KR20160137938A - Compression molding die, production method for compression molding die, and production method for compression-molded article - Google Patents

Abstract

CLAIMS 1. A compression-molding die for molding a compression-molded body by pressurizing and compressing a material for an organic EL device, wherein a nitride film containing nitride is laminated on a metal surface of a compression-molding die which is in contact with the organic EL element- In the nitride film, a fluoride film containing a fluoride formed by a dipping method is laminated.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a compression molding die, a compression molding die, a compression molding die, a compression molding die, a compression molding die, a production method and a compression molding die,

The present invention relates to a compression-molding die, a method of manufacturing a compression-molding die, and a method of manufacturing a compression-molded body.

Conventionally, a method of filling a powdery material in a compaction chamber of a compression molding die and compressing it by punching is employed.

Further, recently, a method of compression-molding a powder material of an organic material used for an electronic device or the like has been studied. An organic layer formed between a pair of electrodes of such an organic electronic material element is generally formed by vacuum heating deposition. The material for the organic device to be placed in the evaporation source is generally in the form of a powder, and if it is in powder form, the charging efficiency is low and the handling property is inferior, and the problem of powder scattering has occurred.

Korean Patent Publication No. 10-2009-0097318 Japanese Patent Application Laid-Open No. 2-297411 Japanese utility model registration No. 3163163

It is an object of the present invention to provide a compression molding die capable of suppressing partial peeling of a material from a molded article or compression of powder from a surface of the molded article after compression molding of the powder material, .

According to one aspect of the present invention, there is provided a compression molding die for molding a compression molded body by pressurizing and compressing a material for an organic EL element, wherein a metal surface of the compression molding die, which is in contact with the material for the organic EL element at the time of compression, And the nitride film is provided with a fluorine-containing film including fluoride formed by a dipping method, which is laminated on the nitride film.

According to another aspect of the present invention, there is provided an organic EL device comprising: a body having a through-hole; and a pressing member inserted into the through- There is provided a compression mold having a first punch and a second punch, each of which is formed with a surface, a nitride film including nitride on the pressing surface, and a fluoride film including fluoride formed by a dipping method.

According to another aspect of the present invention, there is provided a method of manufacturing a compression molding die for molding a compression molded body by pressurizing and compressing a material for an organic EL element, A step of forming a nitride film on the surface of the nitride film, a step of immersing the surface on which the nitride film is formed in a fluoride-containing solution containing fluoride, and a step of drying the fluoride-containing solution to form a fluoride film / RTI >

According to another aspect of the present invention, there is provided a method of manufacturing a compression molded body by pressurizing and compressing a material for an organic EL device, the method comprising: And a nitride film containing nitride are laminated on the nitride film, and a fluoride film containing fluoride formed by a dipping method is laminated on the nitride film.

According to the compression molding die, the compression molding die manufacturing method, and the compression molding die manufacturing method of the present invention, after compression molding of the powder material, the material is partially peeled off from the molding body or scattering of the powder from the molding body surface can be suppressed .

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partial schematic cross-sectional view showing the configuration of a compression molding apparatus according to one embodiment. Fig.
Fig. 2 is an enlarged cross-sectional schematic view showing the surface of the compression-molding die according to the above-described embodiment on an enlarged scale.
Fig. 3A is a view for explaining a method of manufacturing a compression molded product which is carried out using a compression-molding die according to the above-described embodiment. Fig.
FIG. 3B is a view for explaining a method of manufacturing a compression molded product performed using the compression-molding die according to the above-described embodiment.
Fig. 3C is a view for explaining a method of manufacturing a compression-molded body using the compression-molding die according to the above embodiment.
Fig. 3D is a view for explaining a method of manufacturing a compression molded product which is carried out using a compression-molding die according to the above-described embodiment.
Fig. 3E is a view for explaining a method of manufacturing a compression-molded body using the compression-molding die according to the above embodiment. Fig.
FIG. 4A is a view for explaining a method of manufacturing a compression molded body which is different from the method of manufacturing the compression molded body described with reference to FIGS. 3A to 3E. FIG.
FIG. 4B is a view for explaining a method of manufacturing a compression molded body which is different from the manufacturing method of the compression molded body described in FIGS. 3A to 3E. FIG.
Fig. 4C is a view for explaining a method of manufacturing a compression molded body which is different from the method of manufacturing the compression molded body described in Figs. 3A to 3E.

