Q is shape
- FIG. In the present embodiment, an example in which the first punch 3 and the second punch 4 move together and press the powder material P from both sides will be described. However, the present invention is not limited to this method.
- the compression pressure is preferably 11 MPa or more.
- the surface temperature of the inner peripheral surface 21c of the compression mold 2, the first pressure surface 31 of the first punch 3, and the second pressure surface 41 of the second punch 4 is 10 ° C. or higher.
- the first punch 3 and the first punch 3 are sandwiched between the first pressure surface 31 of the first punch 3 and the second pressure surface 41 of the second punch 4.
- the second punch 4 is moved up and the compression molded body Q is extracted from the through hole 21.
- the upward movement of the first punch 3 and the second punch 4 is preferably stopped when the first pressure surface 31 of the first punch 3 coincides with the upper surface of the compression mold 2.
- the first punch 3 and the second punch 4 are preferably moved up at a low speed so that the stress acting on the compression molded body Q is not released at a stretch.
- the second punch 4 is moved upward to open the upper surface of the compression molded body Q. Thereafter, the compression molded body Q placed on the first pressure surface 31 is taken out.
- the manufacturing method of an organic EL element using the compression molding body Q obtained by compressing the material for organic EL elements.
- the powder material P of this embodiment is a material for an organic EL element, and is not mixed with a molding aid such as a binder or a lubricant.
- the material for the organic EL device is a material used for the organic EL device and is not particularly limited.
- a hole transporting material used for the hole transport layer a host material used for the light emitting layer, a dopant material, an electron transport. Examples thereof include an electron transporting material used for the layer.
- the organic EL element material may be configured by mixing a plurality of types of organic EL element materials.
- the average particle diameter D50 (median diameter) of the powder material P of the present embodiment is preferably smaller. As the average particle diameter D50 of the powder material P becomes smaller, the hardness of the compression molded body can be improved.
- the average particle diameter D50 of the powder material P is preferably 70 ⁇ m or less, more preferably 45 ⁇ m or less, and even more preferably 30 ⁇ m or less. In the particle size distribution of the powder material P, it is preferable that the difference between the maximum particle size and the minimum particle size is small. In the present embodiment, it is preferable that the average particle diameter D50 of the powder material P satisfies the above preferable range.
- the molding chamber 22 filled with the powder material P includes the first pressurizing surface 31 of the first punch 3 and the second pressurizing of the second punch 4.
- the pressure surface 41 and the inner peripheral surface 21 c of the through hole 21 of the compression molding die 2 are formed.
- a nitride film is formed on the first pressure surface 31, the second pressure surface 41, and the inner peripheral surface 21c, and the contact angle of water is 80 degrees or more.
- the powder material P is pressurized and compressed in a state surrounded by a surface having a water contact angle of 80 degrees or more.
- the gas contained in the filled powder material P can be removed by vibrating the first punch 3 with the above-described vibration device and performing a deaeration process.
- the compression pressure at the time of compressing the powder material P between the 1st pressurization surface 31 and the 2nd pressurization surface 41 is 11 Mpa or more.
- the organic EL element material that does not contain a molding aid is taken as an example of the powder material.
- the compression molded product that has undergone peeling after molding, etc., has insufficient hardness and it is difficult to accurately grasp its weight due to cracking of the compression molded product, improving the productivity of organic EL elements I can't plan.
- the material is partially separated from the compression molded body Q even if the molding aid is not contained. Or scattering of the powder from the surface of the molded body can be suppressed. Therefore, the frequency
- nitride films are formed on the first pressure surface 31, the second pressure surface 41, and the inner peripheral surface 21c, the wear resistance of these surfaces can be improved.
- ⁇ Second embodiment> In the description of the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals and names, and the description thereof is omitted or simplified. In the second embodiment, the same materials and compounds as those described in the first embodiment can be used. In the first embodiment, a nitride film is formed on the first pressure surface 31, the second pressure surface 41, and the inner peripheral surface 21c, whereas in the second embodiment, a laminated film having a three-layer structure is formed. It differs in that it is formed.
- a laminated film is formed on each of the compression mold 2 of the compression molding apparatus 1, the inner peripheral surface 21 c, the first pressure surface 31, and the second pressure surface 41 of the first punch 3 and the second punch 4.
- the contact angle of water on the film surface of the outermost layer is 80 degrees or more. Also in this embodiment, the contact angle of water is preferably 80 degrees or more and 120 degrees or less, and more preferably 80 degrees or more and 110 degrees or less.
- the laminated film of this embodiment is a laminated film having a three-layer structure. Specifically, the nitride film described in the first embodiment is first formed on the first pressure surface 31, the second pressure surface 41, and the inner peripheral surface 21c, and the surface of the nitride film is activated.
