JP5979648B2 - フリット密封システム及び方法 - Google Patents
フリット密封システム及び方法 Download PDFInfo
- Publication number
- JP5979648B2 JP5979648B2 JP2014020513A JP2014020513A JP5979648B2 JP 5979648 B2 JP5979648 B2 JP 5979648B2 JP 2014020513 A JP2014020513 A JP 2014020513A JP 2014020513 A JP2014020513 A JP 2014020513A JP 5979648 B2 JP5979648 B2 JP 5979648B2
- Authority
- JP
- Japan
- Prior art keywords
- frit
- laser
- laser beam
- substrate
- homogenizer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007789 sealing Methods 0.000 title claims description 59
- 238000000034 method Methods 0.000 title claims description 19
- 239000000758 substrate Substances 0.000 claims description 41
- 230000010355 oscillation Effects 0.000 claims description 25
- 239000013307 optical fiber Substances 0.000 claims description 18
- 230000003287 optical effect Effects 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 239000011521 glass Substances 0.000 description 14
- 230000008569 process Effects 0.000 description 10
- 239000000835 fiber Substances 0.000 description 9
- 230000008859 change Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 239000003230 hygroscopic agent Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/206—Laser sealing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
- H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Laser Beam Processing (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
図1は、本発明の第1実施形態に関するフリット密封システムを示す概略的な図面である。
図2は、図1のフリット密封システムのレーザー照射部材を概略的に示す図面である。
ビームファイバー125はレーザー発振装置123に接続され、レーザー発振装置123から伝送されるレーザービームをホモジナイザー127に伝送する。
図14は、本発明の第2実施形態に関するフリット密封システムを示す概略的な図面であり、図15は、図14の連結部材を詳細に示す図面である。
図15を参照すれば、連結部材231は、入力部231a、出力部231b、コリメートレンズ231c及びフォーカスレンズ231dを備える。
102 第2基板
103 フリット
110 ベッド部材
120 レーザー照射部材
Claims (4)
- フリットを利用して第1基板と第2基板とを接合するフリット密封システムにおいて、
バンドルタイプのマルチコアソースであるレーザー発振装置と、
前記レーザー発振装置からの複数のレーザービームを受け取る、多重モード光ファイバー、光パイプ、光導波路及びマイクロレンズのアレイの少なくとも一つを含むホモジナイザーと、
前記ホモジナイザーからのレーザービームを集光する集光レンズと、
を備え、
前記ホモジナイザーにおける複数の経路を経てプロファイルが均一化されたレーザービームを前記集光レンズで集光してビーム断面での強度が均一な一つの大きなビームを形成し、さらに一定程度デフォーカスして照射することにより、少なくとも、前記フリットで密封する前記第1及び第2基板上における密封部分の温度を均一に保持するようにするフリット密封システム。 - 前記レーザー発振装置で発振される前記レーザービームを前記ホモジナイザーに伝達する連結部材をさらに備える、請求項1に記載のフリット密封システム。
- 前記連結部材は、コリメートレンズ及びフォーカスレンズのうち少なくとも一つを備える、請求項2に記載のフリット密封システム。
- 第1基板上にフリットを塗布した後に焼成するステップと、
前記第1基板に第2基板を合わせるステップと、
前記第1基板に、請求項1〜3のいずれか1項記載のフリット密封システムから発生するレーザービームを照射することにより前記第1基板と第2基板とを前記フリットで密封するステップと
を含む、フリット密封方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0023926 | 2008-03-14 | ||
KR1020080023926A KR100937864B1 (ko) | 2008-03-14 | 2008-03-14 | 프릿 실링 시스템 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009042346A Division JP5721248B2 (ja) | 2008-03-14 | 2009-02-25 | フリット密封システム及び方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014133262A JP2014133262A (ja) | 2014-07-24 |
JP5979648B2 true JP5979648B2 (ja) | 2016-08-24 |
Family
ID=40749278
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009042346A Active JP5721248B2 (ja) | 2008-03-14 | 2009-02-25 | フリット密封システム及び方法 |
JP2014020513A Active JP5979648B2 (ja) | 2008-03-14 | 2014-02-05 | フリット密封システム及び方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009042346A Active JP5721248B2 (ja) | 2008-03-14 | 2009-02-25 | フリット密封システム及び方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8175124B2 (ja) |