≪ First Embodiment >

(1) Configuration of compression molding apparatus

Fig. 1 shows a schematic view of a compression molding apparatus 1 according to the present embodiment.

In this embodiment, a material for an organic EL device is pressed and compressed to produce a compression molded article.

The compression molding apparatus 1 includes a compression molding die 2, a base portion 10, two guide bars 11 arranged parallel to each other on the base portion 10, And a lower movable plate 13, a middle movable plate 14 and an upper movable plate 15 which are supported between the base portion 10 and the upper frame 12. [ 1, the lower movable plate 13, the middle movable plate 14 and the upper movable plate 15 are formed in parallel with each other in this order from the base portion 10 side. The lower movable plate 13, the middle movable plate 14 and the upper movable plate 15 are independently movable in the vertical direction along the guide bar 11. The lower movable plate 13, the middle movable plate 14, and the upper movable plate 15 are supported by a liquid pressure drive mechanism such as a hydraulic cylinder, a pneumatic drive mechanism such as an air cylinder, Or the like by means of a mechanical driving mechanism.

The compression molding die 2 includes a main body 20, a first punch 23 and a second punch 24 formed opposite to the first punch 23. The main body 20 is replaceably mounted in a substantially central portion of the middle movable plate 14. [ As shown in Fig. 1, the main body 20 has a through hole 21 penetrating vertically. The first punch 23 and the second punch 24 are inserted into the through hole 21 to form a molding chamber 22 for filling the organic EL element material in the compression molding die 2 do. The molding chamber 22 has a shape of a compression molded body to be molded. The shape of the molding chamber 22, that is, the shape of the compression-molded body may be a columnar shape, an elliptical columnar shape, or a cross-sectional shape may be a polygonal shape such as a semicircular shape, a fan shape, a triangle shape or a square shape or a small plate shape. The compression-molded body may be a solid body or a hollow body.

The first punch 23 and the second punch 24 compress the organic EL element materials filled in the compaction chamber 22 by pressing them from opposite directions. The first punch 23 and the second punch 24 are formed so as to be insertable into the through hole 21.

The first punch 23 is fixed to the upper surface of the lower movable plate 13. The first punch 23 is configured to move in the axial direction of the through hole 21 by moving the lower movable plate 13 in the vertical direction. The first punch 23 is inserted from the other through-hole inlet 21b of the through-hole 21. [ The second punch 24 is fixed to the lower surface of the upper movable plate 15. The second punch 24 is configured to move in the axial direction of the through hole 21 by moving the upper movable plate 15 in the vertical direction. The second punch 24 is inserted from one of the through-hole openings 21a of the through-hole 21. It is preferable that the first punch 23 and the second punch 24 are formed to be slightly smaller than the through holes 21. [ A gap is formed between the side surface of the inserted first punch 23 and the inner circumferential surface 21c of the through hole 21 and between the side surface of the second punch 24 and the inner circumferential surface 21c of the through hole 21, It is preferable that the gas deaerated from the powder material in the molding chamber 22 is discharged through the gap.

At each end of the first punch 23 and the second punch 24, a first pressing surface 231 and a second pressing surface 241 for pressing the organic EL element material are formed. In the present embodiment, the first pressing surface 231 of the first punch 23 and the second pressing surface 241 of the second punch 24 are flat surfaces. The first pressing surface 231 of the first punch 23 and the second pressing surface 241 of the second punch 24 and the inner circumferential surface 21c of the through hole 21 of the main body 20, 22 are formed. The material for the organic EL element is filled in the molding chamber 22 and the first punch 23 and the second punch 24 are pressed from above and below to form the first pressing surface 231 and the second pressing surface 241, So that a compression molded article is obtained.

2 is a schematic cross-sectional view showing a part of the first punch 23 as an enlarged part as a part of the surface of the compression-molding die 2 according to the present embodiment.

The first pressing surface 231 of the first punch 23 is a metal surface in contact with the material for the organic EL element at the time of pressing and compression. As shown in FIG. 2, a nitride film 25 including nitride is laminated on the first pressing surface 231. On the nitride film 25, a fluoride film 26 containing fluoride is laminated.

