TWI814282B - Adhesive Film Applied to Wafer Fat Edge Removal and Its Removal Method - Google Patents

Abstract

The invention relates to a film applied to wafer fat edge removal and its removal method, which includes: a film roll, which includes a discharge side, a rewind side and an application section, which is cut and formed in the application section There is a receiving hole, and the circular cutting waste cut out by it is removed; a working platform has a wafer positioned on its surface, and the bottom side of the working platform passes through a preset power device and a lifting device The push rod pushes up and inserts the wafer into the receiving hole to form a position; a coating knife is located above one edge of the wafer and moves in a horizontal direction toward the other side of the wafer until the coating knife The coating liquid stops after completely covering the wafer surface, and an uncured coating layer is formed on the wafer surface and the application section surface; a vacuum chamber cover is covered on the work platform, and the inside of the chamber cover is Evacuate and form an accelerated drying state, so that the uncured coating layer quickly forms a cured coating layer, so that a coating waste remains on the surface of the application section, and the cured coating layer remains on the surface of the wafer to form The fat edge phenomenon on the wafer surface significantly reduces the structure.

Description

Adhesive film used in wafer fat edge removal and its removal method

The present invention provides an adhesive film for removing the fat edge of a wafer and a removal method thereof. In particular, it refers to an application section with an adhesive film roll surrounding the edge of the wafer, and the application section is simultaneously coated by a straight-line coating knife. Partial areas and the surface of the wafer are used to form an uncured coating layer, and the application section of the film roll is used to break the surface tension of the wafer edge, and then the uncured coating layer is quickly formed and cured through the vacuum process of the vacuum chamber cover. The coating layer continues to separate the wafer and the film roll through the lifting and lowering of the work platform to ensure a uniform thickness of the coating layer on the wafer surface, thereby preventing the fat edge phenomenon on the wafer surface.

According to reports, a common technology for thin film coating on wafers is spin coating. The advantage of spin coating is that it can obtain an extremely thin coating layer with excellent film thickness uniformity. However, spin coating also has its disadvantages: it is difficult to produce a thick film. The reason is that the rotation speed of the center and the outer ring is quite different during rotation, so it is difficult to obtain a thick and uniform coating film layer. To further understand, when the coating is thin, most of the coating layer will adhere closely to the wafer surface through surface tension; but when the coating forms a thick film, although the bottom layer of the coating is also tightly adhered to the wafer surface due to surface tension, However, the upper layer of paint will be subject to centrifugal force and slide outward. Therefore, when the wafer is spin-coated, due to the different centrifugal forces between the center and the outer ring, it is difficult to obtain a uniform thick film as the rotation speed changes.

Following the above, the paint is particularly affected by surface tension at the outermost edge of the wafer. It has been thrown to the outermost position. The paint is affected by the surface tension of the wafer edge and is not easily thrown away by centrifugal force. Therefore, the paint accumulates at the outer edge of the wafer. The effects will be more severe. In order to obtain a thicker and more uniform coating, more paint needs to be pre-coated on the wafer and rotated slowly to achieve the expected film thickness uniformity. It may even require multiple spin coating processes to achieve a thicker and more uniform coating. The purpose of coating, but the material wasted in the process will increase even more.

Regarding the various shortcomings of the spin coating process for the above-mentioned wafers, those in this industry need to develop and improve them.

Therefore, in view of the above-mentioned problems and deficiencies, the inventor collected relevant information, and after multiple evaluations and considerations, he came up with the invention of this adhesive film for wafer fat edge removal and its removal method.