- Is applied to form an activated layer and a fluoride-containing layer containing a fluorocarbon-based compound is formed on the activated layer.
- an activation process for forming an activation layer dirt attached to the nitride film surface is decomposed and cleaned, and an activation layer having molecular bonds is formed on the nitride film surface, Hydroxyl groups are adsorbed on the molecular bonds and react with the reactive group of the fluorocarbon compound to facilitate bonding.
- the activation treatment is not particularly limited, and physical methods include corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, flame treatment, etc., and chemical methods include at least one of acid and alkali.
- the treatment examples include immersion in a solution, oxidant treatment, and ozone treatment.
- these activation treatments corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, and ozone treatment are preferable because damage to the nitride film surface can be prevented, and plasma treatment and ultraviolet irradiation treatment activate the nitride film surface. High efficiency is more preferable.
- the fluoride-containing layer formed on the activation layer contains a fluorocarbon-based compound.
- the fluorocarbon-based compound is composed of a chain portion formed of fluorocarbon and a reactive group that binds to another substance.
- Examples of the method for forming the fluoride-containing layer include a method in which a release agent containing a fluorocarbon-based compound is applied on the activated layer and heat-dried.
- Examples of the fluorocarbon-based compound include perfluoroalkyl silanes and perfluoropolyether group-containing silane compounds.
- Examples of perfluoroalkylsilanes include compounds represented by the following formula (1) and formula (2). CF 3 (CF 2 ) n CH 2 CH 2 Si (OMe) m (1) CF 3 (CF 2 ) n CH 2 CH 2 Si (OR) m (2) However, in said formula (1), n is 1, 3, 5, or 7, m is 2 or 3, and Me is a methyl group or an ethyl group.
- n 1, 3, 5, or 7, m is 2 or 3, and R is a halogen element.
- Specific examples of the compound represented by the formula (1) or formula (2) include CF 3 (CF 2 ) 5 CH 2 CH 2 Si (OCH 3 ) 3 (for example, TSL8257 manufactured by Momentive Performance Materials).
- CF 3 (CF 2 ) 7 CH 2 CH 2 Si (OCH 3 ) 3 for example, TSL 8233 manufactured by Momentive Performance Materials
- CF 3 (CF 2 ) 7 CH 2 CH 2 Si (OCH 3 ) 2 for example, TSL8231 manufactured by Momentive Performance Materials, or KBM7803 manufactured by Shin-Etsu Chemical Co., Ltd.
- CF 3 (CF 2 ) 7 CH 2 CH 2 Si (OC 2 H 5 ) 3 for example, manufactured by Toray Dow Corning AY43-158E
- the perfluoropolyether group-containing silane compounds include perfluoropolyether-modified aminosilane and perfluoropolyether-modified polysilazane. Specifically, for example, KY-164 manufactured by Shin-Etsu Chemical Co., Ltd., OPTOOL series manufactured by Daikin Industries, and the like can be mentioned.
- a layer different from the activation layer may be interposed between the nitride film and the fluoride-containing layer, or the formation of the activation layer is omitted and the nitride film and the fluoride-containing layer are directly laminated.
- a laminated film having a two-layer structure may be used.
- the layer provided on the outermost surface of the laminated film is not limited to a layer containing a fluorocarbon-based compound, and may be a layer having a water contact angle of 80 degrees or more.
- the deaeration means provided in the compression molding apparatus 1 is not limited to the vibration device, and may be, for example, an ultrasonic generator, a tapping device, or a vacuum deaeration device. As a deaeration means, what is necessary is just to be able to deaerate from the powder material with which the molding chamber 22 was filled.
- the deaeration means is not limited to being provided in the first punch 3, and may be provided in the second punch 4 or the compression mold 2.
- the through-hole inlet 21a of the through-hole 21 of the compression mold 2 may be tapered.
- the taper processing is performed so that the hole diameter increases from the inside of the through hole 21 toward the through hole inlet 21a.
- the contact angle of water is preferably 80 degrees or more.
- the nitride film as described above is preferably formed.
- the through hole inlet 21b may also be tapered.
- the method of extracting the compression molding body Q from the compression molding die 2 is not limited to the method demonstrated by the said embodiment.
- the compression mold 2 is moved downward.
- the downward movement of the compression mold 2 is preferably stopped when the upper surface of the compression mold 2 coincides with the first pressure surface 31 of the first punch 3.
- the compression mold 2 is preferably moved downward at a low speed so that the stress acting on the compression molded body Q is not released all at once.
