JP6092729B2 - プローブカード及びその製造方法 - Google Patents

プローブカード及びその製造方法 Download PDF

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Publication number
JP6092729B2
JP6092729B2 JP2013150337A JP2013150337A JP6092729B2 JP 6092729 B2 JP6092729 B2 JP 6092729B2 JP 2013150337 A JP2013150337 A JP 2013150337A JP 2013150337 A JP2013150337 A JP 2013150337A JP 6092729 B2 JP6092729 B2 JP 6092729B2
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JP
Japan
Prior art keywords
bonding wire
contact terminal
connection pad
opening
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013150337A
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English (en)
Japanese (ja)
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JP2015021851A (ja
JP2015021851A5 (enExample
Inventor
亮 深澤
亮 深澤
堀内　道夫
道夫 堀内
徳武　安衛
安衛 徳武
勇一 松田
勇一 松田
光浩 相澤
光浩 相澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2013150337A priority Critical patent/JP6092729B2/ja
Priority to US14/327,745 priority patent/US9476913B2/en
Publication of JP2015021851A publication Critical patent/JP2015021851A/ja
Publication of JP2015021851A5 publication Critical patent/JP2015021851A5/ja
Application granted granted Critical
Publication of JP6092729B2 publication Critical patent/JP6092729B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2013150337A 2013-07-19 2013-07-19 プローブカード及びその製造方法 Active JP6092729B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013150337A JP6092729B2 (ja) 2013-07-19 2013-07-19 プローブカード及びその製造方法
US14/327,745 US9476913B2 (en) 2013-07-19 2014-07-10 Probe card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013150337A JP6092729B2 (ja) 2013-07-19 2013-07-19 プローブカード及びその製造方法

Publications (3)

Publication Number Publication Date
JP2015021851A JP2015021851A (ja) 2015-02-02
JP2015021851A5 JP2015021851A5 (enExample) 2016-05-12
JP6092729B2 true JP6092729B2 (ja) 2017-03-08

Family

ID=52343102

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013150337A Active JP6092729B2 (ja) 2013-07-19 2013-07-19 プローブカード及びその製造方法

Country Status (2)

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US (1) US9476913B2 (enExample)
JP (1) JP6092729B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6246507B2 (ja) * 2012-11-05 2017-12-13 新光電気工業株式会社 プローブカード及びその製造方法
JP6208486B2 (ja) * 2013-07-19 2017-10-04 新光電気工業株式会社 プローブカード及びその製造方法
KR101838875B1 (ko) * 2016-03-25 2018-03-15 주식회사 제다온 반도체 검사장치용 인터페이스 및 그 제조방법

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59154054A (ja) * 1983-02-23 1984-09-03 Hitachi Ltd ワイヤおよびそれを用いた半導体装置
WO1996016440A1 (en) * 1994-11-15 1996-05-30 Formfactor, Inc. Interconnection elements for microelectronic components
US5785538A (en) * 1995-11-27 1998-07-28 International Business Machines Corporation High density test probe with rigid surface structure
JP3307823B2 (ja) * 1996-02-23 2002-07-24 松下電器産業株式会社 電子部品検査用接触体の製造方法
JP3128199B2 (ja) * 1996-06-28 2001-01-29 信越ポリマー株式会社 検査用プローブ
US6100815A (en) * 1997-12-24 2000-08-08 Electro Scientific Industries, Inc. Compound switching matrix for probing and interconnecting devices under test to measurement equipment
JP2000150701A (ja) * 1998-11-05 2000-05-30 Shinko Electric Ind Co Ltd 半導体装置並びにこれに用いる接続用基板及びその製造方法
JP2000294311A (ja) 1999-04-12 2000-10-20 Shin Etsu Polymer Co Ltd 電気コネクタとその製造方法
US6791344B2 (en) * 2000-12-28 2004-09-14 International Business Machines Corporation System for and method of testing a microelectronic device using a dual probe technique
JP4014912B2 (ja) 2001-09-28 2007-11-28 株式会社ルネサステクノロジ 半導体装置
JP2005077322A (ja) * 2003-09-02 2005-03-24 Matsushita Electric Ind Co Ltd プローブカード
JP2005091065A (ja) * 2003-09-16 2005-04-07 Oki Electric Ind Co Ltd 半導体装置への動作電圧供給装置及び動作電圧供給方法
JP2005172603A (ja) * 2003-12-10 2005-06-30 Nidec-Read Corp 基板検査装置及びこれに用いられる接続治具の製造方法
US7119571B2 (en) * 2004-11-24 2006-10-10 Applied Materials, Inc. Test structure design for reliability test
US7030633B1 (en) * 2004-12-03 2006-04-18 Chunong Qiu Four-terminal methods for resistivity measurement of semiconducting materials
US7271606B1 (en) * 2005-08-04 2007-09-18 National Semiconductor Corporation Spring-based probe pin that allows kelvin testing
MY147251A (en) * 2006-05-23 2012-11-14 Integrated Technology Corp Probe needle protection method for high current probe testing of power devices
JP4774071B2 (ja) * 2007-04-05 2011-09-14 ルネサスエレクトロニクス株式会社 プローブ抵抗値測定方法、プローブ抵抗値測定用パッドを有する半導体装置
JP2009192309A (ja) * 2008-02-13 2009-08-27 Shinko Electric Ind Co Ltd 半導体検査装置
JP2011061112A (ja) * 2009-09-14 2011-03-24 Shinko Electric Ind Co Ltd 半導体チップ積層体及び製造方法
JP6246507B2 (ja) * 2012-11-05 2017-12-13 新光電気工業株式会社 プローブカード及びその製造方法
JP6208486B2 (ja) * 2013-07-19 2017-10-04 新光電気工業株式会社 プローブカード及びその製造方法
JP6189187B2 (ja) * 2013-11-19 2017-08-30 新光電気工業株式会社 プローブカード及びプローブカードの製造方法

Also Published As

Publication number Publication date
JP2015021851A (ja) 2015-02-02
US9476913B2 (en) 2016-10-25
US20150022230A1 (en) 2015-01-22

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