JP6002362B2 - 発光素子及びそれを用いたライトユニット - Google Patents
発光素子及びそれを用いたライトユニット Download PDFInfo
- Publication number
- JP6002362B2 JP6002362B2 JP2010283957A JP2010283957A JP6002362B2 JP 6002362 B2 JP6002362 B2 JP 6002362B2 JP 2010283957 A JP2010283957 A JP 2010283957A JP 2010283957 A JP2010283957 A JP 2010283957A JP 6002362 B2 JP6002362 B2 JP 6002362B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- inclined surface
- respect
- seating portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 claims description 20
- 230000017525 heat dissipation Effects 0.000 claims description 13
- 239000007769 metal material Substances 0.000 claims description 2
- 238000002955 isolation Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 26
- 238000009792 diffusion process Methods 0.000 description 17
- 239000011347 resin Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 15
- 238000000926 separation method Methods 0.000 description 10
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 238000005286 illumination Methods 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000003566 sealing material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 239000003086 colorant Substances 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000994 depressogenic effect Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000006089 photosensitive glass Substances 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Description
Claims (2)
- キャビティが形成された胴体と、
前記胴体に少なくとも一部が配置される第1及び第2電極と、
前記キャビティと対応する領域に形成され、前記キャビティ領域の水平面から突出し、間に隔離空間を有するように離隔して形成され、各々前記水平面に対して傾斜面を有する2つ以上の安着部が形成された、前記第1及び第2電極とは別の放熱部材と、
前記2つ以上の安着部の各々の傾斜面に実装されて前記第1及び第2電極に電気的に連結される発光ダイオードと、を含み、
前記放熱部材は、前記胴体のキャビティに締結され、前記胴体の背面に露出され、前記安着部に実装された前記発光ダイオードと熱的に連結され、
前記安着部と前記放熱部材は、金属材質で形成され、
前記安着部と前記放熱部材は、同一材質で形成され、
前記2つ以上の安着部は、前記放熱部材の水平面上で対角線方向に配列され、
前記安着部は、前記放熱部材の水平面に対して0゜以上30゜以下の傾斜度を有し、
前記安着部は、
前記放熱部材の垂直な中心線を基準にして左側に配置された第1安着部と、
前記中心線を基準にして右側に配置された第2安着部と、を含み、
前記第1安着部の傾斜面は、左側方向に形成され、
前記第2安着部の傾斜面は、右側方向に形成され、
前記放熱部材は、
前記中心線を基準にして前記第1安着部の左側に配置された第1傾斜面と、
前記中心線を基準にして前記第2安着部の右側に配置された第2傾斜面と、
前記中心線を基準にして前記第1傾斜面の左側に配置された第1垂直面と、
前記中心線を基準にして前記第2傾斜面の右側に配置された第2垂直面と、
前記中心線を基準にして前記第1傾斜面の左側に配置された第1水平面と、
前記中心線を基準にして前記第2傾斜面の右側に配置された第2水平面と、
前記中心線を基準にして前記第1水平面の左側に配置された第3垂直面と、
前記中心線を基準にして前記第2水平面の右側に配置された第4垂直面と、を含み、
前記第1傾斜面は、右側方向に形成され、
前記第2傾斜面は、左側方向に形成され、
前記第1傾斜面の傾斜度は、前記第2安着部の傾斜面の傾斜度よりも大きく、
前記第2傾斜面の傾斜度は、前記第1安着部の傾斜面の傾斜度よりも大きく、
前記第1垂直面乃至前記第4垂直面並びに前記第1水平面及び前記第2水平面は、前記胴体によって覆われ、
前記第1垂直面、前記第1水平面及び前記第3垂直面は、連続して配置され、
前記第2垂直面、前記第2水平面及び前記第4垂直面は、連続して配置され、
前記放熱部材の底面及び前記胴体の底面は、同一平面上に配置されている
ことを特徴とする発光素子。 - 前記発光ダイオードの上に形成されたレンズ部を含むことを特徴とする請求項1に記載の発光素子。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2009-0128529 | 2009-12-21 | ||
KR1020090128529A KR101081069B1 (ko) | 2009-12-21 | 2009-12-21 | 발광소자 및 그를 이용한 라이트 유닛 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011129932A JP2011129932A (ja) | 2011-06-30 |
JP6002362B2 true JP6002362B2 (ja) | 2016-10-05 |
Family
ID=43602833
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010283957A Active JP6002362B2 (ja) | 2009-12-21 | 2010-12-21 | 発光素子及びそれを用いたライトユニット |
Country Status (6)
Country | Link |
---|---|
US (1) | US9111777B2 (ja) |
EP (1) | EP2337072B1 (ja) |
JP (1) | JP6002362B2 (ja) |
KR (1) | KR101081069B1 (ja) |
CN (1) | CN102130105B (ja) |
TW (1) | TWI527988B (ja) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7821023B2 (en) | 2005-01-10 | 2010-10-26 | Cree, Inc. | Solid state lighting component |
US9793247B2 (en) | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US9335006B2 (en) | 2006-04-18 | 2016-05-10 | Cree, Inc. | Saturated yellow phosphor converted LED and blue converted red LED |
US10295147B2 (en) | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
US9425172B2 (en) | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
KR101072212B1 (ko) * | 2010-01-05 | 2011-10-10 | 엘지이노텍 주식회사 | 발광 소자 및 그 제조방법 |
US9786811B2 (en) * | 2011-02-04 | 2017-10-10 | Cree, Inc. | Tilted emission LED array |
KR101813495B1 (ko) | 2011-06-08 | 2017-12-29 | 엘지이노텍 주식회사 | 발광소자 패키지 |
US10842016B2 (en) | 2011-07-06 | 2020-11-17 | Cree, Inc. | Compact optically efficient solid state light source with integrated thermal management |
USD700584S1 (en) | 2011-07-06 | 2014-03-04 | Cree, Inc. | LED component |
JP5639543B2 (ja) * | 2011-07-26 | 2014-12-10 | 日立アプライアンス株式会社 | 照明装置 |
KR101886127B1 (ko) * | 2011-09-19 | 2018-08-07 | 엘지이노텍 주식회사 | 발광 모듈 및 이를 구비한 백라이트 유닛 |
CN103107246B (zh) * | 2011-11-10 | 2015-10-07 | 展晶科技(深圳)有限公司 | 发光二极管及其制造方法 |
CN103988326A (zh) * | 2011-12-07 | 2014-08-13 | 皇家飞利浦有限公司 | 光束整形发光模块 |
CN103187406A (zh) * | 2011-12-27 | 2013-07-03 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及封装方法 |
JP2013222499A (ja) * | 2012-04-12 | 2013-10-28 | Sharp Corp | 光源基板ユニット |
JP2014053506A (ja) * | 2012-09-07 | 2014-03-20 | Toshiba Corp | 半導体発光装置及び発光モジュール |
KR101431588B1 (ko) * | 2013-04-09 | 2014-08-29 | 주식회사 굿엘이디 | 고효율 cob led 패키지 |
CN104019403A (zh) * | 2014-05-23 | 2014-09-03 | 京东方光科技有限公司 | 发光二极管、背光模组、液晶显示器、照明装置 |
KR101650539B1 (ko) * | 2014-10-15 | 2016-08-26 | 장준구 | 다각도로 발광하는 led패키지 |
KR101697212B1 (ko) * | 2015-04-28 | 2017-02-01 | 동부라이텍 주식회사 | 조명장치 |
KR101764821B1 (ko) * | 2015-10-12 | 2017-08-04 | 동부라이텍 주식회사 | 조명장치 |
DE102016214340A1 (de) * | 2016-08-03 | 2018-02-08 | Osram Gmbh | LED-Modul |
EP3549412B1 (en) * | 2016-11-30 | 2022-10-05 | Tactotek Oy | Illumination structure and related method of manufacture |
CN107229093B (zh) * | 2017-06-30 | 2020-05-22 | 厦门天马微电子有限公司 | 侧光式背光模组及其光源和显示面板 |
WO2019102956A1 (ja) * | 2017-11-24 | 2019-05-31 | 京セラ株式会社 | 発光素子搭載用基板およびアレイ基板、ならびに発光装置 |
JP6705462B2 (ja) | 2018-01-30 | 2020-06-03 | 日亜化学工業株式会社 | 発光装置 |
CN108598122B (zh) * | 2018-04-28 | 2021-08-31 | 京东方科技集团股份有限公司 | 显示基板及其制作方法、显示装置 |
JP2020021823A (ja) * | 2018-07-31 | 2020-02-06 | 日亜化学工業株式会社 | 発光装置 |
JP7159335B2 (ja) * | 2018-10-04 | 2022-10-24 | 京セラ株式会社 | 電子部品搭載用基板、電気装置および発光装置 |
US10962829B1 (en) * | 2020-03-31 | 2021-03-30 | Chongqing Boe Optoelectronics Technology Co., Ltd. | Light bar, backlight module and display device |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5948581U (ja) * | 1982-09-22 | 1984-03-31 | 三洋電機株式会社 | 発光ダイオ−ド表示器 |
JP3704941B2 (ja) * | 1998-03-30 | 2005-10-12 | 日亜化学工業株式会社 | 発光装置 |
JP3495923B2 (ja) | 1998-09-09 | 2004-02-09 | シャープ株式会社 | 通信用光学素子組立体 |
US6682211B2 (en) * | 2001-09-28 | 2004-01-27 | Osram Sylvania Inc. | Replaceable LED lamp capsule |
US6991355B1 (en) * | 2004-06-16 | 2006-01-31 | Osram Sylvania Inc. | light emitting diode lamp with light pipes |
JP5122062B2 (ja) | 2004-09-22 | 2013-01-16 | 株式会社光波 | 発光装置 |
JP4815843B2 (ja) * | 2005-04-01 | 2011-11-16 | 日亜化学工業株式会社 | 発光装置 |
JP2009525614A (ja) * | 2006-01-31 | 2009-07-09 | スリーエム イノベイティブ プロパティズ カンパニー | コンプライアントなフォイル構造を有するled照明アセンブリ |
KR101308701B1 (ko) * | 2006-02-21 | 2013-09-13 | 삼성디스플레이 주식회사 | 점광원, 이를 갖는 광 출사 모듈 및 표시장치 |
JP5357379B2 (ja) | 2006-02-23 | 2013-12-04 | パナソニック株式会社 | 発光装置 |
KR100875443B1 (ko) * | 2006-03-31 | 2008-12-23 | 서울반도체 주식회사 | 발광 장치 |
KR100799864B1 (ko) | 2006-04-21 | 2008-01-31 | 삼성전기주식회사 | Led 패키지 |
JP4830768B2 (ja) * | 2006-05-10 | 2011-12-07 | 日亜化学工業株式会社 | 半導体発光装置及び半導体発光装置の製造方法 |
JP2008108942A (ja) | 2006-10-26 | 2008-05-08 | Iwasaki Electric Co Ltd | 光源装置 |
JP2008130909A (ja) | 2006-11-22 | 2008-06-05 | Matsushita Electric Works Ltd | 発光ダイオードを用いた光源 |
JP5200471B2 (ja) * | 2006-12-26 | 2013-06-05 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
TWI358003B (en) | 2007-02-07 | 2012-02-11 | Au Optronics Corp | Lighting device |
CN201066688Y (zh) * | 2007-05-11 | 2008-05-28 | 群康科技(深圳)有限公司 | 发光二极管及背光模组 |
TW200847469A (en) * | 2007-05-23 | 2008-12-01 | Tysun Inc | Substrates of curved surface for light emitting diodes |
JP2009004443A (ja) | 2007-06-19 | 2009-01-08 | Sharp Corp | Led発光装置、led表示装置、およびled発光装置の製造方法 |
KR100896282B1 (ko) | 2007-11-01 | 2009-05-08 | 엘지전자 주식회사 | 발광 소자 패키지 및 그 제조방법 |
TWI353053B (en) * | 2007-11-28 | 2011-11-21 | Ind Tech Res Inst | Lighting device |
JP2009177101A (ja) | 2008-01-28 | 2009-08-06 | Panasonic Electric Works Co Ltd | 発光装置 |
KR20090099785A (ko) | 2008-03-18 | 2009-09-23 | 엘지디스플레이 주식회사 | 발광 다이오드 패키지, 이를 구비한 백라이트 유닛 및액정표시장치 |
CN101566320B (zh) * | 2008-04-25 | 2011-12-28 | 富准精密工业(深圳)有限公司 | 发光二极管灯具 |
TWM355346U (en) | 2008-10-02 | 2009-04-21 | Rong-Seng Chang | Structural improvement of oblique LED light source |
KR101106176B1 (ko) | 2009-06-29 | 2012-01-20 | 서울반도체 주식회사 | 경사형 led 패키지 및 그것을 포함하는 백라이트 유닛 |
-
2009
- 2009-12-21 KR KR1020090128529A patent/KR101081069B1/ko active IP Right Grant
-
2010
- 2010-09-15 US US12/882,853 patent/US9111777B2/en active Active
- 2010-12-20 TW TW099144694A patent/TWI527988B/zh active
- 2010-12-20 EP EP10196014.4A patent/EP2337072B1/en active Active
- 2010-12-21 JP JP2010283957A patent/JP6002362B2/ja active Active
- 2010-12-21 CN CN201010602429.XA patent/CN102130105B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP2337072B1 (en) | 2019-10-30 |
US9111777B2 (en) | 2015-08-18 |
US20110149601A1 (en) | 2011-06-23 |
CN102130105B (zh) | 2016-08-24 |
EP2337072A3 (en) | 2015-11-11 |
TW201135126A (en) | 2011-10-16 |
JP2011129932A (ja) | 2011-06-30 |
TWI527988B (zh) | 2016-04-01 |
CN102130105A (zh) | 2011-07-20 |
KR101081069B1 (ko) | 2011-11-07 |
KR20110071853A (ko) | 2011-06-29 |
EP2337072A2 (en) | 2011-06-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6002362B2 (ja) | 発光素子及びそれを用いたライトユニット | |
KR101039881B1 (ko) | 발광소자 및 그를 이용한 라이트 유닛 | |
JP5797393B2 (ja) | 発光素子パッケージ | |
US8860072B2 (en) | Light emitting device and light unit having the same | |
KR20130133695A (ko) | 발광소자, 발광장치 및 장치 베이스 | |
TW201024598A (en) | Light emitting diode apparatus | |
JP6703312B2 (ja) | 発光モジュールおよび面発光光源 | |
JP2023120234A (ja) | 発光装置及びledパッケージ | |
KR20110108147A (ko) | 발광소자 패키지 및 이를 구비한 라이트 유닛 | |
KR100947440B1 (ko) | 지향각 변환 렌즈 및 그것을 포함하는 백라이트용 발광장치 | |
KR101047633B1 (ko) | 발광소자 및 이를 구비한 라이트 유닛 | |
EP2325908A2 (en) | Light emitting device package | |
KR20120053412A (ko) | Led 패키지 및 이를 포함하는 백라이트 유닛 | |
KR101125456B1 (ko) | 발광소자 및 그를 이용한 라이트 유닛 | |
JP2020123752A (ja) | 発光モジュールおよび面発光光源 | |
CN211125689U (zh) | 发光元件以及发光模块 | |
CN214956934U (zh) | 发光装置及包括其的发光模块 | |
KR101997240B1 (ko) | 조명 소자 | |
KR20110115320A (ko) | 발광소자 패키지, 그 제조방법 및 조명시스템 | |
KR102098848B1 (ko) | 발광소자 패키지 | |
KR101637590B1 (ko) | 발광 소자 패키지 및 조명 시스템 | |
KR20130072600A (ko) | 발광 소자 패키지 | |
KR20130014242A (ko) | 발광소자 패키지 및 조명 장치 | |
KR20120099549A (ko) | 발광 소자 패키지, 발광 소자 패키지 제조방법 및 조명 시스템 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20130730 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20131219 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140513 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140514 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140813 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140902 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141202 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20150127 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150527 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150708 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20150727 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20151002 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160513 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160905 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6002362 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |