JP6088143B2 - バスバー - Google Patents
バスバー Download PDFInfo
- Publication number
- JP6088143B2 JP6088143B2 JP2012022864A JP2012022864A JP6088143B2 JP 6088143 B2 JP6088143 B2 JP 6088143B2 JP 2012022864 A JP2012022864 A JP 2012022864A JP 2012022864 A JP2012022864 A JP 2012022864A JP 6088143 B2 JP6088143 B2 JP 6088143B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- bus bar
- pin
- positioning pin
- base portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 210000000078 claw Anatomy 0.000 claims description 18
- 238000005476 soldering Methods 0.000 description 15
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G5/00—Installations of bus-bars
- H02G5/02—Open installations
- H02G5/025—Supporting structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/7017—Snap means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
Description
11 バスバーピン
12 ピン足部
13 連結部
14 垂直部
20 ベース部
25 支柱部
26 本体部
27 係合部
27a 段差部
28 爪部
30 位置決めピン
31 位置決めピン爪部
40 基板
42 ランド
45 凹部
46 位置決めピン穴
Claims (4)
- 回路基板に実装されるバスバーピンを備えるバスバーであって、
前記回路基板に沿って配置され、前記バスバーピンを支持するベース部と、
前記ベース部の両端部に形成され、前記回路基板を挟持して、前記バスバーピンを前記回路基板に固定する一組の支柱部と、を備え、
前記支柱部は、前記ベース部の両端側に結合された本体部と、前記本体部から延設され前記回路基板の両側面に係合する係合部と、前記本体部と前記係合部との間に形成され前記回路基板の表面に当接する段差部と、を備え、
前記係合部の先端には、前記回路基板の裏面に係止される爪部が形成され、
前記支柱部は、前記段差部と前記爪部とにより前記回路基板を板厚方向に把持し、
前記バスバーピンには、前記回路基板と平行な面をなす底部が形成されることを特徴とするバスバー。 - 前記回路基板の両側面には、凹部が形成され、
前記支柱部は、前記凹部に係合することを特徴とする請求項1に記載のバスバー。 - 前記ベース部には、前記支柱部の間に位置決めピンが形成され、
前記位置決めピンは、前記回路基板に穿設された位置決め穴に挿入されることを特徴とする請求項1又は2に記載のバスバー。 - 前記位置決めピンの先端部には前記回路基板の裏面に係止される位置決めピン爪部が形成されることを特徴とする請求項3に記載のバスバー。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012022864A JP6088143B2 (ja) | 2012-02-06 | 2012-02-06 | バスバー |
CN201380006193.5A CN104094680B (zh) | 2012-02-06 | 2013-01-15 | 汇流条 |
PCT/JP2013/050549 WO2013118540A1 (ja) | 2012-02-06 | 2013-01-15 | バスバー |
EP13746691.8A EP2814307A4 (en) | 2012-02-06 | 2013-01-15 | BUS-RAIL |
US14/372,847 US9425602B2 (en) | 2012-02-06 | 2013-01-15 | Busbar |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012022864A JP6088143B2 (ja) | 2012-02-06 | 2012-02-06 | バスバー |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013161949A JP2013161949A (ja) | 2013-08-19 |
JP6088143B2 true JP6088143B2 (ja) | 2017-03-01 |
Family
ID=48947309
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012022864A Active JP6088143B2 (ja) | 2012-02-06 | 2012-02-06 | バスバー |
Country Status (5)
Country | Link |
---|---|
US (1) | US9425602B2 (ja) |
EP (1) | EP2814307A4 (ja) |
JP (1) | JP6088143B2 (ja) |
CN (1) | CN104094680B (ja) |
WO (1) | WO2013118540A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110168904B (zh) * | 2016-12-22 | 2022-02-08 | 松下知识产权经营株式会社 | 汇流条单元以及电动机驱动装置 |
