JP6053195B2 - ダイ実装システムのウエハマップ管理装置 - Google Patents
ダイ実装システムのウエハマップ管理装置 Download PDFInfo
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- JP6053195B2 JP6053195B2 JP2014512256A JP2014512256A JP6053195B2 JP 6053195 B2 JP6053195 B2 JP 6053195B2 JP 2014512256 A JP2014512256 A JP 2014512256A JP 2014512256 A JP2014512256 A JP 2014512256A JP 6053195 B2 JP6053195 B2 JP 6053195B2
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- 230000002950 deficient Effects 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 8
- 235000012431 wafers Nutrition 0.000 description 80
- 238000007689 inspection Methods 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Die Bonding (AREA)
Description
フライン)のウエハマップ作成装置で、画像処理エラーやピックアップミスにより取り残されたダイ位置のステータスを「良品ダイ」とした新たなウエハマップを作成し、この新たなウエハマップでダイ実装システムのサーバーのウエハマップのデータを更新するようにしている。
まず、図1を用いてダイピックアップ装置11の構成を概略的に説明する。
ット28全体が上下動するように構成されている。ダイピックアップ動作時には、突き上げユニット28が上昇して突き上げポット37の上面がウエハパレット32のダイシングシート34にほぼ接触する所定のシート吸着位置まで上昇すると、ストッパ機構(図示せず)によって突き上げユニット28の上昇が止まり、更に上昇動作を続けると、突き上げポット37の上面から突き上げピン39(図4、図5参照)が上方に突出して、ダイシングシート34のうちのピックアップしようとするダイ31の貼着部分を突き上げるようになっている。この場合、駆動源となるサーボモータの回転量を調整することで、突き上げピン39の突き上げ高さ位置(突き上げ量)を調整できるようになっている。
位置のステータスを「良品ダイ」に修正するウエハマップ修正機能を搭載すると共に、図8に示すように、表示装置54の画面に、ウエハマップの各ダイ位置のステータスを表示させて、該表示装置54の画面上で作業者がウエハマップの各ダイ位置のステータスを目視で確認しながら入力装置53を操作して「画像処理エラー」又は「ピックアップミス」のステータスを「良品ダイ」に修正できるようにしている。
もない。
Claims (3)
- 複数のダイに分割するようにダイシングされたウエハの各位置のダイの良否を示すウエハマップをダイ実装システムの記憶手段に記憶し、ダイ実装工程で前記ウエハマップを参照して、前記ウエハから良品ダイを順番にピックアップして基板に実装すると共に、良品ダイをピックアップする毎に、前記ウエハマップのうちのピックアップ済みのダイ位置のステータスを「良品ダイ」から「ピックアップ済み」に書き換える一方、画像処理エラー又はピックアップミスが発生したダイ位置のステータスを「良品ダイ」から「画像処理エラー」又は「ピックアップミス」に書き換えるダイ実装システムのウエハマップ管理装置において、
前記ダイ実装システムには、前記ウエハマップのうちの「画像処理エラー」又は「ピックアップミス」に書き換えられたダイ位置のステータスを「良品ダイ」に修正するウエハマップ修正手段が設けられていることを特徴とするダイ実装システムのウエハマップ管理装置。 - 前記ダイ実装システムには、前記ウエハマップの各ダイ位置のステータスを表示する表示装置が設けられ、
前記表示装置の画面上で作業者が前記ウエハマップの各ダイ位置のステータスを目視で確認しながら前記ウエハマップ修正手段を操作して「画像処理エラー」又は「ピックアップミス」のステータスを「良品ダイ」に修正できるように構成されていることを特徴とする請求項1に記載のダイ実装システムのウエハマップ管理装置。 - 前記ウエハマップ修正手段は、「画像処理エラー」又は「ピックアップミス」に書き換えられた複数のダイ位置のステータスを一括して「良品ダイ」に修正する一括修正機能を備えていることを特徴とする請求項1又は2に記載のダイ実装システムのウエハマップ管理装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2012/061394 WO2013161061A1 (ja) | 2012-04-27 | 2012-04-27 | ダイ実装システムのウエハマップ管理装置及びダイ実装方法 |
Publications (2)
Publication Number | Publication Date |
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JPWO2013161061A1 JPWO2013161061A1 (ja) | 2015-12-21 |
JP6053195B2 true JP6053195B2 (ja) | 2016-12-27 |
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JP2014512256A Active JP6053195B2 (ja) | 2012-04-27 | 2012-04-27 | ダイ実装システムのウエハマップ管理装置 |
Country Status (3)
Country | Link |
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JP (1) | JP6053195B2 (ja) |
CN (1) | CN104205289B (ja) |
WO (1) | WO2013161061A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6367672B2 (ja) * | 2014-09-29 | 2018-08-01 | ファスフォードテクノロジ株式会社 | 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法 |
US9633883B2 (en) | 2015-03-20 | 2017-04-25 | Rohinni, LLC | Apparatus for transfer of semiconductor devices |
JPWO2017085816A1 (ja) * | 2015-11-18 | 2018-09-13 | 株式会社Fuji | 部品供給システム |
US10504767B2 (en) | 2016-11-23 | 2019-12-10 | Rohinni, LLC | Direct transfer apparatus for a pattern array of semiconductor device die |
JP6739323B2 (ja) * | 2016-11-28 | 2020-08-12 | 株式会社Fuji | 吸着開始ダイ教示システム |
US11094571B2 (en) | 2018-09-28 | 2021-08-17 | Rohinni, LLC | Apparatus to increase transferspeed of semiconductor devices with micro-adjustment |
JP6621964B1 (ja) * | 2019-03-18 | 2019-12-18 | キヤノンマシナリー株式会社 | 半導体装置の組立システム、半導体装置の組立方法を用いた半導体装置の製造方法、及び半導体装置の組立プログラム |
DE102019118270B4 (de) * | 2019-07-05 | 2021-10-07 | X-Fab Semiconductor Foundries Gmbh | Verfahren zur Herstellung von Halbleiterbauelementen zur Ausbeutesteigerung beim Mikrotransferdruck |
JP6865316B2 (ja) * | 2020-04-24 | 2021-04-28 | 株式会社Fuji | 部品供給方法および部品供給システム |
KR102662236B1 (ko) * | 2021-03-08 | 2024-05-03 | 파스포드 테크놀로지 주식회사 | 다이 본딩 장치 및 반도체 장치의 제조 방법 |
CN113426714B (zh) * | 2021-06-23 | 2022-08-02 | 深圳新益昌科技股份有限公司 | 晶元搜索方法、装置、电子设备及计算机可读存储介质 |
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JP3030400B2 (ja) * | 1994-02-24 | 2000-04-10 | 株式会社三井ハイテック | 自動ダイボンディング方法 |
JP2000091403A (ja) * | 1998-09-14 | 2000-03-31 | Hitachi Ltd | ダイピックアップ方法およびそれを用いた半導体製造装置ならびに半導体装置の製造方法 |
JP2001209520A (ja) * | 2000-01-27 | 2001-08-03 | Yokogawa Electric Corp | 操作装置 |
JP2001250834A (ja) * | 2000-03-06 | 2001-09-14 | Hitachi Ltd | 半導体装置の製造方法 |
JP2004140084A (ja) * | 2002-10-16 | 2004-05-13 | Sharp Corp | 半導体チップのピックアップ方法およびそのピックアップ装置 |
JP4902838B2 (ja) * | 2005-05-27 | 2012-03-21 | 株式会社日立ハイテクインスツルメンツ | 電子部品ピックアップ装置及びテーピング装置 |
JP4606319B2 (ja) * | 2005-12-19 | 2011-01-05 | 日東電工株式会社 | 復旧支援装置 |
KR100716552B1 (ko) * | 2006-02-03 | 2007-05-09 | 삼성전자주식회사 | 다이 어태치 방법 |
KR101132141B1 (ko) * | 2006-03-03 | 2012-03-29 | 삼성테크윈 주식회사 | 다이 픽업위치 보정방법 |
JP5007137B2 (ja) * | 2007-03-29 | 2012-08-22 | 株式会社日立ハイテクインスツルメンツ | 電子部品ピックアップ装置及びテーピング装置 |
JP2009105151A (ja) * | 2007-10-22 | 2009-05-14 | Iwate Toshiba Electronics Co Ltd | 半導体テスト装置 |
JP2010206157A (ja) * | 2009-02-09 | 2010-09-16 | Toshiba Corp | 半導体チップのピックアップ方法 |
-
2012
- 2012-04-27 CN CN201280071970.XA patent/CN104205289B/zh active Active
- 2012-04-27 JP JP2014512256A patent/JP6053195B2/ja active Active
- 2012-04-27 WO PCT/JP2012/061394 patent/WO2013161061A1/ja active Application Filing
Also Published As
Publication number | Publication date |
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WO2013161061A1 (ja) | 2013-10-31 |
CN104205289A (zh) | 2014-12-10 |
JPWO2013161061A1 (ja) | 2015-12-21 |
CN104205289B (zh) | 2017-03-29 |
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