JP6067846B2 - 濡れ性を良くする表面改質処理がなされた構造体及び印刷用孔版、これらを製造する方法 - Google Patents

濡れ性を良くする表面改質処理がなされた構造体及び印刷用孔版、これらを製造する方法 Download PDF

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Publication number
JP6067846B2
JP6067846B2 JP2015518248A JP2015518248A JP6067846B2 JP 6067846 B2 JP6067846 B2 JP 6067846B2 JP 2015518248 A JP2015518248 A JP 2015518248A JP 2015518248 A JP2015518248 A JP 2015518248A JP 6067846 B2 JP6067846 B2 JP 6067846B2
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Prior art keywords
printing
water
plasma
squeegee
oil
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English (en)
Japanese (ja)
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JPWO2014189026A1 (ja
Inventor
邦彦 澁澤
邦彦 澁澤
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TAIYO YUDEN CHEMICAL TECHNOLOGY CO., LTD.
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TAIYO YUDEN CHEMICAL TECHNOLOGY CO., LTD.
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/24—Stencils; Stencil materials; Carriers therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/24—Stencils; Stencil materials; Carriers therefor
    • B41N1/247—Meshes, gauzes, woven or similar screen materials; Preparation thereof, e.g. by plasma treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Textile Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Microelectronics & Electronic Packaging (AREA)
JP2015518248A 2013-05-20 2014-05-20 濡れ性を良くする表面改質処理がなされた構造体及び印刷用孔版、これらを製造する方法 Active JP6067846B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013106025 2013-05-20
JP2013106025 2013-05-20
PCT/JP2014/063282 WO2014189026A1 (ja) 2013-05-20 2014-05-20 濡れ性を良くする表面改質処理がなされた構造体及び印刷用孔版、これらを製造する方法

Related Child Applications (1)

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JP2016248372A Division JP6412547B2 (ja) 2013-05-20 2016-12-21 濡れ性を良くする表面改質処理がなされた構造体及び印刷用孔版、これらを製造する方法

Publications (2)

Publication Number Publication Date
JP6067846B2 true JP6067846B2 (ja) 2017-01-25
JPWO2014189026A1 JPWO2014189026A1 (ja) 2017-02-23

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JP2015518248A Active JP6067846B2 (ja) 2013-05-20 2014-05-20 濡れ性を良くする表面改質処理がなされた構造体及び印刷用孔版、これらを製造する方法
JP2016248372A Active JP6412547B2 (ja) 2013-05-20 2016-12-21 濡れ性を良くする表面改質処理がなされた構造体及び印刷用孔版、これらを製造する方法

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Country Status (7)

Country Link
US (1) US20160121636A1 (enExample)
EP (1) EP3000612A4 (enExample)
JP (2) JP6067846B2 (enExample)
KR (1) KR101776041B1 (enExample)
CN (1) CN105392635A (enExample)
TW (1) TW201510666A (enExample)
WO (1) WO2014189026A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017019279A (ja) * 2015-07-14 2017-01-26 太陽誘電ケミカルテクノロジー株式会社 撥水撥油性表面を有する構造体及びその製造方法
JP6872728B2 (ja) * 2016-06-27 2021-05-19 パナソニックＩｐマネジメント株式会社 金属メッシュの製造方法
US20180201010A1 (en) * 2017-01-18 2018-07-19 Microsoft Technology Licensing, Llc Screen printing liquid metal
CN110042649B (zh) * 2019-05-20 2020-08-04 江南大学 一种用于织物功能整理的大气压等离子体设备及其应用
DE102020122181A1 (de) 2020-08-25 2022-03-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Druckform zur Herstellung einer Struktur eines elektronischen Bauelementes, insbesondere einer photovoltaischen Solarzelle und Verfahren zur Herstellung solch einer Druckform
TW202231501A (zh) * 2020-12-25 2022-08-16 日商Ｎｂｃ紗網技術股份有限公司 絲網版
CN112768559A (zh) * 2021-01-06 2021-05-07 中国科学院上海高等研究院 太阳电池结构及基于丝网印刷制备太阳电池栅线的方法
CN118046661A (zh) * 2024-03-28 2024-05-17 嘉兴南博精密制造股份有限公司 一种基于等离子的印刷网版加工工艺
CN118700694B (zh) * 2024-08-29 2025-02-11 浙江微铸科技有限公司 一种柔性合金网版及其制作方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0220121A3 (en) * 1985-10-14 1987-07-01 Shin-Etsu Chemical Co., Ltd. A method for the preparation of a screen mesh for screen printing
JPH0580522A (ja) 1991-09-20 1993-04-02 Cmk Corp スクリーン印刷用のスクリーン版
JP3451762B2 (ja) * 1994-12-12 2003-09-29 旭硝子株式会社 水系インキ用スクリーン印刷版
TW387845B (en) * 1996-11-29 2000-04-21 Mitsubishi Plastics Inc Lithography film, lithography ink, and lithographic method and system using the film
JP4509295B2 (ja) * 2000-04-26 2010-07-21 リコーマイクロエレクトロニクス株式会社 印刷用マスク及びその製造方法
JP2007245708A (ja) * 2007-02-07 2007-09-27 Asada Mesh Co Ltd 金属メッシュ
JP2008192977A (ja) * 2007-02-07 2008-08-21 Pjt Kk プラズマ処理済み金属メッシュを用いたプラズマ処理済み転写基材への印刷方法及びその印刷装置
DE102007010936A1 (de) * 2007-03-07 2008-09-11 Biotronik Crm Patent Ag Siebdruckvorrichtung und Verfahren zur Herstellung derselben
JP5264427B2 (ja) * 2008-03-25 2013-08-14 富士フイルム株式会社 平版印刷版の作製方法
DE202008012829U1 (de) * 2008-09-26 2008-12-04 Nb Technologies Gmbh Siebdruckform
JP2011218673A (ja) * 2010-04-09 2011-11-04 Yasuo Kondo スクリーン印刷用メッシュ
CN102947103B (zh) * 2010-05-28 2015-03-25 太阳化学工业株式会社 具有非晶质炭膜的网版印刷用孔版及其制造方法
JP5802752B2 (ja) * 2011-07-01 2015-11-04 太陽誘電ケミカルテクノロジー株式会社 プライマー組成物、該組成物から成るプライマー層を含む構造体、及び該構造体の製造方法
EP2743092A4 (en) * 2011-08-10 2015-04-01 Taiyo Chemical Industry Co Ltd STRUCTURE WITH A PRIMER THIN FILM AND METHOD FOR THE PRODUCTION THEREOF
JPWO2014065207A1 (ja) * 2012-10-26 2016-09-08 太陽誘電ケミカルテクノロジー株式会社 メッシュ構造体及びその製造方法

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Publication number Publication date
JP2017077732A (ja) 2017-04-27
US20160121636A1 (en) 2016-05-05
WO2014189026A1 (ja) 2014-11-27
EP3000612A4 (en) 2017-03-08
KR20150135358A (ko) 2015-12-02
CN105392635A (zh) 2016-03-09
JPWO2014189026A1 (ja) 2017-02-23
TW201510666A (zh) 2015-03-16
JP6412547B2 (ja) 2018-10-24
EP3000612A1 (en) 2016-03-30
KR101776041B1 (ko) 2017-09-07

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