- the second punch 4 is moved upward to open the upper surface of the compression molded body Q. Thereafter, the compression molded body Q placed on the first pressure surface 31 is taken out.
- compression molding is not limited to the method described in the above embodiment.
- compression molding may be performed by a floating die method.
- the floating die method pressure is applied by the second punch 4, and the frictional force gradually increases between the inner peripheral surface 21 c of the through-hole 21 of the compression molding die 2 and the powder material. If it becomes larger than that, the compression molding die 2 descends together with the middle movable plate 14. At this time, the first punch 3 is relatively lifted. Then, the 2nd punch 4 is raised and a compression molding body is taken out. According to such a floating die system, it is possible to adjust the density in the thickness direction of the compression molded body.
- a withdrawing method, a one-pushing method in which only the second punch 4 is lowered, or the like can be employed. Even when these methods are employed, water on the first pressurizing surface 31 of the first punch 3, the second pressurizing surface 41 of the second punch 4, and the inner peripheral surface 21 c of the through hole 21 of the compression molding die 2 is also illustrated.
- the contact angle By setting the contact angle to 80 degrees or more, it is possible to prevent the material from partially peeling from the compression molded body Q after the compression molding or the powder from being scattered from the surface of the molded body.
- Example 1 In the compression molding apparatus 1 according to the embodiment, a powder material having an average particle diameter D50 of 20.71 ⁇ m and a bulk density of 0.33 g / ml was compression molded.
- the molding hardness of the compression molded body according to Example 1 was measured. Table 1 shows the characteristics of the powder material and the hardness of the molded product.
- the average particle diameter D50 is a median diameter.
- the median diameter was measured from the cumulative distribution by expressing the particle size measured with a laser diffraction / scattering particle size analyzer MT3300II manufactured by Nikkiso Co., Ltd. as a cumulative distribution.
- the bulk density was measured using a Casa specific gravity measuring instrument JIS-K-5101 manufactured by Tsutsui Rika Instruments Co., Ltd.
- the molded product hardness of the compression-molded body was measured by attaching a popular digital force gauge DS2-50N made by Imada to a vertical manual measurement stand SVH-1000N made by Imada.
- Example 2 Using a powder material having an average particle diameter D50 of 41.15 ⁇ m and a bulk density of 0.44 g / ml, a compression molded product was produced in the same manner as in Example 1, and the molded product hardness was measured. . The results are shown in Table 1.
- Example 3 Using a powder material having an average particle diameter D50 of 65.27 ⁇ m and a bulk density of 0.44 g / ml, a compression molded body was produced in the same manner as in Example 1, and the molded product hardness was measured. . The results are shown in Table 1.
- FIG. 4 shows a graph showing the relationship between the molded product hardness of the compression molded body and the particle size of the powder material according to the example and the comparative example, and the relationship between the molded product hardness of the compression molded body and the bulk density of the powder material.
- the graph which shows is shown in FIG. In Table 1, FIG. 4, and FIG. 5, the hardness of the molded product is indicated by a normalized value. That is, in this example, the measured values of the molded product hardness of Examples 1 to 3 and Comparative Example 1 were respectively divided by the measured value of the molded product hardness of Comparative Example 1, and normalized.
- the contact angle of water on the surface in contact with the powder material is 80 degrees or more, the release property of the compression molded body is excellent. Although the contact angle of water may be larger, it has been found that good releasability can be obtained even in the range of 80 degrees to 100 degrees.
