CN101533790A - 熔结密封系统 - Google Patents
熔结密封系统 Download PDFInfo
- Publication number
- CN101533790A CN101533790A CN200910118698A CN200910118698A CN101533790A CN 101533790 A CN101533790 A CN 101533790A CN 200910118698 A CN200910118698 A CN 200910118698A CN 200910118698 A CN200910118698 A CN 200910118698A CN 101533790 A CN101533790 A CN 101533790A
- Authority
- CN
- China
- Prior art keywords
- laser beam
- substrate
- frit
- sealing system
- homogenizer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 71
- 239000000758 substrate Substances 0.000 claims abstract description 78
- 238000000034 method Methods 0.000 claims description 23
- 239000011521 glass Substances 0.000 claims description 18
- 239000000835 fiber Substances 0.000 claims description 16
- 238000005516 engineering process Methods 0.000 claims description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- 239000011368 organic material Substances 0.000 claims description 4
- 239000000428 dust Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000013307 optical fiber Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 7
- 239000010410 layer Substances 0.000 description 5
- 230000001276 controlling effect Effects 0.000 description 4
- 239000012044 organic layer Substances 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 241000282693 Cercopithecidae Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/206—Laser sealing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
- H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Laser Beam Processing (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (19)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510458785.1A CN105057885A (zh) | 2008-03-14 | 2009-03-03 | 熔结密封系统 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080023926A KR100937864B1 (ko) | 2008-03-14 | 2008-03-14 | 프릿 실링 시스템 |
KR1020080023926 | 2008-03-14 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510458785.1A Division CN105057885A (zh) | 2008-03-14 | 2009-03-03 | 熔结密封系统 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101533790A true CN101533790A (zh) | 2009-09-16 |
Family
ID=40749278
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910118698A Pending CN101533790A (zh) | 2008-03-14 | 2009-03-03 | 熔结密封系统 |
CN201510458785.1A Pending CN105057885A (zh) | 2008-03-14 | 2009-03-03 | 熔结密封系统 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510458785.1A Pending CN105057885A (zh) | 2008-03-14 | 2009-03-03 | 熔结密封系统 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8175124B2 (zh) |
EP (1) | EP2101366B1 (zh) |
JP (2) | JP5721248B2 (zh) |
KR (1) | KR100937864B1 (zh) |
CN (2) | CN101533790A (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI508807B (zh) * | 2012-11-30 | 2015-11-21 | Lts Co Ltd | 使用雷射的熔接密封裝置 |
WO2016008238A1 (zh) * | 2014-07-17 | 2016-01-21 | 京东方科技集团股份有限公司 | 激光封装的方法及显示面板的制备方法 |
US9511539B2 (en) | 2012-12-21 | 2016-12-06 | Samsung Display Co., Ltd. | Laser beam irradiation apparatus and substrate sealing method |
CN106997929A (zh) * | 2016-01-22 | 2017-08-01 | 上海微电子装备有限公司 | 一种双面激光准同步封装系统及封装方法 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101137394B1 (ko) * | 2010-07-05 | 2012-04-20 | 삼성모바일디스플레이주식회사 | 레이저 빔 조사 장치 및 상기 레이저 빔 조사 장치를 포함하는 기판 밀봉 장치 |
KR101134608B1 (ko) * | 2010-08-02 | 2012-04-09 | 주식회사 엘티에스 | 레이저를 이용한 프릿 밀봉 시스템 |
US9422189B2 (en) | 2011-02-11 | 2016-08-23 | Guardian Industries Corp. | Substrates or assemblies having directly laser-fused frits, and/or method of making the same |
US9487437B2 (en) | 2011-02-11 | 2016-11-08 | Guardian Industries Corp. | Substrates or assemblies having indirectly laser-fused frits, and/or method of making the same |