The main purpose of the present invention is to provide a film used for wafer fat edge removal, including: a film roll, which includes a discharge side, a rewind side and an application section, and is cut to form a The hole is accommodated, and the circular cutting waste cut out by it is removed; a working platform has a wafer positioned on its surface, and the bottom side of the working platform passes through a preset power device and a lifting pusher The rod pushes up and inserts the wafer into the receiving hole to form a position; a coating knife is located above one edge of the wafer and moves in a horizontal direction toward the other side of the wafer until the coating knife reaches the other side of the wafer. The coating liquid stops after completely covering the wafer surface, and an uncured coating layer is formed on the wafer surface and the application section surface; a vacuum chamber cover is covered on the work platform, and the inside of the chamber cover is evacuated Vacuum and form an accelerated drying state, so that the uncured coating layer quickly forms a cured coating layer, so that a coating waste remains on the surface of the application section, and on the surface of the wafer The cured coating layer is retained to form a structure that significantly reduces fat edges on the wafer surface. By surrounding the edge of the wafer with an application section of the film roll, a linear coating knife is used to simultaneously coat part of the application section and the wafer surface to form an uncured coating layer, and the application of the film roll is used The surface tension of the wafer at the edge is broken in several stages, and then the uncured coating layer is quickly formed into a cured coating layer through the vacuum process of the vacuum chamber cover, and the wafer and the film roll are separated by lifting and lowering the work platform to ensure that the wafer is The uniform thickness of the coating layer on the circular surface can prevent the fat edge phenomenon on the wafer surface. At the same time, the film roll is a low-cost disposable consumable, so there is no need to use solvents for cleaning. This is also due to the lack of cleaning tools. The process can speed up the production process of removing the fat edge of the wafer, which is beneficial to significantly shortening the manufacturing time of the wafer.

Another object of the present invention is that the preset power device refers to a pneumatic cylinder with air supply equipment, a hydraulic cylinder with oil supply equipment, or a motor, and in the pneumatic cylinder, the hydraulic cylinder, or the motor Equipped with a lifting push rod that can reciprocate and telescope.

Another object of the present invention is that the cured coating layer formed on the wafer surface refers to a photoresist layer or an insulating layer, and the material constituting the insulating layer is polyimide.

Another object of the present invention is that the preset cutting fixture refers to a laser module, a circular cutter or a hot melt cutting device, and the preset adsorption fixture refers to a suction cup with vacuum adsorption force .

Another object of the present invention is that the coating knife and the nozzle have a straight appearance.

1: Film roll

10: Accommodation hole

11: Discharge side

12: Receiving side

13:Application section

14: Cutting scraps

15: Adsorption fixture

2:wafer

3:Working platform

31: Lifting push rod

4:Painting knife

41:Nozzle

42:Coating liquid

43: Uncured coating layer

44: Cured coating layer

45: Coating waste

5: Vacuum chamber cover

51:tube body

61: Provide a film roll with a flat application section between the discharge side and the take-up side, and a circular shape cut out by a preset cutting jig is formed in the application section. A receiving hole, and the circular cutting waste material cut out by it is removed through a preset adsorption fixture

62: Provide a wafer positioned on a working platform, and drive the working platform to rise so that the wafer can be inserted into the accommodating hole of the film roll to form a positioning

63: Drive the coating knife located above one edge of the wafer to move in a horizontal direction toward the other side of the wafer until the coating liquid of the coating knife completely covers the surface of the wafer and then stops, and the coating liquid on the wafer stops. An uncured coating layer is formed on the surface and the surface of the application section.

64: Drive a vacuum chamber cover to move from a preset position to be positioned above the wafer and the application section and then cover the work platform downwards, and evacuate the inside of the chamber cover to form an accelerated drying state, so that After the uncured coating layer quickly forms a cured coating layer, the vacuum chamber cover is moved back to the preset position.

65: Drive the work platform down to the original position so that a coating waste remains on the surface of the application section, and the cured coating layer is retained on the surface of the wafer to form a structure that greatly reduces the fat edge phenomenon on the surface of the wafer.

[Figure 1] is a schematic diagram of the present invention with a film roll on the working platform.

[Figure 2] is a schematic diagram of the present invention cutting a receiving hole in the film roll.

[Figure 3] is a schematic diagram of the invention using an adsorption jig to remove cutting waste.

[Figure 4] is a schematic diagram of inserting the wafer in front of the accommodating hole according to the present invention.

[Figure 5] is a schematic diagram of the present invention after the wafer is inserted into the receiving hole.

[Figure 6] is a schematic diagram of a coating knife located above one edge of the wafer of the present invention.

[Figure 7] is a schematic diagram of the coating knife of the present invention before coating from one side of the wafer to the other side.

[Figure 8] is a schematic diagram of the present invention after the coating blade is applied from one side of the wafer to the other side.