The second pressing surface 241 of the second punch 24 and the inner circumferential surface 21c of the through hole 21 of the main body 20 are also metal surfaces that come into contact with the material for the organic EL element at the time of pressing and compression. The nitride film 25 and the fluoride film 26 are laminated on the second pressing surface 241 and the inner circumferential surface 21c in the same manner as the first pressing surface 231. [ In the present embodiment, the first pressing surface 231, the second pressing surface 241, and the fluoride film 26 laminated on the inner circumferential surface 21c are formed by the dipping method.

In the present embodiment, the nitride film 25 is preferably composed of a nitride selected from the group consisting of titanium aluminum nitride, titanium nitride carbide, chromium nitride, titanium nitride, titanium nitride silicon, and titanium aluminum nitride silicon , And titanium aluminum nitride are more preferable. In the present embodiment, the nitride film 25 is made of titanium aluminum nitride formed by physical vapor deposition.

The fluoride film 26 is preferably composed of a fluorocarbon compound. The fluorocarbon-based compound is composed of a chain-like moiety formed of fluorocarbons and a reactor that bonds with other materials. Examples of fluorocarbon-based compounds include perfluoroalkylsilanes and perfluoropolyether group-containing silane compounds.

Examples of the perfluoroalkylsilanes include compounds represented by the following formulas (1) and (2).

CF ₃ (CF ₂ ) _n CH ₂ CH ₂ Si (OMe) _m (One)

CF ₃ (CF ₂ ) _n CH ₂ CH ₂ Si (OR) _m (2)

In the above formula (1), n is 1, 3, 5, or 7, m is 2 or 3, and Me is a methyl group or an ethyl group.

In the above formula (2), n is 1, 3, 5, or 7, m is 2 or 3, and R is a halogen element.

Specific examples of the compound represented by the above-mentioned formula (1) or (2) include CF ₃ (CF ₂ ) ₅ CH ₂ CH ₂ Si (OCH ₃ ) ₃ (manufactured by Momentive Performance Materials of _{TSL8257), CF 3 (CF 2} ) 7 CH 2 CH 2 Si (OCH 3) 3 ( for example, TSL8233 of Momentive, performance, meote Materials _{manufacturing), CF 3 (CF 2)} 7 CH 2 CH 2 Si (OCH _{3) 2} (for example, KBM7803 of Momentive, performance, meote Materials Preparation TSL8231, or Shin-Etsu chemical Co., _{in), CF 3 (CF 2)} 7 CH 2 CH 2 Si (OC 2 H 5) ₃ (for example, AY43-158E manufactured by Toorra Dow Corning).

Examples of the perfluoropolyether group-containing silane compounds include perfluoropolyether-modified aminosilane and perfluoropolyether-modified polysilazane. Specifically, for example, KY-164 manufactured by Shin-Etsu Chemical Industry Co., Ltd. and off-tool series manufactured by Daikin Industries Co., Ltd. can be mentioned.

The fluoride film 26 is not particularly limited as long as it is formed by the dipping method. For example, the fluorine-containing film 26 is immersed in a fluoride-containing solution containing a fluorocarbon compound, ≪ / RTI > In the present embodiment, the first punch 23, the second punch 24, and the main body 20 are immersed in the fluoride-containing solution. At this time, at least the first pressing surface 231, the second pressing surface 241 and the inner circumferential surface 21c are immersed in the fluoride-containing solution and dried to form the fluoride film 26 on each surface.

In the present embodiment, the center line average roughness Ra of the first pressing surface 231, the second pressing surface 241, and the inner circumferential surface 21c is preferably 0.5 占 퐉 or less, more preferably 0.1 占 퐉 or less. In the present embodiment, since the fluoride film 26 is present in the surface layer of each surface, if the center line average roughness Ra of the surface of the fluoride film 26 is 0.5 m or less, It is not adhered well, and peeling from the compression-molded body is suppressed.

The compression molding apparatus 1 preferably has a degassing means for discharging the gas from the inside of the molding chamber 22 to the outside and includes a main body 20 of the compression molding die 2, a first punch 23, It is preferable that at least one of the punches 24 has a degassing means. In the present embodiment, the first punch 23 has a vibrating device (not shown) serving as a degassing means. The first punch 23 is inserted from the through hole inlet 21b of the through hole 21 and the first punch 23 is formed by the inner peripheral surface 21c of the through hole 21 and the first pressing surface 231 of the first punch 23. [ The concave portion is filled with the powder material. After the filling, the first punch 23 is vibrated by the vibration device to thereby degas the powder material in the charged state and discharge it to the outside of the molding chamber 22.