- SYMBOLS 1 ... Compression molding apparatus, 2 ... Compression molding die, 21 ... Through-hole, 21a, 21b ... Through-hole inlet, 21c ... Inner peripheral surface, 22 ... Molding chamber, 3 ... 1st punch, 31 ... 1st pressurization surface, 4 ... 2nd punch, 41 ... 2nd pressurization surface, P ... Powder material, Q ... Compression molding.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Press-Shaping Or Shaping Using Conveyers (AREA)
Abstract
Description
また、近年は、電子デバイス等に用いられる有機材料の粉末材料を圧縮成形する方法が検討されている。このような有機電子材料素子の一対の電極間に設けられる有機層は、一般的に真空加熱蒸着することで形成される。蒸着源に入れる有機素子用材料は一般的に粉末状であるが、粉末状であると、充填効率が低く、またハンドリング性に劣り、粉末が飛散したりする問題が生じていたからである。
(1)圧縮成形装置の構成
図1には、本実施形態に係る圧縮成形装置1の概略図が示されている。
圧縮成形装置1は、圧縮成形金型2と、第1パンチ3と、この第1パンチ3と対向して設けられる第2パンチ4とを備える。圧縮成形装置1は、さらに、ベース部10と、ベース部10に互いに平行に立設された2本のガイドバー11と、ガイドバー11の上端に連結された上部フレーム12と、ベース部10および上部フレーム12の間にて支持されている下部可動板13、中部可動板14および上部可動板15とを備える。図1に示すように、下部可動板13、中部可動板14および上部可動板15は、ベース部10側からこの順に互いに平行に設けられている。また、下部可動板13、中部可動板14および上部可動板15は、ガイドバー11に沿って上下方向にそれぞれ独立に移動可能に設けられている。なお、下部可動板13、中部可動板14および上部可動板15は、図示しない油圧シリンダ等の液体圧式駆動機構、エアシリンダ等の空気圧式駆動機構あるいはカムもしくはクランク機構等の機械式駆動機構により移動できるように構成されている。
次に、圧縮成形装置1を用いて実施する粉末材料の圧縮成形体の製造方法について説明する。
図2A~図2Eには、圧縮成形体の製造方法の各工程における圧縮成形装置1の圧縮成形金型2、第1パンチ3および第2パンチ4について記載され、その他の構成は省略されている。圧縮成形装置1を用いて実施する本実施形態の圧縮成形体の製造方法は、粉末材料を充填し、単軸に沿った加圧力で成形する方法である。
そして、第1加圧面31と、第2加圧面41との間で粉末材料Pを圧縮することで、圧縮成形体Qが成形される。本実施形態では、第1パンチ3および第2パンチ4がともに移動して粉末材料Pを両側から加圧する両押し方式で行う例を挙げて説明するが、この方式に限定されない。
圧縮圧力は、11MPa以上であることが好ましい。また、圧縮成形金型2の内周面21c、第1パンチ3の第1加圧面31、および第2パンチ4の第2加圧面41の表面温度が、10℃以上であることが好ましい。
なお、粉末材料Pの平均粒径D50が、上述の好ましい範囲を満たしていることが本実施形態において好適である。
本実施形態に係る圧縮成形装置1では、粉末材料Pが充填される成形室22は、第1パンチ3の第1加圧面31、第2パンチ4の第2加圧面41、および圧縮成形金型2の貫通孔21の内周面21cとで形成される。第1加圧面31、第2加圧面41、および内周面21cには、窒化物膜が形成され、水の接触角が80度以上である。このように本実施形態の圧縮成形装置1では、粉末材料Pは、水の接触角が80度以上である面で囲まれた状態で加圧圧縮される。その結果、圧縮成形後に圧縮成形体Qから材料が部分的に剥離したり、成形体表面から粉末が飛散したりすることを抑制できる。一方で、第1加圧面31,第2加圧面41、および内周面21cにおける水の接触角が80度未満であると、圧縮成形体から材料が部分的に剥離したり、成形体表面から粉末が飛散したりする量が増えてしまい、成形後の圧縮成形体の重量が10%以上減少し、重量減少が著しい。
第二実施形態の説明において第一実施形態と同一の構成要素は、同一の符号や名称を付す等して説明を省略もしくは簡略にする。また、第二実施形態では、第一実施形態で説明したものと同様の材料や化合物を用いることができる。
第一実施形態においては、第1加圧面31、第2加圧面41、および内周面21cに窒化物膜が形成されていたのに対し、第二実施形態では、3層構成の積層膜が形成されている点で相違する。
本実施形態の積層膜は、3層構成の積層膜である。具体的には、第1加圧面31、第2加圧面41、および内周面21c側に、まず前記第一実施形態で説明した窒化物膜が形成され、窒化物膜の表面に活性化処理を施して活性化層が形成され、さらにこの活性化層の上にフッ化炭素系化合物を含有するフッ化物含有層が形成されている。
活性化層を形成するための活性化処理を行うことで、窒化物膜表面に付着した汚れが分解されて清浄化され、窒化物膜表面には分子結合手を有する活性化層が形成され、この分子結合手に水酸基が吸着し、フッ化炭素系化合物の反応基と反応して結合し易くなる。