[Figure 9] is a schematic diagram of the vacuum chamber cover of the present invention before it is covered with the working platform.

[Figure 10] is a schematic diagram of the vacuum chamber cover of the present invention after it is covered with the working platform.

[Figure 11] is a schematic diagram of the present invention in which the working platform is lowered to separate the wafer and the film roll.

[Figure 12] is a flow chart of the removal steps of the present invention applied to the wafer fat edge.

In order to achieve the above objects and effects, the technical means and structures adopted by the present invention are described in detail below with respect to the preferred embodiments of the present invention, so as to facilitate a complete understanding.

Please refer to Figures 1 to 11, which are schematic diagrams of the present invention in which a film roll is provided on the work platform, a receiving hole is cut in the film roll, and the cutting waste is removed using an adsorption jig. The schematic diagram of the wafer passing through the accommodating hole, the schematic diagram of the wafer passing through the accommodating hole, the schematic diagram of the wafer having a coating knife above the edge of one side of the wafer, the coating knife facing from one side of the wafer to the other The schematic diagram before side coating, the schematic diagram after the coating knife is coated from one side of the wafer to the other side, the schematic diagram before the vacuum chamber cover is covered on the work platform, the schematic diagram after the vacuum chamber cover is covered on the work platform and lowered through the work platform The schematic diagram of separating the wafer from the film roll can be clearly seen from the figure. The invented wafer fat edge removal device mainly includes: film roll 1, wafer 2, working platform 3, coating knife 4, and vacuum chamber cover 5. The connection relationship and detailed structure of each component are as follows:

The film roll 1 (Dummy Film) includes a discharge side 11 and a take-up side 12. There is a flat application section 13 between the discharge side 11 and the take-up side 12. The application section 13 There is a circular receiving hole 10 cut out by a preset cutting jig (not shown in the figure), and the circular cutting waste material 14 is cut through a preset cutting jig (not shown in the figure). The adsorption fixture 15 is removed. The aforementioned preset cutting jig refers to a laser module, a circular cutter or a hot melt cutting device, and the preset adsorption jig 15 refers to a suction cup with vacuum adsorption force.

A working platform 3 has a wafer 2 positioned on its surface through vacuum adsorption technology, and the bottom side of the working platform 3 is provided with a lifting push rod 31 connected to a preset power device (not shown in the figure). The preset The power device drives the lifting push rod 31 to rise and insert the wafer 2 into the accommodating hole 10 of the film roll 1 to position it.

The coating knife 4 has a nozzle 41 for a coating liquid 42 to flow out, and the coating knife 4 and its nozzle 41 are in a straight shape, and the coating liquid 42 also moves in a straight shape toward a preset direction for coating, and A preferred embodiment is that the length of the straight-shaped coating liquid 42 is slightly larger than the circular diameter of the wafer 2, and its initial position is above the edge of one side of the wafer 2 and facing the other side of the wafer 2 in a horizontal direction. Move sideways until the coating liquid 42 completely covers the surface of the wafer 2 and then stops, and an uncured coating layer 43 is formed on the surface of the wafer 2 and the surface of the application section 13 .

The vacuum chamber cover 5 moves from a preset position (not shown in the figure) to be positioned above the wafer 2 and the application section 13 and then covers the work platform 3 downward, and evacuates the inside of the chamber cover. An accelerated drying state is formed, and the gas is discharged to the outside through a tube 51 provided on the vacuum chamber cover 5, so that the uncured coating layer 43 quickly forms a cured coating layer 44, and then the vacuum chamber cover 5 is moved. The cavity cover 5 returns to the preset position, and drives the lifting push rod 31 to lower the work platform 3 to the original position, so that a coating waste 45 remains on the surface of the application section 13 and remains on the surface of the wafer 2 The cured coating layer 44 is moved to the next processing station for subsequent processing to form a structure that greatly reduces fat edges on the surface of the wafer 2 . The subsequent processing of the aforementioned application section 13 with coating waste 45 is: rolling the film roll 1 from the discharging side 11 toward the receiving side 12, and allowing the application section 13 with coating waste 45 to be rolled up on the receiving side. 12, at the same time, the unused application section 13 removed from the discharge side 11 is placed above the work platform 3, and waits for the next wafer 2 to be processed to be placed on the work platform 3 and all processes are repeated.