(2) Manufacturing method of compression mold

Next, a method of manufacturing the compression-molding die 2 will be described.

First, a step of forming a nitride film 25 by coating a nitride on the metal surface of the compression-molding die 2 in contact with the material for an organic EL device during pressurization and compression is performed. In the present embodiment, at least the nitride film 25 is formed on the first pressing surface 231, the second pressing surface 241, and the inner circumferential surface 21c. The nitride film 25 is formed by coating nitride on each surface. The nitride film 25 can be formed by, for example, a physical vapor deposition (PVD) method or a chemical vapor deposition (CVD) method. It is preferable to clean the surface of the first punch 23, the surface of the second punch 24 and the surface and the inner peripheral surface 21c of the main body 20 before forming the nitride film 25. [ Examples of the purification treatment include a surface polishing treatment, an ultrasonic cleaning treatment performed by immersing in an organic solvent or the like, a spring-bud treatment with argon ions or the like, and these treatments may be combined.

Next, the first punch 23, the second punch 24, and the main body 20 are immersed in the fluoride-containing solution. At this time, at least the first pressing surface 231, the second pressing surface 241, and the inner circumferential surface 21c on which the nitride film 25 is formed are immersed in the fluoride-containing solution. Thereafter, the fluoride-containing solution is dried to form the fluoride film 26 on each surface. The fluoride-containing solution may be dried at room temperature or may be heated and dried.

In the present embodiment, the fluoride-containing solution includes a fluoride and a solvent. The fluoride is preferably composed of the fluorocarbon compound described above. The solvent is not particularly limited as long as it is a solvent capable of dissolving the fluoride, but an organic solvent is preferable. Examples of the organic solvent include aromatic hydrocarbon solvents such as toluene and xylene, ester solvents such as ethyl acetate and butyl acetate, ether solvents such as dioxane and diethyl ether, and alcohol solvents such as butyl alcohol , Ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone, and the like. The solvent may be a single solvent composed of one kind, or a mixed solvent obtained by mixing a plurality of kinds.

When the fluoride-containing solution is dried, it is preferable to remove the solvent and chemically bond the fluoride to the nitride film 25 to form the fluoride film 26. When the fluoride is chemically bonded to the nitride film 25, it is preferable to carry out the activation treatment to the nitride film 25 in advance. An activation process is performed on the surface of the nitride film 25 by the activation process to form an activation layer. It is preferable to chemically bond the fluoride to the activation layer formed on the surface of the nitride film 25. By performing the activation treatment for forming the activation layer, the contamination adhered to the surface of the nitride film 25 is decomposed and purified, and an activation layer having molecular bonding hands is formed on the surface of the nitride film, Is adsorbed and easily reacts with the reactor of the fluorocarbon compound to be bonded.

The activation treatment is not particularly limited, and examples of the physical treatment include a corona discharge treatment, a plasma treatment, an ultraviolet irradiation treatment, a frame treatment, and the like. Examples of the chemical method include a treatment of immersing in at least one of an acid and an alkali, an oxidizing agent treatment, and an ozone treatment. Among these activation treatments, the corona discharge treatment, the plasma treatment, the ultraviolet ray irradiation treatment and the ozone treatment are preferable because the surface of the nitride film 25 can be prevented from being damaged, and the plasma treatment and the ultraviolet ray irradiation treatment are preferable. ) Is more preferable because it has high efficiency of activating the surface of the substrate.

It is preferable to carry out a step of removing unreacted fluoride after the fluoride film 26 is formed. The surface of the fluoride film 26, that is, the surface in contact with the material for the organic EL device, can be cleaned by removing unreacted fluoride. The method of removing the fluoride is not particularly limited, but it is preferable to clean the fluoride film 26 with a solvent, and it is more preferable to clean the fluoride film 26 by using the same kind of solvent as the solvent used for the fluoride-containing solution.

As described above, a laminated film including the nitride film 25 and the fluoride film 26 is formed on the first punch 23, the second punch 24, and the main body 20 of the compression molding die 2 do.