活性化処理としては、特に限定されないが、物理的な方法としては、コロナ放電処理、プラズマ処理、紫外線照射処理、フレーム処理などが挙げられ、化学的な方法としては、酸およびアルカリの少なくともいずれかの溶液に浸漬させる処理、酸化剤処理、オゾン処理などが挙げられる。これらの活性化処理の中でも、コロナ放電処理、プラズマ処理、紫外線照射処理、オゾン処理が、窒化物膜表面の損傷を防止できるため好ましく、プラズマ処理および紫外線照射処理が窒化物膜表面を活性化する効率が高くさらに好ましい。
活性化層の上に形成されるフッ化物含有層には、フッ化炭素系化合物が含有される。フッ化炭素系化合物は、フッ化炭素で形成される鎖状部位と、他の物質と結合する反応基とで構成される。フッ化物含有層を形成する方法としては、例えば、フッ化炭素系化合物を含有する離型剤を活性化層上に塗布し、加熱乾燥を行う方法が挙げられる。
フッ化炭素系化合物としては、例えば、パーフルオロアルキルシラン類、パーフルオロポリエーテル基含有シラン化合物類などが挙げられる。
パーフルオロアルキルシラン類としては、下記式(1)や式(2)で表される化合物が挙げられる。
CF3 (CF2)nCH2CH2Si(OMe)m …(1)
CF3 (CF2)nCH2CH2Si(OR)m …(2)
ただし、前記式(1)において、nは、1,3,5,または7であり、mは、2または3であり、Meは、メチル基またはエチル基である。
また、前記式(2)において、nは、1,3,5,または7であり、mは、2または3であり、Rは、ハロゲン元素である。
前記式(1)や式(2)で表される化合物の具体例としては、CF3(CF2)5CH2CH2Si(OCH3)3(例えば、モメンティブ・パフォーマンス・マテリアルズ製のTSL8257)、CF3(CF2)7CH2CH2Si(OCH3)3(例えば、モメンティブ・パフォーマンス・マテリアルズ製のTSL8233)、CF3(CF2)7CH2CH2Si(OCH3)2(例えば、モメンティブ・パフォーマンス・マテリアルズ製のTSL8231、または信越化学工業製のKBM7803)、CF3(CF2)7CH2CH2Si(OC2H5)3(例えば、東レ・ダウコーニング製のAY43-158E)などが挙げられる。
パーフルオロポリエーテル基含有シラン化合物類には、パーフルオロポリエーテル変性アミノシラン、パーフルオロポリエーテル変性ポリシラザンなどがある。具体的には、例えば、信越化学工業製のKY-164、ダイキン工業製のオプツールシリーズなどが挙げられる。
積層膜の最表層であるフッ化物含有層表面における水の接触角を80度以上とすることで、当該積層膜が形成されている第1パンチ3の第1加圧面31、第2パンチ4の第2加圧面41、および圧縮成形金型2の貫通孔21の内周面21cで粉末材料を圧縮成形すれば、圧縮成形後に圧縮成形体Qから材料が部分的に剥離したり、成形体表面から粉末が飛散したりすることを抑制する効果をさらに向上させることができる。
なお、本発明は、上述した実施形態に限定されるものではなく、本発明の目的を達成できる範囲で、以下に示される変形等をも含む。
なお、積層膜の構成は、前記実施形態で説明した例に限定されない。窒化物膜とフッ化物含有層との間に、活性化層とは異なる層を介在させてもよいし、活性化層の形成を省略して直接、窒化物膜とフッ化物含有層とを積層させた2層構成の積層膜としてもよい。また積層膜の最表面に設けられる層も、フッ化炭素系化合物を含有する層に限定されず、水の接触角が80度以上となる層であればよい。
例えば、図3Aに示すように、圧縮成形金型2を下降移動させる。図3Bに示すように、圧縮成形金型2の下降移動は、圧縮成形金型2の上面が、第1パンチ3の第1加圧面31と一致したところで停止することが好ましい。圧縮成形金型2は、圧縮成形体Qに作用している応力が一気に解放されないよう、低速度で下降移動させることが好ましい。次に、図3Cに示すように、第2パンチ4を上昇移動させて、圧縮成形体Qの上面を開放する。その後、第1加圧面31上に載置されている圧縮成形体Qを取り出す。
前記実施形態に係る圧縮成形装置1で、平均粒径D50が20.71μmであり、嵩密度が0.33g/mlの粉末材料を圧縮成形した。実施例1に係る圧縮成形体の成形物硬さを測定した。表1に、粉末材料の特性および成形物硬さを示す。なお、平均粒径D50は、メジアン径である。メジアン径は、日機装株式会社製のレーザー回折・散乱式粒度分析計MT3300IIで測定した粒径を累積分布として表し、当該累積分布から測定した。
嵩密度は、筒井理化学器械株式会社製のカサ比重測定計 JIS-K-5101を用いて測定した。
圧縮成形体の成形物硬さは、株式会社イマダ製の縦型手動計測スタンドSVH-1000Nに、株式会社イマダ製の普及型デジタルフォースゲージDS2-50Nを取り付けて測定した。
平均粒径D50が41.15μmであり、嵩密度が0.44g/mlの粉末材料を用い、それ以外は、実施例1と同様にして圧縮成形体を作製し、成形物硬さを測定した。結果を表1に示す。
平均粒径D50が65.27μmであり、嵩密度が0.44g/mlの粉末材料を用い、それ以外は、実施例1と同様にして圧縮成形体を作製し、成形物硬さを測定した。結果を表1に示す。
平均粒径D50が92.81μmであり、嵩密度が0.74g/mlの粉末材料を用い、それ以外は、実施例1と同様にして圧縮成形体を作製し、成形物硬さを測定した。結果を表1に示す。
なお、表1、図4および図5において、成形物硬さは、正規化した値で示す。すなわち、本実施例では、実施例1~3および比較例1の成形物硬さの測定値を、それぞれ比較例1の成形物硬さの測定値で除して正規化した。