CN112009202A (zh) * | 2019-05-31 | 2020-12-01 | 法雷奥汽车空调湖北有限公司 | 加热装置 |
EP3761763A1 (en) * | 2019-07-03 | 2021-01-06 | Schaffner EMV AG | Filter with busbar assembly |
CN115207731A (zh) * | 2021-04-13 | 2022-10-18 | 泰科电子(上海)有限公司 | 汇流条子组件和电气组件 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5438Y2 (ja) * | 1972-09-20 | 1979-01-05 | ||
JPH10302914A (ja) * | 1997-04-25 | 1998-11-13 | Amp Japan Ltd | 電気コネクタ |
JP2000058165A (ja) * | 1998-08-03 | 2000-02-25 | Fujitsu Takamisawa Component Ltd | コネクタ |
TW511450B (en) * | 2001-08-16 | 2002-11-21 | Orient Semiconductor Elect Ltd | Heat dissipation plate with inlay pin and its assembly components |
JP2003079026A (ja) * | 2001-09-03 | 2003-03-14 | Sumitomo Wiring Syst Ltd | 電子制御ユニットのコネクタ搭載構造 |
CN1282402C (zh) * | 2003-01-02 | 2006-10-25 | 台达电子工业股份有限公司 | 电子元件与电路板的接合结构 |
JP4597659B2 (ja) * | 2004-12-24 | 2010-12-15 | 矢崎総業株式会社 | ジャンクションブロック |
JP2006310567A (ja) * | 2005-04-28 | 2006-11-09 | Sony Corp | リフローソルダリング用電子部品 |
JP4459913B2 (ja) * | 2006-02-13 | 2010-04-28 | 株式会社ケーヒン | コネクタの仮止め構造 |
CN100553035C (zh) * | 2006-10-30 | 2009-10-21 | 株式会社电装 | 具有汇流条组件及由焊接装在其上的电子部件的电子装置 |
JP4888359B2 (ja) * | 2007-02-23 | 2012-02-29 | 株式会社アドヴィックス | 電子制御ユニットおよびその製造方法 |
DE202007005013U1 (de) * | 2007-04-03 | 2008-08-07 | Weidmüller Interface GmbH & Co. KG | Leiterplattenverbinder |
US7857668B2 (en) * | 2008-04-11 | 2010-12-28 | Avx Corporation | Connector module for ruggedized applications |
JP5319979B2 (ja) * | 2008-07-28 | 2013-10-16 | 株式会社ケーヒン | バスバーを有する端子 |
JP5538019B2 (ja) * | 2010-03-25 | 2014-07-02 | 新電元工業株式会社 | コネクタユニット、及び、電子回路装置 |
JP2011254647A (ja) * | 2010-06-03 | 2011-12-15 | Sumitomo Wiring Syst Ltd | 電気接続箱 |
DE202010015731U1 (de) * | 2010-11-24 | 2011-01-20 | Wago Verwaltungsgesellschaft Mbh | Abstützvorrichtung für eine elektrische Reihenklemmenanordnung |
-
2012
- 2012-02-06 JP JP2012022864A patent/JP6088143B2/ja active Active
-
2013
- 2013-01-15 WO PCT/JP2013/050549 patent/WO2013118540A1/ja active Application Filing
- 2013-01-15 EP EP13746691.8A patent/EP2814307A4/en not_active Withdrawn
- 2013-01-15 US US14/372,847 patent/US9425602B2/en not_active Expired - Fee Related
- 2013-01-15 CN CN201380006193.5A patent/CN104094680B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP2814307A4 (en) | 2015-09-30 |
WO2013118540A1 (ja) | 2013-08-15 |
EP2814307A1 (en) | 2014-12-17 |
US9425602B2 (en) | 2016-08-23 |
US20140360750A1 (en) | 2014-12-11 |
CN104094680B (zh) | 2017-10-17 |
JP2013161949A (ja) | 2013-08-19 |
CN104094680A (zh) | 2014-10-08 |
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