(3) Manufacturing method of compression molded article

Next, a description will be given of a method of manufacturing a compression molded product which is carried out using the compression molding apparatus 1 and the compression molding die 2.

3A to 3E describe the main body 20, the first punch 23 and the second punch 24 of the compression-molding die 2 in each step of the method for manufacturing a compression molded body, The configuration is omitted. A method of manufacturing a compression molded product according to the present embodiment, which is carried out using a compression molding die 2, is a method of filling a material for an organic EL device and molding the material with a pressing force along a short axis.

First, as shown in Fig. 3A, the first punch 23 is inserted into the through hole 21 through the first pressing surface 231. Then, as shown in Fig. At this time, the first pressing surface 231 is inserted until it reaches the position of the predetermined depth dimension in the through hole 21. This depth dimension is set by the thickness dimension of the compression-molded body and the like.

Next, as shown in Fig. 3B, the powdery organic EL element-forming material P is filled in the through hole 21 having the bottom surface formed by the first pressing surface 231. Next, as shown in Fig. After filling the material P for an organic EL device, the first punch 23 is vibrated by the above-described vibrating device to perform degassing treatment.

Next, as shown in FIG. 3C, the second punch 24 is inserted into the through-hole 21 in the second pressing surface 241, and the first pressing surface 241 of the first punch 23 The molding chamber 22 is formed by the inner peripheral surface 21c of the through hole 21, the first pressing surface 231 and the second pressing surface 241. [ The compression molded body Q is formed by compressing the organic EL element material P between the first pressing surface 231 and the second pressing surface 241. [ In the present embodiment, an example is described in which the first punch 23 and the second punch 24 are moved to perform the positive pressure method of pressing the organic EL element material P from both sides. However, It does not.

The compression pressure is preferably 11 MPa or more. The surface temperature of the inner peripheral surface 21c of the main body 20, the first pressure surface 231 of the first punch 23 and the second pressure surface 241 of the second punch 24 is 10 ° C or higher .

Next, as shown in Fig. 3D, a pressurized object (Q) is sandwiched between the first pressure surface 231 of the first punch 23 and the second pressure surface 241 of the second punch 24 The first punch 23 and the second punch 24 are lifted and the compression-molded body Q is pulled out from the through hole 21. Then, It is preferable that the first punch 23 and the second punch 24 are stopped to move up when the first pressing surface 231 of the first punch 23 coincides with the upper surface of the main body 20 . It is preferable that the first punch 23 and the second punch 24 move upward at a low speed so that the stress acting on the compression-molded body Q is not released at once.

Next, as shown in Fig. 3E, the second punch 24 is moved upward to open the upper surface of the compression-molded body Q. Then, as shown in Fig. Thereafter, the compression-molded body Q placed on the first pressing surface 231 is taken out. It is preferable to carry out the manufacturing method of the organic EL element by using the compression molded product (Q) obtained by compressing the material for the organic EL device in this way.

The organic EL device material of the present embodiment is not mixed with a molding aid such as a binder or a lubricant. The material for the organic EL device is not particularly limited as a material used for the organic EL device, and examples thereof include a hole transporting material used for the hole transporting layer, a host material used for the light emitting layer, a dopant material, Materials and the like. Further, the material for the organic EL device may be constituted by mixing a plurality of types of materials for the organic EL device.

In the present embodiment, the average particle diameter D50 (median diameter) of the organic EL device material P before molding is preferably small. The smaller the average particle diameter D50 of the material (P) for an organic EL device, the higher the hardness of the compression-molded article. The average particle diameter D50 of the material (P) for an organic EL device is preferably 70 mu m or less, more preferably 45 mu m or less, and further preferably 30 mu m or less. It is preferable that the difference between the maximum particle diameter and the minimum particle diameter is small in the particle diameter distribution of the material (P) for an organic EL device.

It is preferable in the present embodiment that the average particle diameter D50 of the material (P) for an organic EL device satisfies the above-described preferable range.