また、表1および図5に示す結果のように、粉末材料の嵩密度が小さいほど、成形物硬さが高くなった。
圧縮成形装置の第1パンチの加圧面、第2パンチの加圧面、および圧縮成形金型の貫通孔の内周面にフッ化炭素系化合物が含有されるフッ化物含有層を形成した。実施例4~7並びに比較例2~3の圧縮成形装置におけるフッ化物含有層の水の接触角を、それぞれ表2に示す値に調整した。この圧縮成形装置を用いて粉末材料を圧縮成形した。離型後の圧縮成形体の外観を目視で確認した。外観の確認結果を表2に示す。表2中、「B」は、圧縮成形体から材料が部分的に剥離したり、圧縮成形体表面から粉末が飛散したりしたことを表し、「A」は、そのような剥離や飛散が生じなかったことを表す。
Claims (20)
- 貫通孔を有し、前記貫通孔の内周面における水の接触角が80度以上である圧縮成形金型と、前記貫通孔の互いに異なる貫通孔入口からそれぞれ挿入することにより粉末材料を加圧するための加圧面がそれぞれ設けられ、および前記加圧面における水の接触角が80度以上である第1パンチおよび第2パンチと、を備える圧縮成形装置。
- 貫通孔を有する圧縮成形金型と、前記貫通孔内に配置される有機材料と接触する第1加圧面が設けられた第1パンチと、前記貫通孔内に配置される有機材料と接触する第2加圧面が設けられた第2パンチと、を備え、前記第1加圧面、前記第2加圧面、及び前記貫通孔の内周面の少なくともいずれかにおける水の接触角が、80度以上である圧縮成形装置。
- 請求項1または請求項2に記載の圧縮成形装置において、前記接触角が80度以上120度以下である圧縮成形装置。
- 請求項1または請求項2に記載の圧縮成形装置において、前記接触角が80度以上100度以下である圧縮成形装置。
- 請求項1から請求項4のいずれか一項に記載の圧縮成形装置において、前記貫通孔の内周面および前記加圧面における中心線平均粗さRaが0.5μm以下である圧縮成形装置。
- 請求項1から請求項5のいずれか一項に記載の圧縮成形装置において、前記貫通孔の内周面および前記加圧面には、窒化物膜が形成されている圧縮成形装置。
- 請求項6に記載の圧縮成形装置において、前記窒化物膜は、窒化チタンアルミ、窒化チタンカーバイド、窒化クロム、窒化チタン、窒化チタンシリコン、および窒化チタンアルミシリコンからなる群から選択される窒化物で構成される圧縮成形装置。
- 請求項7に記載の圧縮成形装置において、前記窒化物膜は、窒化チタンアルミで構成される圧縮成形装置。
- 請求項6から請求項8のいずれか一項に記載の圧縮成形装置において、フッ化炭素系化合物を含有するフッ化物含有層が、前記窒化物膜上に形成されている圧縮成形装置。
- 請求項1から請求項9のいずれか一項に記載の圧縮成形装置において、前記圧縮成形金型、前記第1パンチおよび前記第2パンチの少なくともいずれかが、前記貫通孔の前記内周面と、前記第1パンチおよび前記第2パンチの前記加圧面とで形成される成形室の内部から外部へ気体を排出する脱気手段を有する圧縮成形装置。
- 圧縮成形金型に設けられた貫通孔の一方から挿入される第1パンチの第1加圧面を前記貫通孔の内部に向けて当該第1パンチを挿入する工程と、
前記貫通孔内に粉末材料を充填する工程と、
前記圧縮成形金型に設けられた前記貫通孔の他方から挿入される第2パンチの第2加圧面を前記貫通孔の内部に向けて当該第2パンチを挿入し、前記第1パンチの第1加圧面と対向させることで、前記貫通孔の内周面と、前記第1パンチの前記第1加圧面と、前記第2パンチの前記第2加圧面とで成形室を形成する工程と、
前記第1加圧面および前記第2加圧面の間で前記粉末材料を圧縮する工程と、を有し、
前記第1加圧面、前記第2加圧面、および前記内周面における水の接触角が、80度以上である圧縮成形体の製造方法。 - 請求項11に記載の圧縮成形体の製造方法において、前記接触角が80度以上120度以下である圧縮成形体の製造方法。
- 請求項11に記載の圧縮成形体の製造方法において、前記接触角が80度以上100度以下である圧縮成形体の製造方法。
- 請求項11から請求項13のいずれか一項に記載の圧縮成形体の製造方法において、前記第1加圧面および前記第2加圧面の間で圧縮する工程の前に、前記粉末材料の脱気処理工程を有する圧縮成形体の製造方法。
- 請求項11から請求項14のいずれか一項に記載の圧縮成形体の製造方法において、前記第1加圧面および前記第2加圧面の間で圧縮する工程における圧縮圧力が、11MPa以上である圧縮成形体の製造方法。
- 請求項11から請求項15のいずれか一項に記載の圧縮成形体の製造方法において、前記第1加圧面および前記第2加圧面の間で前記粉末材料を圧縮して形成された圧縮成形体を挟み込んだまま、前記第1パンチおよび前記第2パンチを移動させて、前記圧縮成形体を前記貫通孔から抜き出す工程を有する圧縮成形体の製造方法。
- 請求項11から請求項15のいずれか一項に記載の圧縮成形体の製造方法において、前記第1加圧面および前記第2加圧面の間で前記粉末材料を圧縮して形成された圧縮成形体を挟み込んだまま、前記圧縮成形金型を移動させて、前記圧縮成形体を前記貫通孔から抜き出す工程を有する圧縮成形体の製造方法。
- 請求項11から請求項17のいずれか一項に記載の圧縮成形体の製造方法において、前記粉末材料には、成形助剤が含有されていない圧縮成形体の製造方法。
- 請求項11から請求項18のいずれか一項に記載の圧縮成形体の製造方法において、前記粉末材料は、有機エレクトロルミネッセンス用素子材料である圧縮成形体の製造方法。
- 請求項19に記載の圧縮成形体の製造方法において、前記粉末材料は、複数種類の有機エレクトロルミネッセンス用素子材料が混合されてなる圧縮成形体の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020167001173A KR20160137937A (ko) | 2014-03-31 | 2015-03-19 | 압축 성형 장치 및 압축 성형체의 제조 방법 |
CN201580001415.3A CN105408100A (zh) | 2014-03-31 | 2015-03-19 | 压缩成形装置及压缩成形体的制造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-072909 | 2014-03-31 | ||
JP2014072909A JP2015193028A (ja) | 2014-03-31 | 2014-03-31 | 圧縮成形装置および圧縮成形体の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2015151824A1 true WO2015151824A1 (ja) | 2015-10-08 |
Family
ID=54240155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2015/058180 WO2015151824A1 (ja) | 2014-03-31 | 2015-03-19 | 圧縮成形装置および圧縮成形体の製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2015193028A (ja) |
KR (1) | KR20160137937A (ja) |
CN (1) | CN105408100A (ja) |
WO (1) | WO2015151824A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106501046B (zh) * | 2016-12-06 | 2018-12-04 | 中国工程物理研究院流体物理研究所 | 金刚石对顶砧实验样品孔中绝热盐片及样品的装配方法 |
TWI756696B (zh) * | 2018-03-28 | 2022-03-01 | 日商三菱化學股份有限公司 | 纖維強化複合材料的成形裝置及纖維強化複合材料成形品的製造方法 |
JP7194135B2 (ja) * | 2020-03-09 | 2022-12-21 | 株式会社豊田中央研究所 | 成形体の製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06179098A (ja) * | 1992-12-09 | 1994-06-28 | Kao Corp | 粉体圧縮成形型及び方法 |
JP2004273456A (ja) * | 2003-03-07 | 2004-09-30 | Eastman Kodak Co | 有機材料の固体圧縮ペレットの形成方法及びoled表示装置の製造方法 |
JP2004345222A (ja) * | 2003-05-22 | 2004-12-09 | Neomax Co Ltd | 粉末成形方法 |
JP2006150854A (ja) * | 2004-11-30 | 2006-06-15 | Mitsubishi Materials Corp | 光ディスク成形用金型装置 |
KR20090097318A (ko) * | 2008-03-11 | 2009-09-16 | 박진연 | 타블릿 성형 다이 어셈블리 |
JP2012201015A (ja) * | 2011-03-25 | 2012-10-22 | Koito Mfg Co Ltd | 熱板溶着用治具およびその製造方法、金属部材 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10249827A (ja) * | 1997-03-17 | 1998-09-22 | Mitsubishi Chem Corp | カーボンブラック成型体の製造方法及び粉体の高効率脱気方法 |
JP2001009596A (ja) * | 1999-06-29 | 2001-01-16 | Hitachi Metals Ltd | 粉末圧縮成形方法 |
-
2014
- 2014-03-31 JP JP2014072909A patent/JP2015193028A/ja active Pending
-
2015
- 2015-03-19 CN CN201580001415.3A patent/CN105408100A/zh active Pending
- 2015-03-19 KR KR1020167001173A patent/KR20160137937A/ko not_active Application Discontinuation
- 2015-03-19 WO PCT/JP2015/058180 patent/WO2015151824A1/ja active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06179098A (ja) * | 1992-12-09 | 1994-06-28 | Kao Corp | 粉体圧縮成形型及び方法 |
JP2004273456A (ja) * | 2003-03-07 | 2004-09-30 | Eastman Kodak Co | 有機材料の固体圧縮ペレットの形成方法及びoled表示装置の製造方法 |
JP2004345222A (ja) * | 2003-05-22 | 2004-12-09 | Neomax Co Ltd | 粉末成形方法 |
