JP4698460B2 - レーザアニーリング装置 - Google Patents
レーザアニーリング装置 Download PDFInfo
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- JP4698460B2 JP4698460B2 JP2006086712A JP2006086712A JP4698460B2 JP 4698460 B2 JP4698460 B2 JP 4698460B2 JP 2006086712 A JP2006086712 A JP 2006086712A JP 2006086712 A JP2006086712 A JP 2006086712A JP 4698460 B2 JP4698460 B2 JP 4698460B2
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- laser
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- optical fibers
- optical fiber
- laser beam
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- 238000005224 laser annealing Methods 0.000 title claims description 27
- 239000013307 optical fiber Substances 0.000 claims description 181
- 230000003287 optical effect Effects 0.000 claims description 85
- 230000010355 oscillation Effects 0.000 claims description 11
- 238000000137 annealing Methods 0.000 claims description 7
- 239000000835 fiber Substances 0.000 description 27
- 238000003384 imaging method Methods 0.000 description 27
- 239000000758 substrate Substances 0.000 description 26
- 229910021417 amorphous silicon Inorganic materials 0.000 description 22
- 238000007493 shaping process Methods 0.000 description 20
- 230000009467 reduction Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 7
- 229920005591 polysilicon Polymers 0.000 description 7
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 6
- 238000005086 pumping Methods 0.000 description 6
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 6
- 238000002425 crystallisation Methods 0.000 description 5
- 230000008025 crystallization Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 101100426900 Caenorhabditis elegans trd-1 gene Proteins 0.000 description 3
- 101000798086 Homo sapiens Triadin Proteins 0.000 description 3
- 102100032268 Triadin Human genes 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000000265 homogenisation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0732—Shaping the laser spot into a rectangular shape
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0911—Anamorphotic systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/0994—Fibers, light pipes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Electromagnetism (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Toxicology (AREA)
- Mechanical Engineering (AREA)
- Recrystallisation Techniques (AREA)
Description
2−1乃至2−m ; 部分反射ミラー
3 ; 全反射ミラー
4−1乃至4−n ; ファイバ結合レンズ
5−1乃至5−n ; 光ファイバ
6 ; 線状ビーム成形光学系
7−1乃至7−k ; 長尺側コリメートシリンドリカルレンズ
8 ; 短尺側コリメートシリンドリカルレンズ
9 ; 長尺側合成集光シリンドリカルレンズ
10 ; 板状光導波路
11 ; 長尺側コリメートシリンドリカルレンズ
12 ; 長尺側結像用シリンドリカルレンズ
13 ; 短尺側結像用シリンドリカルレンズ
14 ; 線状ビーム
15−1乃至15−n ; レーザ発振器
16 ; 2軸稼動ステージ
17 ; ステージ
18 ; アモルファスシリコン基板
19 ; ポリシリコン
101 ; 細径光ファイバ組
102 ; 中径光ファイバ組
103 ; 太径光ファイバ組
110 ; 合成レーザパルス強度分布
111 ; 細径光ファイバ組によるレーザパルス強度分布
112 ; 中径光ファイバ組によるレーザパルス強度分布
113 ; 太径光ファイバ組によるレーザパルス強度分布
201 ; レーザ発振器
202 ; 線状ビーム成形光学系
203 ; 2軸稼動ステージ
204 ; アモルファスシリコン基板
205 ; ポリシリコン
206 ; レーザビーム
207 ; 線状ビーム
208 ; ステージ
300 ; 光学系
301 ; レーザ発振器
302 ; シリンドリカルレンズアレイ
303 ; シリンドリカルレンズ
304 ; シリンドリカルレンズ
305 ; シリンドリカルレンズ
306 ; ミラー
307 ; シリンドリカルレンズ
308 ; スリット
309 ; 照射面