(3) Effect of the present embodiment

In the compression molding die 2 according to the present embodiment, the molding chamber 22 in which the organic P-element material P is filled is the first pressing surface 231 of the first punch 23, 24 and the inner circumferential surface 21c of the through hole 21 of the main body 20. [ A nitride film 25 and a fluoride film 26 are laminated on the first pressing surface 231, the second pressing surface 241 and the inner circumferential surface 21c. The fluoride film 26 is formed by a dipping method. As a result, it is possible to prevent the material from being peeled off from the compression-molded body (Q) after compression molding, or to prevent the powder from scattering from the surface of the molded body. Further, the surface of the compression-molded body Q can be smoothly formed. It is considered that the fluoride film 26 is uniformly formed on the first pressing surface 231, the second pressing surface 241 and the inner circumferential surface 21c by the dipping method.

In addition, in the prior art, a fluoride-containing solution is coated by a coating method such as a brushing method, and a fluoride film is formed by heating and drying. However, such a method makes it difficult to uniformly form a fluoride film, And the surface of the compression-molded body becomes rough. As a result, the amount of the material partially peeled from the compression-molded body or scattered from the surface of the molded body increases, and the weight of the molded body after molding is reduced by 10% or more.

In this embodiment, after the organic P-element material P is filled, the first punch 23 is vibrated by the above-described vibrating device and subjected to a degassing treatment, whereby the charged organic EL element material P The contained gas can be removed. In this embodiment, the compression pressure when the organic EL element-forming material P is compressed between the first pressing surface 231 and the second pressing surface 241 is 11 MPa or more. As a result, the particles of the organic EL element-forming material P are filled more tightly, and the material is partially peeled off from the compression-molded body Q after compression molding, or scattering of powder from the surface of the molded body can be suppressed.

In the present embodiment, an organic EL device material not containing a molding assistant has been described as an example. The compression molded body in which peeling or the like occurs after molding is not sufficiently hard. As a result, it is difficult to accurately grasp the weight of the compression-molded article due to occurrence of cracks or the like of the compression-molded article, and the productivity of the organic EL device can not be improved. On the other hand, according to the compression-molding die 2 and the method for producing a compression-molded body using the compression-molding die 2 according to the present embodiment, the material is partially peeled off from the compression-molded body Q, It is possible to suppress scattering. Therefore, it is possible to reduce the number of times of supplying the compression-molded body to the evaporation source, and to improve the productivity of the organic EL element.

Since the nitride film 25 is formed on the inner layer side of the fluoride film 26 in the first pressing surface 231, the second pressing surface 241 and the inner circumferential surface 21c, the fluoride film 26 Can be improved.

<Modifications>

The present invention is not limited to the above-described embodiments, but includes the modifications and the like described below within the scope of achieving the object of the present invention.

The laminated film laminated on the metal surface of the compression-molding die 2 is not limited to the configuration of the above embodiment. For example, a layer different from the above-described activation layer may be interposed between the nitride film 25 and the fluoride film 26, and the nitride film 25 and the fluoride film 26 ) May be laminated on one another.

The degassing means formed in the compression molding apparatus 1 is not limited to the vibrating apparatus, but may be, for example, an ultrasonic wave generating apparatus, a tapping apparatus, or a vacuum degassing apparatus. As the degassing means, it is only necessary to be able to degas from the powder material filled in the forming chamber 22. The degassing means is not limited to being formed in the first punch 23 but may be formed in the second punch 24 or the main body 20.

The through-hole inlet 21a of the through-hole 21 of the compression-molding die 2 may be tapered. The tapering is performed such that the diameter of the hole is increased from the inside of the through hole 21 toward the through hole entrance 21a. It is also preferable that a laminated film of the nitride film 25 and the fluoride film 26 is formed also in this tapered portion. Further, the through-hole inlet 21b may be tapered.

The method of extracting the compression-molded body Q from the compression-molding die 2 is not limited to the method described in the above embodiment.

For example, as shown in Fig. 4A, the main body 20 is moved down. It is preferable that the lowering movement of the main body 20 is stopped when the upper surface of the main body 20 coincides with the first pressing surface 231 of the first punch 23 as shown in Fig. The main body 20 is preferably moved downward at a low speed so that the stress acting on the compression-molded body Q is not released at once. Next, as shown in Fig. 4C, the second punch 24 is moved upward to open the upper surface of the compression-molded body Q. Then, as shown in Fig. Thereafter, the compression-molded body Q placed on the first pressing surface 231 is taken out.