JP2006150854A (ja) * | 2004-11-30 | 2006-06-15 | Mitsubishi Materials Corp | 光ディスク成形用金型装置 |
KR20090097318A (ko) * | 2008-03-11 | 2009-09-16 | 박진연 | 타블릿 성형 다이 어셈블리 |
JP2012201015A (ja) * | 2011-03-25 | 2012-10-22 | Koito Mfg Co Ltd | 熱板溶着用治具およびその製造方法、金属部材 |
Non-Patent Citations (1)
Title |
---|
"Yotobetsu Catalog Plastic Gomu Seikei Kako", CERTESS COATING, 2012, pages 4, Retrieved from the Internet <URL:http://nanocoat-ts.com/download> [retrieved on 20150415] * |
Also Published As
Publication number | Publication date |
---|---|
CN105408100A (zh) | 2016-03-16 |
JP2015193028A (ja) | 2015-11-05 |
KR20160137937A (ko) | 2016-12-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2015151824A1 (ja) | 圧縮成形装置および圧縮成形体の製造方法 | |
JPWO2015068808A1 (ja) | 離型フィルム、および半導体パッケージの製造方法 | |
TWI805808B (zh) | 合成石英玻璃腔體、合成石英玻璃腔蓋、光學元件封裝體及其等之製造方法 | |
KR20170126394A (ko) | 차압법으로 재료의 뒤틀림을 억제하는 방법 | |
WO2014041904A1 (ja) | 凹凸形状付積層体の製造方法および転写フィルム | |
TW201829148A (zh) | 包括可壓縮結構的成型裝置 | |
CN107884856A (zh) | 一种基于紫外固化的新型光栅复制方法 | |
WO2008102621A1 (ja) | 稜状の微細構造を有する粘着部材 | |
CN105034228A (zh) | 片状树脂体、树脂成形装置及树脂成形方法以及成形制品的制造方法 | |
US20130228799A1 (en) | Method for producing a silicone foil, silicone foil and optoelectronic semiconductor component comprising a silicone foil | |
ES2531101T3 (es) | Sinterización por plasma de microondas | |
US8182739B2 (en) | Process for producing concentric-circular-gradient functional material for biogenic use and apparatus for producing the same | |
CN1200597C (zh) | 多层陶瓷基片的制造方法 | |
WO2015151825A1 (ja) | 圧縮成形金型、圧縮成形金型の製造方法、及び圧縮成形体の製造方法 | |
CN109454899B (zh) | 一种预浸料层叠高压预成型工艺 | |
CN101391435A (zh) | 多层压板机 | |
KR20110084397A (ko) | 연마공구의 제조방법 | |
US9676173B2 (en) | Process for the transfer of at least a portion of a composite film onto a flexible polymer membrane | |
CN106200261B (zh) | 一种具有双层纳米结构的金属/聚合物的制备方法 | |
JP7194135B2 (ja) | 成形体の製造方法 | |
RU2011130815A (ru) | Способ изготовления пластины держателя для использования в электростатическом держателе | |
JP2006326648A (ja) | 粉末成形金型及び粉末成形方法 | |
WO2020194815A1 (ja) | 凹凸構造体の製造方法 | |
WO2010147313A3 (ko) | 다층 세라믹 기판의 제조 방법 | |
CN106684018A (zh) | 一种生瓷片去膜装置及方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201580001415.3 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 15773323 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20167001173 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 15773323 Country of ref document: EP Kind code of ref document: A1 |