EP (1) | EP2101366B1 (ja) |
JP (2) | JP5721248B2 (ja) |
KR (1) | KR100937864B1 (ja) |
CN (2) | CN101533790A (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101137394B1 (ko) * | 2010-07-05 | 2012-04-20 | 삼성모바일디스플레이주식회사 | 레이저 빔 조사 장치 및 상기 레이저 빔 조사 장치를 포함하는 기판 밀봉 장치 |
KR101134608B1 (ko) * | 2010-08-02 | 2012-04-09 | 주식회사 엘티에스 | 레이저를 이용한 프릿 밀봉 시스템 |
US9422189B2 (en) | 2011-02-11 | 2016-08-23 | Guardian Industries Corp. | Substrates or assemblies having directly laser-fused frits, and/or method of making the same |
US9487437B2 (en) | 2011-02-11 | 2016-11-08 | Guardian Industries Corp. | Substrates or assemblies having indirectly laser-fused frits, and/or method of making the same |
US9150449B2 (en) | 2011-06-24 | 2015-10-06 | Guardian Industries Corp. | Substrates or assemblies having two-color laser-fused frits, and/or method of making the same |
WO2013015414A1 (ja) * | 2011-07-27 | 2013-01-31 | 日本電気硝子株式会社 | 封着材料層付きガラス基板、これを用いた有機elデバイス、及び電子デバイスの製造方法 |
RU2635651C2 (ru) | 2012-04-17 | 2017-11-14 | Конинклейке Филипс Н.В. | Устройство облучения |
KR101398020B1 (ko) * | 2012-11-30 | 2014-05-30 | 주식회사 엘티에스 | 레이저를 이용한 프릿 실링장치 |
KR102034252B1 (ko) | 2012-12-21 | 2019-10-21 | 삼성디스플레이 주식회사 | 레이저 빔 조사 장치 및 기판 밀봉 방법 |
KR102015401B1 (ko) * | 2012-12-21 | 2019-08-29 | 삼성디스플레이 주식회사 | 광학계 및 기판 밀봉 방법 |
KR101427689B1 (ko) | 2013-05-22 | 2014-08-07 | 주식회사 엘티에스 | 곡면기판의 프릿 실링장치 및 방법 |
KR102107766B1 (ko) * | 2013-07-09 | 2020-05-27 | 삼성디스플레이 주식회사 | 밀봉장치 및 그를 이용한 표시장치의 제조방법 |
KR102117608B1 (ko) | 2013-08-14 | 2020-06-02 | 삼성디스플레이 주식회사 | 밀봉 장치, 밀봉 장치를 포함하는 기판 밀봉 장치 및 기판 밀봉 방법 |
CN104157795B (zh) | 2014-07-17 | 2016-09-14 | 京东方科技集团股份有限公司 | 激光封装的方法及显示面板的制备方法 |
KR20160017837A (ko) | 2014-08-06 | 2016-02-17 | 삼성디스플레이 주식회사 | 디스플레이 장치 제조방법 |
CN106997929A (zh) * | 2016-01-22 | 2017-08-01 | 上海微电子装备有限公司 | 一种双面激光准同步封装系统及封装方法 |
KR102588275B1 (ko) * | 2023-04-10 | 2023-10-12 | 지이티에스 주식회사 | 레이저를 이용한 프릿 실링 시스템 |
Family Cites Families (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55153327A (en) * | 1979-05-18 | 1980-11-29 | Nec Corp | Laser annealing device |
US4360372A (en) * | 1980-11-10 | 1982-11-23 | Northern Telecom Limited | Fiber optic element for reducing speckle noise |
US4932747A (en) * | 1989-09-07 | 1990-06-12 | The United States Of America As Represented By The Secretary Of The Navy | Fiber bundle homogenizer and method utilizing same |
JP2507222B2 (ja) * | 1992-03-27 | 1996-06-12 | 松下電器産業株式会社 | 多軸ビ―ムレ―ザ加工機 |
JPH07281053A (ja) * | 1994-04-11 | 1995-10-27 | Mitsui Petrochem Ind Ltd | ファイバ光結合装置 |
KR0163404B1 (ko) | 1995-11-23 | 1999-04-15 | 김유채 | 광섬유의 다차원 2중굽힘을 이용한 균일화레이저빔, 그 제조방법 및 그 제조장치 |
US6037710A (en) * | 1998-04-29 | 2000-03-14 | Candescent Technologies, Inc. | Microwave sealing of flat panel displays |
JPH1074583A (ja) | 1996-08-30 | 1998-03-17 | Sanyo Electric Co Ltd | 有機elディスプレイ及び有機elディスプレイの 製造方法 |
JP3939816B2 (ja) | 1997-06-30 | 2007-07-04 | 浜松ホトニクス株式会社 | レーザ装置 |
EP0889335B1 (en) | 1997-06-30 | 2009-06-03 | Hamamatsu Photonics K. K. | Fiber bundle and fiber laser apparatus using the fibre bundle |