The compression molding method is not limited to the method described in the above embodiment. For example, compression molding may be performed by a floating die method. The pressing force is applied by the second punch 24 to increase gradually the frictional force between the inner peripheral surface 21c of the through hole 21 of the main body 20 and the material for the organic EL element, The main body 20 descends together with the middle movable plate 14. In this case, At this time, the first punch 23 is relatively raised. Thereafter, the second punch 24 is raised to take out the compression-molded body. According to such a floating die system, it is possible to adjust the density in the thickness direction of the compression-molded body. In addition to that, a wide drawer system or a pressure reducing system in which only the second punch 24 is lowered can be adopted. The first pressing surface 231 of the first punch 23, the second pressing surface 241 of the second punch 24, and the through hole 21 of the main body 20, A laminated film of the nitride film 25 and the fluoride film 26 is formed on the inner peripheral surface 21c of the compression molded body Q so that the material is partially peeled off from the compression molded body Q after compression molding, .

The compression molding die is not limited to the mechanism, the shape, and the like described in the above embodiments, but may be a mold having a mechanism and a shape capable of pressing and compressing a powdery material to form a compression molded body.

One ; Compression molding device
2 ; Compression mold
21; Through-hole
21a, 21b; Penetrating ball entrance
21c; Inner circumferential surface
22; Molding room
23; The first punch
231; The first pressing surface
24; The second punch
241; The second pressing surface
P; Powder material
Q; Compression molding body

Claims (13)

CLAIMS 1. A compression-molding die for molding a compression-molded body by pressurizing and compressing a material for an organic EL device, wherein a nitride film containing nitride is laminated on a metal surface of a compression-molding die which is in contact with the organic EL element- Wherein the nitride film is laminated with a fluoride film containing a fluoride formed by a dipping method. A first punch having a pressing surface for pressing an organic EL element material filled in a molding chamber inside the main body, the first punch being inserted into the through hole from different through-hole openings of the through- And a second punch, wherein a fluoride film including a nitride film including nitride and a fluoride formed by a dipping method is laminated on the pressing surface. 3. The method of claim 2,
And the nitride film and the fluoride film are also laminated on the inner peripheral surface of the through hole. 4. The method according to any one of claims 1 to 3,
Wherein the nitride film is composed of a nitride selected from the group consisting of titanium aluminum nitride, titanium nitride carbide, chromium nitride, titanium nitride, titanium nitride silicon, and titanium aluminum nitride silicon. 5. The method according to any one of claims 1 to 4,
Wherein the fluoride is a fluorocarbon compound. A manufacturing method of a compression molding die for molding a compression molded product by pressurizing and compressing a material for an organic EL device, the process comprising the steps of: forming a nitride film on a metal surface of a compression molding die contacting with the above- , A step of immersing the surface on which the nitride film is formed in a fluoride-containing solution containing fluoride, and a step of drying the fluoride-containing solution to form a fluoride film. The method according to claim 6,
Wherein the fluoride-containing solution contains the fluoride and a solvent, and in the step of forming the fluoride film, the solvent is removed and the fluoride is chemically bonded to the nitride film to form the fluoride film, And subsequently removing the unreacted fluoride. 8. The method of claim 7,
Wherein the fluoride film is washed with a solvent of the same kind as the solvent contained in the fluoride-containing solution when the unreacted fluoride is removed. 9. The method according to any one of claims 6 to 8,
After the nitride film is subjected to activation treatment of at least one of a corona discharge treatment, a plasma treatment, an ultraviolet ray irradiation treatment, a frame treatment, a treatment of immersing in at least any solution of an acid and an alkali, an oxidizing agent treatment and an ozone treatment, And the formed surface is immersed in the fluoride-containing solution. 10. The method of claim 9,
Wherein the activation treatment is a corona discharge treatment, a plasma treatment, an ultraviolet irradiation treatment, or an ozone treatment. 10. The method of claim 9,
Wherein the activation treatment is a plasma treatment or an ultraviolet ray irradiation treatment. A production method of a compression molded product in which a material for an organic EL device is pressed and compressed to produce a compression molded product, wherein a nitride film containing nitride is laminated on the metal surface of the compression mold, , And a fluoride film containing a fluoride formed by a dipping method is laminated on the nitride film. 13. The method of claim 12,
Wherein the nitride film is composed of a nitride selected from the group consisting of titanium aluminum nitride, titanium nitride carbide, chromium nitride, titanium nitride, titanium nitride silicon, and titanium aluminum nitride silicon.

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