The above-mentioned film roll 1 has a pre-treatment procedure in order to improve the adhesion of the coating liquid 42 and the characteristics of curing film formation. The specific method is to attach plasma, corona or modifier to the film using a physical process. Volume 1 surface. In addition, the surface of the film roll 1 can be treated with ultrasonic vibration suction or dust wheel adhesion to remove impurities or dirt on the surface of the film roll 1. During the dirt removal process, the film roll 1 may be subject to mechanical friction, separation or air Static electricity is generated by flow friction, so it is necessary to configure a static elimination device (such as an air blowing static eliminator or a light radiation static eliminator) on the preset cleaning mechanism (not shown in the figure) to neutralize the film roll 1 Static electricity remaining on the surface. At the same time, the film roll 1 is a low-cost disposable consumable, so there is no need to use solvents for cleaning. Due to the lack of a cleaning process, the production process of removing the wafer fat edge can be accelerated, which is beneficial The wafer manufacturing time is significantly shortened.

The above-mentioned preset power device refers to a pneumatic cylinder with air supply equipment, a hydraulic cylinder with oil supply equipment, or a motor, and the pneumatic cylinder, the hydraulic cylinder, or the motor is equipped with a reciprocating telescopic device. The lifting push rod 31, but the aforementioned pneumatic cylinder, hydraulic cylinder or motor power device is only an example, and other forms of power devices that can cooperate with the lifting push rod 31 to produce reciprocating motion are also used. within the protection scope of the present invention.

The cured coating layer 44 formed on the surface of the wafer 2 refers to a photoresist layer or an insulating layer that can be cured by ultraviolet irradiation, and the material constituting the insulating layer is polyimide (PI). ).

According to the above-mentioned Figures 1 to 11, the adhesive film applied to the wafer fat edge removal is disclosed, and please refer to Figure 12, which is a flow chart of the steps for removing the wafer fat edge of the present invention, including the following steps:

Step 61: Provide a film roll with a flat application section between the discharge side and the take-up side, and a circular shape cut out by a preset cutting jig is formed in the application section. a receiving hole, and the circular cutting waste material cut out by it is removed through a preset adsorption fixture.

Step 62: Provide a wafer positioned on a working platform, drive the working platform up so that the wafer is inserted into the receiving hole of the film roll to form a position, and the working platform uses vacuum adsorption technology to position the wafer. The wafer is positioned.

Step 63: Drive a coating knife located above one edge of the wafer to move in a horizontal direction toward the other side of the wafer until the coating liquid of the coating knife completely covers the surface of the wafer and then stop. An uncured coating layer is formed on the circular surface and the surface of the application section.

Step 64: Drive a vacuum chamber cover to move from a preset position to be positioned above the wafer and the application section and then cover it downward on the work platform, and evacuate the inside of the chamber cover to form an accelerated drying state, so as to After the uncured coating layer is quickly formed into a cured coating layer, the vacuum chamber cover is moved back to the preset position.

Step 65: Drive the working platform down to the original position so that there is a coating remaining on the surface of the application section Waste material is used, and the cured coating layer is retained on the surface of the wafer to form a structure that greatly reduces the fat edge phenomenon on the surface of the wafer.