310 ; ステージ
311 ; 基板
400 ; レーザ発振器
401 ; マスターレーザ
402 ; ビームエキスパンダ
402a; レンズ
402b; レンズ
403 ; マイクロレンズアレイ
404−1乃至404−N; 光ファイバ増幅器
405−1乃至405−N; ファイバ結合型励起用レーザ光源
406−1乃至406−N; 励起光伝播用光ファイバ
407 ; 第3高調波発生装置
408 ; 照明光学系
414−1乃至414−N; 光ファイバカプラ
Claims (7)
- Qスイッチ動作のNd:YAGレーザ第2高調波の発振器と、前記発振器から出射されるレーザビームを複数本に分割する1又は複数個の部分反射ミラーと、前記部分反射ミラーによって分割された複数本のレーザビームを夫々伝送し、その各出射端が一方向に直線状に配列された複数本の光ファイバと、前記光ファイバから出射される複数本のレーザビームを合成し均質化する第1の光学系と、前記第1の光学系から出射されたレーザビームを被加工面上にビーム形状が横長縦短の矩形のレーザビームとして結像させる第2の光学系と、を有することを特徴とするレーザアニーリング装置。
- 前記光ファイバは、1又は複数本の光ファイバ毎に相互に異なる長さに設定されており、前記光ファイバの出射端にて出射レーザビームの光学的な伝播遅延量を異ならせ、レーザビーム波形を前記発振器から出射したときの波形と異ならせることを特徴とする請求項1に記載のレーザアニーリング装置。
- 前記発振器は複数個設けられ、前記光ファイバは1又は複数本毎に前記複数個の発振器に接続されており、各前記発振器から出射されるレーザビームのパルス発振タイミングを調整して前記光ファイバから出射されるレーザビームのパルス波形を時間的に異ならせることを特徴とする請求項2に記載のレーザアニーリング装置。
- 前記部分反射ミラーの反射率を相互に異ならせることにより、1又は複数本の光ファイバ毎に前記光ファイバに入射するレーザビームの強度を相互に異ならせることを特徴とする請求項2に記載のレーザアニーリング装置。
- 前記光ファイバのコア径は、1又は複数本の光ファイバ毎に異なり、前記第2の光学系により結像するレーザビームのビーム形状における短尺の縦方向のビーム強度分布を調整することを特徴とする請求項1乃至4のいずれか1項に記載のレーザアニーリング装置。
- 前記光ファイバの出射端を1又は複数本の光ファイバ毎に前記一方向に直交する方向にずらして配列し、前記第2の光学系により結像するビーム形状における短尺の縦方向にレーザビームのパルス波形をずらすことを特徴とする請求項1乃至4のいずれか1項に記載のレーザアニーリング装置。
- 1又は複数本の光ファイバ毎にコア径を異ならせることによって前記レーザビームの前記ビーム形状における短尺の縦方向のビーム強度分布を調整し、1又は複数本の光ファイバ毎に前記出射端を前記一方向に直交する方向にずらして配列することによって、前記ビーム形状における短尺の前記縦方向にレーザビームのパルス波形をずらすことを特徴とする請求項1乃至4のいずれか1項に記載のレーザアニーリング装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006086712A JP4698460B2 (ja) | 2006-03-27 | 2006-03-27 | レーザアニーリング装置 |
US11/691,131 US7519252B2 (en) | 2006-03-27 | 2007-03-26 | Laser annealing apparatus |
KR1020070029416A KR100825701B1 (ko) | 2006-03-27 | 2007-03-26 | 레이저 어닐링 장치 |
CN2007100897197A CN101047111B (zh) | 2006-03-27 | 2007-03-27 | 激光退火设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006086712A JP4698460B2 (ja) | 2006-03-27 | 2006-03-27 | レーザアニーリング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007266146A JP2007266146A (ja) | 2007-10-11 |
JP4698460B2 true JP4698460B2 (ja) | 2011-06-08 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006086712A Expired - Fee Related JP4698460B2 (ja) | 2006-03-27 | 2006-03-27 | レーザアニーリング装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7519252B2 (ja) |
JP (1) | JP4698460B2 (ja) |
KR (1) | KR100825701B1 (ja) |
CN (1) | CN101047111B (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100985913B1 (ko) * | 2007-11-27 | 2010-10-08 | 주식회사 엘티에스 | 레이저 스크라이빙 방법 |
US8674257B2 (en) | 2008-02-11 | 2014-03-18 | Applied Materials, Inc. | Automatic focus and emissivity measurements for a substrate system |
KR100937864B1 (ko) * | 2008-03-14 | 2010-01-21 | 삼성모바일디스플레이주식회사 | 프릿 실링 시스템 |
JP4863407B2 (ja) * | 2009-02-02 | 2012-01-25 | 株式会社日本製鋼所 | 半導体膜のレーザアニール方法 |
US8372667B2 (en) * | 2009-04-20 | 2013-02-12 | Applied Materials, Inc. | Fiber laser substrate processing |
JP4834790B1 (ja) * | 2011-01-25 | 2011-12-14 | 株式会社エタンデュ目白 | 光照射装置 |
JP5148730B2 (ja) * | 2011-05-18 | 2013-02-20 | 昭和オプトロニクス株式会社 | ファイバ転送レーザ光学系 |
KR101888089B1 (ko) * | 2011-09-29 | 2018-08-16 | 엘지디스플레이 주식회사 | 결정화방법 및 이를 이용한 박막 트랜지스터의 제조방법 |
JP5923765B2 (ja) * | 2011-10-07 | 2016-05-25 | 株式会社ブイ・テクノロジー | ガラス基板のレーザ加工装置 |