DK1335829T3 (da) * | 2000-10-26 | 2011-12-05 | Neophotonics Corp | Optiske strukturer med flere lag |
JP4059623B2 (ja) * | 2000-12-15 | 2008-03-12 | 株式会社リコー | 照明装置、及び均一照明装置 |
JP2002328288A (ja) | 2001-04-26 | 2002-11-15 | Matsushita Electric Ind Co Ltd | 組レンズ調整方法とその装置 |
JP2003019588A (ja) | 2001-07-03 | 2003-01-21 | Hamamatsu Photonics Kk | レーザ溶接機、及び、レーザ溶接方法 |
DE10136611C1 (de) * | 2001-07-23 | 2002-11-21 | Jenoptik Laserdiode Gmbh | Optische Anordnung zur Formung und Homogenisierung eines von einer Laserdiodenanordnung ausgehenden Laserstrahls |
JP2003112281A (ja) | 2001-09-28 | 2003-04-15 | Matsushita Electric Ind Co Ltd | レーザ加工装置とこれを用いた生産設備 |
US6714581B2 (en) * | 2001-10-01 | 2004-03-30 | Christopher J. Corcoran | Compact phase locked laser array and related techniques |
JP2003112279A (ja) * | 2001-10-04 | 2003-04-15 | Hitachi Ltd | レーザ光照射装置 |
TW517356B (en) | 2001-10-09 | 2003-01-11 | Delta Optoelectronics Inc | Package structure of display device and its packaging method |
TWI272666B (en) * | 2002-01-28 | 2007-02-01 | Semiconductor Energy Lab | Semiconductor device and method of manufacturing the same |
JP2004093837A (ja) * | 2002-08-30 | 2004-03-25 | Sumitomo Heavy Ind Ltd | 均一化レーザビーム照射装置 |
US6998776B2 (en) * | 2003-04-16 | 2006-02-14 | Corning Incorporated | Glass package that is hermetically sealed with a frit and method of fabrication |
ITTO20030431A1 (it) | 2003-06-06 | 2004-12-07 | Bright Solutions Soluzioni Laser I Nnovative S R L | Apparato di saldatura laser a punti e relativo metodo. |
JP2005033007A (ja) * | 2003-07-14 | 2005-02-03 | Sumitomo Heavy Ind Ltd | レーザ光のエネルギ変動補正方法及び装置 |
US7245802B2 (en) * | 2003-08-04 | 2007-07-17 | Semiconductor Energy Laboratory Co., Ltd. | Beam homogenizer, laser irradiation apparatus and method for manufacturing semiconductor device |
US20050248270A1 (en) * | 2004-05-05 | 2005-11-10 | Eastman Kodak Company | Encapsulating OLED devices |
US7923306B2 (en) * | 2004-06-18 | 2011-04-12 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots |
CN101044530B (zh) * | 2004-07-02 | 2010-05-05 | 古河电气工业株式会社 | 光供电型传感系统 |
DE102004038310A1 (de) * | 2004-08-05 | 2006-02-23 | Kuka Schweissanlagen Gmbh | Lasereinrichtung und Betriebsverfahren |
JP4371369B2 (ja) | 2004-09-08 | 2009-11-25 | 新日本製鐵株式会社 | 圧延ロールの加工方法 |
US7387954B2 (en) * | 2004-10-04 | 2008-06-17 | Semiconductor Energy Laboratory Co., Ltd. | Beam homogenizer, laser irradiation apparatus, and method for manufacturing semiconductor device |
WO2006046768A1 (en) * | 2004-10-29 | 2006-05-04 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus and laser irradiation method |
JP2006185933A (ja) * | 2004-12-24 | 2006-07-13 | Advanced Lcd Technologies Development Center Co Ltd | レーザアニール方法およびレーザアニール装置 |
US7425166B2 (en) * | 2005-12-06 | 2008-09-16 | Corning Incorporated | Method of sealing glass substrates |
US7597603B2 (en) * | 2005-12-06 | 2009-10-06 | Corning Incorporated | Method of encapsulating a display element |
CN100585771C (zh) * | 2005-12-06 | 2010-01-27 | 康宁股份有限公司 | 包封显示元件的方法 |
KR100745345B1 (ko) | 2006-01-27 | 2007-08-02 | 삼성에스디아이 주식회사 | 레이저 조사 장치 및 이를 이용한 유기전계발광표시장치의 제조방법 |