The more detailed operation process of the present invention is as follows: the film roll 1 is fed through a roll-to-roll (Roll to Roll) or a single sheet (Sheet) method. Although the above-mentioned embodiment of a single sheet is not proposed, this simple implementation change should be included. within the protection scope of the present invention. The film roll 1 is positioned at a predetermined position of the wafer 2 process through vacuum adsorption, and a laser module, a circular cutter or a preset cutting jig of a hot melt cutting device is used to cut out a piece of the application section 13 The accommodating hole 10 (circular notch) is equal to or slightly smaller than the size of the wafer 2, and the cut waste film is removed through a preset adsorption fixture 15 (for example, a suction cup with vacuum adsorption force). The wafer 2 is placed in the center of the receiving hole 10 cut out of the film roll 1. The wafer 2 is fixed by vacuum adsorption through the working platform 3 at the bottom, and a preset distance sensor is used to measure the wafer 2. The surface height is determined, and the height distance between the wafer 2 and the coating knife 4 is automatically adjusted based on the measurement value of the preset distance sensor. Apply rectangular coating through the straight-shaped coating knife 4 and its nozzle 41, and make the short side of the coating area greater than or equal to the diameter of the wafer 2. After the coating of the wafer 2 is completed, move the wafer 2 and the film roll 1 up and down. The separation method may be to separate the wafer 2 upward or the film roll 1 downward, or it may be to separate the wafer 2 and the film roll 1 by moving up and down in opposite directions at the same time. After the coating is completed, the wafer 2 is moved out of the work platform 3 through a preset transfer device, and the film roll 1 carrying the coating waste 45 is moved out of the processing range of the work platform 3 and discarded without reuse. , and wait for the next wafer 2 to be processed to be placed on the work platform 3 and repeat all processes.

From the above figures 1 to 12, it can be understood that the present invention is a film used for wafer fat edge removal, including: a film roll, which includes a discharge side, a take-up side and an application section , a receiving hole is cut in the application section, and it is cut into a circular shape. The cutting waste is removed; a working platform has a wafer positioned on its surface, and the bottom side of the working platform is pushed up through a preset power device and a lifting push rod to insert the wafer into the receiving hole Positioning is formed; a coating knife is located above one edge of the wafer and moves in a horizontal direction toward the other side of the wafer until the coating liquid of the coating knife completely covers the surface of the wafer and then stops, and stops at the edge of the wafer. An uncured coating layer is formed on the circular surface and the surface of the application section; a vacuum chamber cover is covered on the working platform, and the inside of the chamber cover is evacuated and formed into an accelerated drying state, so that the uncured coating layer is quickly formed After a cured coating layer, a coating waste remains on the surface of the application section, and the cured coating layer is retained on the surface of the wafer, so as to form a structure that greatly reduces the fat edge phenomenon on the surface of the wafer. By surrounding the edge of the wafer with an application section of the film roll, a linear coating knife is used to simultaneously coat part of the application section and the wafer surface to form an uncured coating layer, and the application of the film roll is used The surface tension of the wafer at the edge is broken in several stages, and then the uncured coating layer is quickly formed into a cured coating layer through the vacuum process of the vacuum chamber cover, and the wafer and the film roll are separated by lifting and lowering the work platform to ensure that the wafer is The uniform thickness of the coating layer on the circular surface can prevent the fat edge phenomenon on the wafer surface. At the same time, the film roll is a low-cost disposable consumable, so there is no need to use solvents for cleaning. This is also due to the lack of cleaning tools. The process can speed up the production process of removing the fat edge of the wafer, which is beneficial to significantly shortening the manufacturing time of the wafer. This invention is applied in the field of wafer processing and manufacturing and has excellent practicability. Therefore, a patent application is filed to seek protection of patent rights.

The above are only preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Therefore, any simple modifications and equivalent structural changes made by using the description and drawings of the present invention should be included in the present invention. Within the scope of the patent, we will make it clear.

In summary, the above-mentioned adhesive film for wafer fat edge removal of the present invention and its removal method can indeed achieve its effect and purpose when used, so the present invention is a practical and excellent method. In order to meet the application requirements for invention patents, I have submitted a unique invention in accordance with the law. I hope that the review committee will approve the case as soon as possible to protect the inventor's hard work on research and development. If the review committee of the Jun Bureau has any doubts, please feel free to write to the inventor. We must try our best to cooperate and feel that it is beneficial.

1: Film roll

10: Accommodation hole

11: Discharge side

12: Receiving side

13:Application section

2:wafer

3:Working platform

31: Lifting push rod

44: Coating waste

45: Cured coating layer

Claims (10)

An adhesive film used for wafer fat edge removal, including: A film roll, which includes a discharge side and a take-up side, has a flat application section between the discharge side and the take-up side, and is formed in the application section using a preset cutting A circular receiving hole is cut out by the jig, and the circular cutting waste material is removed through a preset adsorption jig; A work platform has a wafer positioned on its surface, and the bottom side of the work platform is provided with a lift push rod connected to a preset power device. The preset power device drives the lift push rod to rise and penetrate the wafer. Placed in the receiving hole of the film roll to form a position; A coating knife has a nozzle for a coating liquid to flow out, and its initial position is above the edge of one side of the wafer, and moves in a horizontal direction toward the other side of the wafer until the coating liquid completely covers the wafer. Stop after the circular surface, and form an uncured coating layer on the surface of the wafer and the surface of the application section; and A vacuum chamber cover moves from a preset position to be positioned above the wafer and the application section and then covers the work platform downwards, and evacuates the inside of the chamber cover and creates an accelerated drying state, so that the After the uncured coating layer quickly forms a cured coating layer, the vacuum chamber cover is moved back to the preset position, and the lifting push rod is driven to lower the working platform to the original position, so that a coating remains on the surface of the application section. Waste material is used, and the cured coating layer is retained on the surface of the wafer to form a structure that greatly reduces the fat edge phenomenon on the surface of the wafer. The adhesive film used for wafer fat edge removal as described in claim 1, wherein the preset power device refers to a pneumatic cylinder with air supply equipment, a hydraulic cylinder with oil supply equipment, or A motor, and the pneumatic cylinder, the hydraulic cylinder or the motor is provided with the lift push rod that can reciprocate and telescope. The adhesive film used for wafer fat edge removal as described in claim 1, wherein the cured coating layer formed on the wafer surface refers to a photoresist layer or an insulating layer, and the material constituting the insulating layer is A polyimide. The adhesive film used for wafer fat edge removal as described in claim 1, wherein the preset cutting fixture refers to a laser module, a circular cutter or a hot melt cutting device, and the preset cutting fixture The adsorption fixture refers to a suction cup with vacuum adsorption force. The adhesive film used for wafer fat edge removal as described in claim 1, wherein the applicator knife and the nozzle have a straight appearance. A method for removing fat edges on wafers, including the following steps: (A) Provide a film roll with a flat application section between the discharge side and the take-up side, and a circular shape cut out by a preset cutting jig is formed in the application section a receiving hole, and the circular cutting waste material cut out by it is removed through a preset adsorption fixture; (B) Provide a wafer positioned on a working platform, driving the working platform up so that the wafer can be inserted into the accommodating hole of the film roll to form a position; (C) Drive a coating blade located above one edge of the wafer to move in a horizontal direction toward the other side of the wafer until the coating liquid of the coating blade completely covers the surface of the wafer and then stop, and stop when the coating liquid of the coating blade completely covers the surface of the wafer. An uncured coating layer is formed on the circular surface and the surface of the application section; (D) Driving a vacuum chamber cover to move from a preset position to position it above the wafer and the application section and then cover it downward on the work platform, and evacuate the inside of the chamber cover to form a vacuum In a quick-drying state, the uncured coating layer quickly forms a cured coating layer, and then the vacuum chamber cover is moved back to the preset position; and (E) Driving the work platform down to its original position, so that a coating waste remains on the surface of the application section, and the cured coating layer is retained on the surface of the wafer, so as to form a structure that greatly reduces the fat edge phenomenon on the surface of the wafer. The method for removing fat edges of wafers as described in claim 6, wherein the bottom side of the working platform is provided with a lifting push rod connected to a preset power device, so that the working platform has a lifting function, and the preset power The device refers to a pneumatic cylinder with air supply equipment, a hydraulic cylinder with oil supply equipment, or a motor, and the pneumatic cylinder, the hydraulic cylinder, or the motor is provided with a reciprocating telescopic push rod. The method for removing fat edges from wafers as described in claim 6, wherein the cured coating layer formed on the surface of the wafer refers to a photoresist layer or an insulating layer, and the material constituting the insulating layer is a polymer acyl imine. The method for removing fat edges from wafers as described in claim 6, wherein the preset cutting fixture refers to a laser module or a hot melt cutting device, and the preset adsorption fixture refers to a device with vacuum adsorption One of the forces is the sucker. The method for removing fat edges on wafers as described in claim 6, wherein the coating knife has a nozzle for a coating liquid to flow out, and the coating knife and the nozzle have a straight appearance.

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