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US8785815B2 (en) | 2012-06-22 | 2014-07-22 | Applied Materials, Inc. | Aperture control of thermal processing radiation |
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US9343307B2 (en) | 2013-12-24 | 2016-05-17 | Ultratech, Inc. | Laser spike annealing using fiber lasers |
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US9698041B2 (en) | 2014-06-09 | 2017-07-04 | Applied Materials, Inc. | Substrate temperature control apparatus including optical fiber heating, substrate temperature control systems, electronic device processing systems, and methods |
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KR102163083B1 (ko) | 2014-07-02 | 2020-10-07 | 어플라이드 머티어리얼스, 인코포레이티드 | 홈 라우팅 광섬유 가열을 포함하는 온도 제어 장치, 기판 온도 제어 시스템들, 전자 디바이스 처리 시스템들 및 처리 방법들 |
KR102215750B1 (ko) | 2014-07-15 | 2021-02-17 | 삼성디스플레이 주식회사 | 레이저 어닐 장치 및 이를 이용한 레이저 어닐 방법 |
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KR101963510B1 (ko) * | 2017-09-14 | 2019-03-28 | 고려대학교 세종산학협력단 | 레이저 결정화 장치 및 그 방법 |
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Citations (4)
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JP2001156017A (ja) * | 1999-11-29 | 2001-06-08 | Semiconductor Energy Lab Co Ltd | レーザー装置及びレーザー光を用いた熱処理方法並びに半導体装置の作製方法 |
JP2002208748A (ja) * | 2001-01-11 | 2002-07-26 | Nec Corp | レーザ光の強度補正方法、レーザ光の強度補正機構及び該補正機構を備えた多分岐レーザ発振装置 |
JP2002280324A (ja) * | 2001-03-16 | 2002-09-27 | Sony Corp | レーザ装置 |
JP2003289052A (ja) * | 2002-03-28 | 2003-10-10 | Ishikawajima Harima Heavy Ind Co Ltd | 半導体の結晶化方法及びそれに用いるレーザ照射装置 |
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TW552645B (en) * | 2001-08-03 | 2003-09-11 | Semiconductor Energy Lab | Laser irradiating device, laser irradiating method and manufacturing method of semiconductor device |
JP5078205B2 (ja) | 2001-08-10 | 2012-11-21 | 株式会社半導体エネルギー研究所 | レーザ照射装置 |
JP2004105565A (ja) * | 2002-09-20 | 2004-04-08 | Topcon Corp | 眼科用光凝固装置 |
JP2004200497A (ja) | 2002-12-19 | 2004-07-15 | Sony Corp | 光照射装置及びレーザアニール装置 |
US7245802B2 (en) * | 2003-08-04 | 2007-07-17 | Semiconductor Energy Laboratory Co., Ltd. | Beam homogenizer, laser irradiation apparatus and method for manufacturing semiconductor device |
KR20060014003A (ko) * | 2004-08-09 | 2006-02-14 | 주식회사 엔앰시스 | 다중 레이저 빔 조사장치 |
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JP2001156017A (ja) * | 1999-11-29 | 2001-06-08 | Semiconductor Energy Lab Co Ltd | レーザー装置及びレーザー光を用いた熱処理方法並びに半導体装置の作製方法 |
JP2002208748A (ja) * | 2001-01-11 | 2002-07-26 | Nec Corp | レーザ光の強度補正方法、レーザ光の強度補正機構及び該補正機構を備えた多分岐レーザ発振装置 |
JP2002280324A (ja) * | 2001-03-16 | 2002-09-27 | Sony Corp | レーザ装置 |
JP2003289052A (ja) * | 2002-03-28 | 2003-10-10 | Ishikawajima Harima Heavy Ind Co Ltd | 半導体の結晶化方法及びそれに用いるレーザ照射装置 |
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CN101047111B (zh) | 2010-06-09 |
JP2007266146A (ja) | 2007-10-11 |
KR20070096958A (ko) | 2007-10-02 |
US20070237475A1 (en) | 2007-10-11 |
US7519252B2 (en) | 2009-04-14 |
CN101047111A (zh) | 2007-10-03 |
KR100825701B1 (ko) | 2008-04-29 |
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