KR20160137938A - 압축 성형 금형, 압축 성형 금형의 제조 방법, 및 압축 성형체의 제조 방법 - Google Patents

압축 성형 금형, 압축 성형 금형의 제조 방법, 및 압축 성형체의 제조 방법 Download PDF

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Publication number
KR20160137938A
KR20160137938A KR1020167001174A KR20167001174A KR20160137938A KR 20160137938 A KR20160137938 A KR 20160137938A KR 1020167001174 A KR1020167001174 A KR 1020167001174A KR 20167001174 A KR20167001174 A KR 20167001174A KR 20160137938 A KR20160137938 A KR 20160137938A
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KR
South Korea
Prior art keywords
fluoride
compression
nitride
film
punch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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KR1020167001174A
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English (en)
Korean (ko)
Inventor
히로마로 시게히사
마사히코 후쿠다
Original Assignee
이데미쓰 고산 가부시키가이샤
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Application filed by 이데미쓰 고산 가부시키가이샤 filed Critical 이데미쓰 고산 가부시키가이샤
Publication of KR20160137938A publication Critical patent/KR20160137938A/ko
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/006—Pressing and sintering powders, granules or fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/361—Moulds for making articles of definite length, i.e. discrete articles with pressing members independently movable of the parts for opening or closing the mould, e.g. movable pistons
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
    • B30B15/022—Moulds for compacting material in powder, granular of pasta form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/04—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon or silicon
    • H01L51/0003—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/361—Moulds for making articles of definite length, i.e. discrete articles with pressing members independently movable of the parts for opening or closing the mould, e.g. movable pistons
    • B29C2043/3615—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices
    • B29C2043/3628—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices moving inside a barrel or container like sleeve
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Press-Shaping Or Shaping Using Conveyers (AREA)
KR1020167001174A 2014-03-31 2015-03-19 압축 성형 금형, 압축 성형 금형의 제조 방법, 및 압축 성형체의 제조 방법 Ceased KR20160137938A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014072910A JP6096147B2 (ja) 2014-03-31 2014-03-31 圧縮成形金型の製造方法、及び圧縮成形体の製造方法
JPJP-P-2014-072910 2014-03-31
PCT/JP2015/058182 WO2015151825A1 (ja) 2014-03-31 2015-03-19 圧縮成形金型、圧縮成形金型の製造方法、及び圧縮成形体の製造方法

Publications (1)

Publication Number Publication Date
KR20160137938A true KR20160137938A (ko) 2016-12-02

Family

ID=54240156

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167001174A Ceased KR20160137938A (ko) 2014-03-31 2015-03-19 압축 성형 금형, 압축 성형 금형의 제조 방법, 및 압축 성형체의 제조 방법

Country Status (4)

Country Link
JP (1) JP6096147B2 (https=)
KR (1) KR20160137938A (https=)
CN (1) CN105408081B (https=)
WO (1) WO2015151825A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016125406A1 (de) 2016-12-22 2018-06-28 Gkn Sinter Metals Engineering Gmbh Matrize für eine Presse
KR102940152B1 (ko) * 2023-07-06 2026-03-17 한국원자력연구원 양방향 압축 금형 장치
CN120228231B (zh) * 2025-04-11 2025-11-25 河南浙锻机床有限公司 自动化压力机及在金属配件加工中的应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02297411A (ja) 1989-02-01 1990-12-07 Chisso Corp 粉体成形用離型剤及びそれを用いた成形品の製造方法
KR20090097318A (ko) 2008-03-11 2009-09-16 박진연 타블릿 성형 다이 어셈블리
JP3163163U (ja) 2010-07-21 2010-09-30 株式会社ジェピア 金型

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03254910A (ja) * 1989-07-11 1991-11-13 Hitachi Tool Eng Ltd プラスチック成形用金型
JPH03216298A (ja) * 1990-01-19 1991-09-24 Idemitsu Kosan Co Ltd 圧縮成形方法
JP2849162B2 (ja) * 1990-02-27 1999-01-20 日本タングステン株式会社 樹脂材成形用モールド
JP3837928B2 (ja) * 1998-08-21 2006-10-25 住友電気工業株式会社 樹脂成形装置用部材及びその製造方法
JP2002001733A (ja) * 2000-06-26 2002-01-08 Fuji Dies Kk 半導体封止用樹脂のタブレット成形用金型
US7153592B2 (en) * 2000-08-31 2006-12-26 Fujitsu Limited Organic EL element and method of manufacturing the same, organic EL display device using the element, organic EL material, and surface emission device and liquid crystal display device using the material
JP3292199B2 (ja) * 2001-03-22 2002-06-17 住友電気工業株式会社 ゴム用金型、ゴム用金型の製造方法およびゴムの成形方法
US7238383B2 (en) * 2003-03-07 2007-07-03 Eastman Kodak Company Making and using compacted pellets for OLED displays
JP4582497B2 (ja) * 2004-02-27 2010-11-17 株式会社ダイヤメット 粉末成形体の成形方法
JP5516653B2 (ja) * 2006-10-06 2014-06-11 日立化成株式会社 タブレット成形金型、ならびにタブレット、光半導体素子搭載用基板の製造方法および光半導体装置。
JP2008112977A (ja) * 2006-10-06 2008-05-15 Hitachi Chem Co Ltd タブレット成形金型、ならびにタブレット、光半導体素子搭載用基板の製造方法および光半導体装置。
JP2012056246A (ja) * 2010-09-10 2012-03-22 Fujifilm Corp 微細な凹凸パターンを表面に有するＮｉ原盤、およびそれを用いたＮｉ複盤の製造方法
JP5725339B2 (ja) * 2011-03-25 2015-05-27 株式会社小糸製作所 熱板溶着用治具およびその製造方法、金属部材

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02297411A (ja) 1989-02-01 1990-12-07 Chisso Corp 粉体成形用離型剤及びそれを用いた成形品の製造方法
KR20090097318A (ko) 2008-03-11 2009-09-16 박진연 타블릿 성형 다이 어셈블리
JP3163163U (ja) 2010-07-21 2010-09-30 株式会社ジェピア 金型

Also Published As

Publication number Publication date
CN105408081A (zh) 2016-03-16
CN105408081B (zh) 2019-03-22
JP2015193175A (ja) 2015-11-05
JP6096147B2 (ja) 2017-03-15
WO2015151825A1 (ja) 2015-10-08

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