US9150449B2 (en) | 2011-06-24 | 2015-10-06 | Guardian Industries Corp. | Substrates or assemblies having two-color laser-fused frits, and/or method of making the same |
CN103459341B (zh) * | 2011-07-27 | 2016-05-11 | 日本电气硝子株式会社 | 带有封接材料层的玻璃基板、使用其的有机el器件、及电子器件的制造方法 |
WO2013156909A1 (en) | 2012-04-17 | 2013-10-24 | Koninklijke Philips N.V. | Lighting apparatus |
KR102015401B1 (ko) * | 2012-12-21 | 2019-08-29 | 삼성디스플레이 주식회사 | 광학계 및 기판 밀봉 방법 |
KR101427689B1 (ko) | 2013-05-22 | 2014-08-07 | 주식회사 엘티에스 | 곡면기판의 프릿 실링장치 및 방법 |
KR102107766B1 (ko) * | 2013-07-09 | 2020-05-27 | 삼성디스플레이 주식회사 | 밀봉장치 및 그를 이용한 표시장치의 제조방법 |
KR102117608B1 (ko) | 2013-08-14 | 2020-06-02 | 삼성디스플레이 주식회사 | 밀봉 장치, 밀봉 장치를 포함하는 기판 밀봉 장치 및 기판 밀봉 방법 |
KR20160017837A (ko) | 2014-08-06 | 2016-02-17 | 삼성디스플레이 주식회사 | 디스플레이 장치 제조방법 |
KR102588275B1 (ko) * | 2023-04-10 | 2023-10-12 | 지이티에스 주식회사 | 레이저를 이용한 프릿 실링 시스템 |
Family Cites Families (43)
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JPS55153327A (en) * | 1979-05-18 | 1980-11-29 | Nec Corp | Laser annealing device |
US4360372A (en) * | 1980-11-10 | 1982-11-23 | Northern Telecom Limited | Fiber optic element for reducing speckle noise |
US4932747A (en) * | 1989-09-07 | 1990-06-12 | The United States Of America As Represented By The Secretary Of The Navy | Fiber bundle homogenizer and method utilizing same |
JP2507222B2 (ja) * | 1992-03-27 | 1996-06-12 | 松下電器産業株式会社 | 多軸ビ―ムレ―ザ加工機 |
JPH07281053A (ja) * | 1994-04-11 | 1995-10-27 | Mitsui Petrochem Ind Ltd | ファイバ光結合装置 |
KR0163404B1 (ko) | 1995-11-23 | 1999-04-15 | 김유채 | 광섬유의 다차원 2중굽힘을 이용한 균일화레이저빔, 그 제조방법 및 그 제조장치 |
US6037710A (en) | 1998-04-29 | 2000-03-14 | Candescent Technologies, Inc. | Microwave sealing of flat panel displays |
JPH1074583A (ja) | 1996-08-30 | 1998-03-17 | Sanyo Electric Co Ltd | 有機elディスプレイ及び有機elディスプレイの 製造方法 |
EP0889335B1 (en) | 1997-06-30 | 2009-06-03 | Hamamatsu Photonics K. K. | Fiber bundle and fiber laser apparatus using the fibre bundle |
JP3939816B2 (ja) | 1997-06-30 | 2007-07-04 | 浜松ホトニクス株式会社 | レーザ装置 |
CA2427103A1 (en) * | 2000-10-26 | 2002-06-06 | Neophotonics Corporation | Multilayered optical structures |
JP4059623B2 (ja) * | 2000-12-15 | 2008-03-12 | 株式会社リコー | 照明装置、及び均一照明装置 |
JP2002328288A (ja) | 2001-04-26 | 2002-11-15 | Matsushita Electric Ind Co Ltd | 組レンズ調整方法とその装置 |
JP2003019588A (ja) | 2001-07-03 | 2003-01-21 | Hamamatsu Photonics Kk | レーザ溶接機、及び、レーザ溶接方法 |
DE10136611C1 (de) | 2001-07-23 | 2002-11-21 | Jenoptik Laserdiode Gmbh | Optische Anordnung zur Formung und Homogenisierung eines von einer Laserdiodenanordnung ausgehenden Laserstrahls |
JP2003112281A (ja) | 2001-09-28 | 2003-04-15 | Matsushita Electric Ind Co Ltd | レーザ加工装置とこれを用いた生産設備 |
US6714581B2 (en) * | 2001-10-01 | 2004-03-30 | Christopher J. Corcoran | Compact phase locked laser array and related techniques |
JP2003112279A (ja) * | 2001-10-04 | 2003-04-15 | Hitachi Ltd | レーザ光照射装置 |
TW517356B (en) | 2001-10-09 | 2003-01-11 | Delta Optoelectronics Inc | Package structure of display device and its packaging method |
TW200302511A (en) * | 2002-01-28 | 2003-08-01 | Semiconductor Energy Lab | Semiconductor device and method of manufacturing the same |
JP2004093837A (ja) * | 2002-08-30 | 2004-03-25 | Sumitomo Heavy Ind Ltd | 均一化レーザビーム照射装置 |
US6998776B2 (en) | 2003-04-16 | 2006-02-14 | Corning Incorporated | Glass package that is hermetically sealed with a frit and method of fabrication |
ITTO20030431A1 (it) | 2003-06-06 | 2004-12-07 | Bright Solutions Soluzioni Laser I Nnovative S R L | Apparato di saldatura laser a punti e relativo metodo. |
JP2005033007A (ja) * | 2003-07-14 | 2005-02-03 | Sumitomo Heavy Ind Ltd | レーザ光のエネルギ変動補正方法及び装置 |
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US20050248270A1 (en) * | 2004-05-05 | 2005-11-10 | Eastman Kodak Company | Encapsulating OLED devices |
US7425471B2 (en) * | 2004-06-18 | 2008-09-16 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset |
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JP2006185933A (ja) * | 2004-12-24 | 2006-07-13 | Advanced Lcd Technologies Development Center Co Ltd | レーザアニール方法およびレーザアニール装置 |
CN100585771C (zh) * | 2005-12-06 | 2010-01-27 | 康宁股份有限公司 | 包封显示元件的方法 |
US7425166B2 (en) * | 2005-12-06 | 2008-09-16 | Corning Incorporated | Method of sealing glass substrates |
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KR100745345B1 (ko) | 2006-01-27 | 2007-08-02 | 삼성에스디아이 주식회사 | 레이저 조사 장치 및 이를 이용한 유기전계발광표시장치의 제조방법 |
KR100713987B1 (ko) * | 2006-02-20 | 2007-05-04 | 삼성에스디아이 주식회사 | 기판 밀착장치 및 이를 이용한 유기전계발광 표시장치의밀봉방법 |
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JP4698460B2 (ja) * | 2006-03-27 | 2011-06-08 | オムロンレーザーフロント株式会社 | レーザアニーリング装置 |
JP2007260694A (ja) | 2006-03-27 | 2007-10-11 | Sony Corp | レーザ加工装置、レーザ光学系、レーザ加工方法及びアクティブマトリクス基板の欠陥修正方法 |
US20070268950A1 (en) * | 2006-05-16 | 2007-11-22 | Spinelli Luis A | Low power Q-switched solid-state lasers |
US20080048556A1 (en) * | 2006-08-24 | 2008-02-28 | Stephan Lvovich Logunov | Method for hermetically sealing an OLED display |
-
2008
- 2008-03-14 KR KR1020080023926A patent/KR100937864B1/ko active IP Right Grant
- 2008-08-04 US US12/185,279 patent/US8175124B2/en active Active
-
2009
- 2009-02-25 JP JP2009042346A patent/JP5721248B2/ja active Active
- 2009-03-03 CN CN200910118698A patent/CN101533790A/zh active Pending
- 2009-03-03 CN CN201510458785.1A patent/CN105057885A/zh active Pending
- 2009-03-11 EP EP09250684.9A patent/EP2101366B1/en active Active
-
2014
- 2014-02-05 JP JP2014020513A patent/JP5979648B2/ja active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI508807B (zh) * | 2012-11-30 | 2015-11-21 | Lts Co Ltd | 使用雷射的熔接密封裝置 |
US9511539B2 (en) | 2012-12-21 | 2016-12-06 | Samsung Display Co., Ltd. | Laser beam irradiation apparatus and substrate sealing method |
CN103878497B (zh) * | 2012-12-21 | 2017-07-07 | 三星显示有限公司 | 激光束照射设备和基板密封方法 |
WO2016008238A1 (zh) * | 2014-07-17 | 2016-01-21 | 京东方科技集团股份有限公司 | 激光封装的方法及显示面板的制备方法 |
US10205119B2 (en) | 2014-07-17 | 2019-02-12 | Boe Technology Group Co., Ltd. | Laser packaging method and manufacturing method of display panel |
CN106997929A (zh) * | 2016-01-22 | 2017-08-01 | 上海微电子装备有限公司 | 一种双面激光准同步封装系统及封装方法 |
Also Published As
Publication number | Publication date |
---|---|
US20090233513A1 (en) | 2009-09-17 |
EP2101366A1 (en) | 2009-09-16 |
CN105057885A (zh) | 2015-11-18 |
JP5721248B2 (ja) | 2015-05-20 |
KR100937864B1 (ko) | 2010-01-21 |
US8175124B2 (en) | 2012-05-08 |
JP2009220180A (ja) | 2009-10-01 |
JP2014133262A (ja) | 2014-07-24 |
KR20090098496A (ko) | 2009-09-17 |
JP5979648B2 (ja) | 2016-08-24 |
EP2101366B1 (en) | 2013-10-16 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG DISPLAY CO., LTD. Free format text: FORMER OWNER: SAMSUNG MOBILE DISPLAY CO., LTD. Effective date: 20120928 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20120928 Address after: Gyeonggi Do, South Korea Applicant after: Samsung Display Co., Ltd. Address before: Gyeonggi Do, South Korea Applicant before: Samsung Mobile Display Co., Ltd. |
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Application publication date: 20090916 |