KR100713987B1 (ko) * | 2006-02-20 | 2007-05-04 | 삼성에스디아이 주식회사 | 기판 밀착장치 및 이를 이용한 유기전계발광 표시장치의밀봉방법 |
JP4594256B2 (ja) | 2006-03-06 | 2010-12-08 | トヨタ自動車株式会社 | レーザ加工システムおよびレーザ加工方法 |
JP4698460B2 (ja) * | 2006-03-27 | 2011-06-08 | オムロンレーザーフロント株式会社 | レーザアニーリング装置 |
JP2007260694A (ja) | 2006-03-27 | 2007-10-11 | Sony Corp | レーザ加工装置、レーザ光学系、レーザ加工方法及びアクティブマトリクス基板の欠陥修正方法 |
US20070268950A1 (en) * | 2006-05-16 | 2007-11-22 | Spinelli Luis A | Low power Q-switched solid-state lasers |
US20080048556A1 (en) * | 2006-08-24 | 2008-02-28 | Stephan Lvovich Logunov | Method for hermetically sealing an OLED display |
-
2008
- 2008-03-14 KR KR1020080023926A patent/KR100937864B1/ko active IP Right Grant
- 2008-08-04 US US12/185,279 patent/US8175124B2/en active Active
-
2009
- 2009-02-25 JP JP2009042346A patent/JP5721248B2/ja active Active
- 2009-03-03 CN CN200910118698A patent/CN101533790A/zh active Pending
- 2009-03-03 CN CN201510458785.1A patent/CN105057885A/zh active Pending
- 2009-03-11 EP EP09250684.9A patent/EP2101366B1/en active Active
-
2014
- 2014-02-05 JP JP2014020513A patent/JP5979648B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
CN101533790A (zh) | 2009-09-16 |
JP5721248B2 (ja) | 2015-05-20 |
KR100937864B1 (ko) | 2010-01-21 |
CN105057885A (zh) | 2015-11-18 |
JP2009220180A (ja) | 2009-10-01 |
EP2101366B1 (en) | 2013-10-16 |
KR20090098496A (ko) | 2009-09-17 |
US8175124B2 (en) | 2012-05-08 |
JP2014133262A (ja) | 2014-07-24 |
US20090233513A1 (en) | 2009-09-17 |
EP2101366A1 (en) | 2009-09-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5979648B2 (ja) | フリット密封システム及び方法 | |
TWI529021B (zh) | 用於基板密封之雷射光束照射裝置及使用此雷射光束照射裝置製造有機發光顯示裝置之方法 | |
KR20140081509A (ko) | 레이저 빔 조사 장치 및 기판 밀봉 방법 | |
CN107923599A (zh) | 用于车辆头灯的照明设备 | |
JP5624143B2 (ja) | デバイスを封止するためのガラスパッケージ及びガラスパッケージを含むシステム | |
KR101134608B1 (ko) | 레이저를 이용한 프릿 밀봉 시스템 | |
KR101189526B1 (ko) | 레이저를 이용한 와이드 프릿 실링방법 | |
KR102015401B1 (ko) | 광학계 및 기판 밀봉 방법 | |
JP2001330763A (ja) | 集光部品並びにこれを用いた光源モジュール、レーザー装置及び光信号増幅装置 | |
JP2004145299A (ja) | 光学装置 | |
JP2011222581A (ja) | 集光装置の構造 | |
KR20140118554A (ko) | 광학계 및 기판 밀봉 방법 | |
JPH1117268A (ja) | 半導体レーザーアレイ装置 | |
JP2005196031A (ja) | 光ファイバーとその製造方法及び画像形成装置 | |
RU2714781C1 (ru) | Способ поперечной накачки рабочей среды лазера | |
KR101543605B1 (ko) | 레이저를 이용한 프릿 실링장치 | |
KR100873215B1 (ko) | 기판 어셈블리 실링 장치 및 방법 | |
JP2008116890A (ja) | 光ファイバへの紫外レーザ光入射装置 | |
JP5867850B2 (ja) | レーザ発光装置 | |
JP2015072335A (ja) | 集光装置の生産方法、集光装置、および光発電装置 | |
KR101035557B1 (ko) | 마이크로 콜리메이터의 제조 방법 | |
JP2005164665A (ja) | 発光モジュール | |
CN116423048A (zh) | 一种光电控焦激光焊接装置 | |
JPH02194580A (ja) | 発光装置およびその製造方法 | |
JP2007193026A (ja) | 光源装置およびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20150219 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150303 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150513 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20151104 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160119 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160628 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160719 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5979648 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |