JP5968621B2 - ナノ構造体ベースの加熱装置およびその使用方法 - Google Patents
ナノ構造体ベースの加熱装置およびその使用方法 Download PDFInfo
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- JP5968621B2 JP5968621B2 JP2011508689A JP2011508689A JP5968621B2 JP 5968621 B2 JP5968621 B2 JP 5968621B2 JP 2011508689 A JP2011508689 A JP 2011508689A JP 2011508689 A JP2011508689 A JP 2011508689A JP 5968621 B2 JP5968621 B2 JP 5968621B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/145—Carbon only, e.g. carbon black, graphite
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/04—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/146—Conductive polymers, e.g. polyethylene, thermoplastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/34—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/54—Heating elements having the shape of rods or tubes flexible
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/007—Heaters using a particular layout for the resistive material or resistive elements using multiple electrically connected resistive elements or resistive zones
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2214/00—Aspects relating to resistive heating, induction heating and heating using microwaves, covered by groups H05B3/00, H05B6/00
- H05B2214/04—Heating means manufactured by using nanotechnology
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- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
図6Aを参照して、米国特許出願11/488,387(参照することにより本明細書に取り込まれる)と同様のナノチューブを製造するのに用いるシステム10を示す。1つ実施形態において、システム10は、合成チャンバ11と結合されてもよい。合成チャンバ11は、概して、内部に反応ガス(すなわち、ガス状のカーボン源)を供給できる入口端部111と、ナノチューブ113の延長された長さの部分の合成が起こり得る加熱ゾーン(hot zone)112と、反応生成物(主にナノチューブと排ガス)を排出および捕集できる出口端部114とを含む。合成チャンバ11は、1つの実施形態では、炉116を通って延在する石英管115を含んでよい。システム10により形成されたナノチューブは、一方、個別の単層ナノチューブ、このようなナノチューブの束および/または撚り合わされた単層ナノチューブ(すなわち、ナノチューブのロープ)であってよい。
図7を参照して、本発明の1つの実施形態に従った加熱器20を示す。加熱器20は、伝導性ナノ構造体ベースの材料から作った伝導部材21を含む。伝導性ナノ構造体ベースの材料は、1つの実施形態において、例えば、上述したようなカーボンナノチューブなどの不織布ナノ構造材料でできたシートから作ってよい。このようなシートを、必要に応じて、伝導部材21を提供するように、ストリップに切断してよい。当然ながら、伝導部材21は、上述したように、ワイヤ、糸、リボンなどのような、カーボンナノチューブ材料から織った織布ナノ構造材料であってもよい。別の実施形態において、伝導部材21を、炭素、銅、銀、窒化ホウ素、ホウ素、MoS2、またはこれらの組み合わせの1つから作ってよい。伝導部材21を作ることができる材料は、1つの実施形態において、例えば、熱分解炭素被膜黒鉛(pyrograph)ファイバ由来のもののような、任意の種類の黒鉛を含んでもよい。1つの実施形態において、加熱器20を、二層カーボンナノチューブの不織布シートまたはストリップから製造してよい。
抵抗を減少させ、それによって、本発明のナノチューブのシートまたは糸の熱伝導性を増加させるための方策は、ナノチューブ成長過程の間に、微量の外来原子(即ちドーピング)を導入することを含む。このようなアプローチは、1つの実施形態において、当該技術分野において利用可能な既知の任意の手順を採用することができ、かつ本発明の成長プロセスに組み込まれることができる。
加熱する必要のある任意の装置、構造体および構成要素を加熱するために、コネクタ部22に電流を流した場合、加熱器20は、加熱機構として作用することができる。加熱器20を、上述した実施形態のいずれかにおいて、その場で用いることができる、即ち、加熱器は、装置内部に組み込まれていてよい。言い換えると、加熱器20を結合、接着、係合、または別の方法で一体化させ、装置内部に組み込んでもよい、あるいは製造の間に、装置内部に組み込んでよい。加熱器20を、装置の外側表面または内側表面に、当該技術分野において既知の任意の手段によって、結合、接着、係合、または他の方法で接続させてもよい。このような装置は、例えば金属、金属合金、黒鉛エポキシ、複合材などの、加熱できる任意の材料であってよい。
加熱器20を、不織布カーボンナノチューブシートから製造した。矩形ストリップおよび放物線状の輪郭を有するストリップを、加熱器として試験した。ストリップの端部を、ニッケル、次に銅によって電気めっきした。電気めっきは、電気入力のための低い抵抗の接点を形成した。
組み込み加熱器の試験は、空気中にて加熱器ストリップの試験のために用いたセットアップと非常に類似していた。電気を、大電力(40V、25A)のDC電源によって供給し、電流を、直列の電流計で測定し、ならびに電圧を、電気入力部に取り付けた電圧計で測定した。温度を、再びWahl社のHSI3000の熱カメラで測定した。材料の放射率を、K型熱電対を用いることによって測定した。温度プロファイルを、定常状態に到達した後まで一定の時間の割合で、PCにデータ記録した。複合材/加熱器構造体を、底部に取り付けたクランプによって空気中にて垂直に保持した。
CNT加熱器ストリップを複合構造体の中に組み込むように、幾つかの異なる技術を試した。CNT加熱器ストリップ材料とCycom 997/黒鉛 エポキシとの複合構造体を、180℃および50p.s.i.にて熱間プレスで作った。プリプレグの単層を、CNT材料の単層と結合させた。結果は、エポキシのCNT材料内への浸透および2つの材料間の良好な付着を示す。
CNT加熱器を作り、複合材料の層間に組み込んだ。組み込み加熱器を、180℃および50p.s.i.にて、熱間プレスで硬化させた。図13は、IM7ファイバ複合材から作った組み込み加熱器の温度分布を示しており、加熱器は4層複合材(または4−ply複合材)の間にあり、かつ0.3W/cm2の入力電力を受容する。層1と層2との間に位置しているCNT加熱ストリップにより加熱するように、4層の0℃〜90℃のIM7複合材を実験した。従って、結合材料としてプリプレグを用いる別の手法は、複合材とCNT加熱ストリップとの間に、黒鉛複合材および絶縁層を用いることであってよい。
別の手法では、組み込み加熱器は、エポキシおよび絶縁システムを用いて、CNT加熱器を8層複合材(または8−ply複合材)と結合させ、かつ電気的に絶縁させた。これら実験のために用いたエポキシは、EPON862であり、かつ硬化剤としてEPIKURE Wを100:24の割合で混合したものであった。次に、エポキシをアセトンで1:1に希釈して、粘性をより低くし、適用を平易にした。複合材を、50p.s.i.、177℃にて3時間の熱間プレスまたは177℃で3時間の真空バッグのいずれかで硬化させた。2つの硬化手順の間に違いは見られなかった。
CNT加熱器の大電力能力を実証するために、実施例5と同じ加熱器を、112Wで加熱した。これは、8.4W/cm2の電力密度を有する。電流入力および電圧入力は、それぞれ7.5Aおよび14.9Vであった。この大電力においてさえも、漏電は見られなかった。これらの条件下で、サンプルの裏側の中心部は、15秒未満で100℃に達した。この温度は、約80秒で225℃に達した。このシステムにおける唯一の冷却は、自然対流であった。
電気貫通通路とCNTストリップの双方を複合材から絶縁する、電気絶縁システムを提供した。使用したセパレータは、短絡を避けるのに十分な電気抵抗を有すると同時に、熱の移動を可能にするように高い熱伝導性を有した。絶縁体として、0.004インチの紙および0.001インチのポリアミドのセパレータの使用は、首尾よく実証された。適切な絶縁を確実に達成するように、第1分離サンプルをクリップで留めて(with clips)試験した。比較的大きな電流(例えば3Aよりも大きい)にて、小さな局所的な黒鉛加熱は、取り付け箇所にて起こり得た。これは、黒鉛と絶縁されていないクリップの裏側に起因しうる。双方のセパレータを、EPON862エポキシを用いて複合材に取り付け、CNTストリップを同じエポキシを用いて頂部に取り付けた。黒鉛の熱的特性と比較すると、双方の材料のセパレータの熱抵抗は、無視できるほどであるように思われる。
Claims (18)
- カーボンナノチューブのマトリクスから作られ、かつ2つの対向する表面と2つの対向する端部を有する、熱伝導部材と、
前記熱伝導部材が熱を発生するのを可能にするように、外部電源からの電流を受容することができる、前記2つの対向する端部の一方に実質的に均一に堆積させた第1のコネクタ部および前記2つの対向する端部の他方に実質的に均一に堆積させた第2のコネクタ部であって、電気および熱の伝送の効率を高めかつ接触抵抗を減少させるように、伝導性に積極的に関与しうる前記熱伝導部材内のカーボンナノチューブの数を、実質的に最大化し、前記熱伝導部材の前記2つの対向する表面のうちの同じ面に堆積させた第1のコネクタ部および第2のコネクタ部と、
前記第1のコネクタ部および前記第2のコネクタ部に、前記熱伝導部材との接触表面領域にわたって実質的に均質な接触を提供するように、前記第1のコネクタ部および前記第2のコネクタ部に付随し、かつ前記熱伝導部材の前記同じ面に位置し、前記カーボンナノチューブ間の空隙に浸透し、前記カーボンナノチューブのマトリクスと常套の熱および/または電気回路システムとの間での効率的な伝導を可能にする、ガラス状炭素の連結機構と、
を有して成る加熱装置。 - 前記熱伝導部材の加熱ゾーンの拡張を可能にするように、前記熱伝導部材と結合した熱伝導本体部を更に含む、請求項1に記載の加熱装置。
- 前記熱伝導本体部が、炭素黒鉛の織布シート、カーボンナノチューブの織布シート、黒鉛エポキシ材料、他の複合材料、またはこれらの組み合わせの1つから作られている、請求項2に記載の加熱装置。
- 前記熱伝導本体部が、炭素黒鉛の不織布シート、カーボンナノチューブの不織布シート、黒鉛エポキシ材料、他の複合材料、またはこれらの組み合わせの1つから作られている、請求項2に記載の加熱装置。
- 前記熱伝導本体部が、金属、金属合金、他の任意の熱伝導材料またはこれらの組み合わせの1つから作られている、請求項2に記載の加熱装置。
- 前記熱伝導部材全体に組み込まれ、分散している樹脂材料を更に含む、請求項1に記載の加熱装置。
- 前記装置からの漏電を最小限にするように、前記熱伝導部材と前記熱伝導本体部との間に絶縁構成要素を更に含む、請求項2に記載の加熱装置。
- 前記加熱装置が、他の装置、構造体または構成要素と連結するように構成されて、これに熱を提供する、請求項1に記載の加熱装置。
- 前記加熱装置が、装置、構造体または構成要素の内部に組み込まれるように構成されて、これに熱を提供する、請求項1に記載の加熱装置。
- 前記加熱装置が、人工衛星、人工衛星ハウジング、他の人工衛星部品もしくは構成要素、燃料ライン、ロケット、宇宙船、航空機、自動車、電池、モーター、または加熱する必要のある他の任意の構造体もしくは構成要素の1つを含む、装置、構造体または構成要素と連結する、あるいは内部に組み込まれるように構成されている、請求項1に記載の加熱装置。
- 構造体、装置または構成要素の除氷に関連して使用するための、請求項10に記載の加熱装置。
- 1)カーボンナノチューブのマトリクスから作られ、かつ2つの対向する表面と2つの対向する端部を有する、熱伝導部材と、2)前記熱伝導部材が熱を発生するのを可能にするように、外部電源からの電流を受容することができる、前記2つの対向する端部の一方に実質的に均一に堆積させた第1のコネクタ部および前記2つの対向する端部の他方に実質的に均一に堆積させた第2のコネクタ部であって、電気および熱の伝送の効率を高めかつ接触抵抗を減少させるように、伝導性に積極的に関与しうる前記熱伝導部材内のカーボンナノチューブの数を、実質的に最大化し、前記熱伝導部材の前記2つの対向する表面のうちの同じ面に堆積させた第1のコネクタ部および第2のコネクタ部と、3)前記第1のコネクタ部および前記第2のコネクタ部に、前記熱伝導部材との接触表面領域にわたって実質的に均質な接触を提供するように、前記第1のコネクタ部および前記第2のコネクタ部に付随し、かつ前記熱伝導部材の前記同じ面に位置し、前記カーボンナノチューブ間の空隙に浸透し、前記カーボンナノチューブのマトリクスと常套の熱および/または電気回路システムとの間での効率的な伝導を可能にする、ガラス状炭素の連結機構とを有する加熱器を提供することと、
前記加熱器を、加熱する必要のある装置、構造体または構成要素に取り付けることと、
前記熱伝導部材が熱を発生するのを可能にするように、前記加熱器に電流を導くことと、
所望のレベルまで前記装置、構造体または構成要素を加熱すること
を含む方法。 - 加熱の間、装置、構造体または構成要素の熱膨張に適応するように、加熱器の前記熱伝導部材を拡張させることを更に含む、請求項12の方法。
- 加熱器を取り付けることが、加熱器を、装置、構造体または構成要素の内側表面に連結させることを含む、請求項12に記載の方法。
- 加熱器を取り付けることが、加熱器を、装置、構造体または構成要素の外側表面に連結させることを含む、請求項12に記載の方法。
- 加熱器を取り付けることが、加熱器を、装置、構造体または構成要素の中に組み込むことを含む、請求項12に記載の方法。
- 加熱器に電流を導くことが、電源を加熱器のコネクタ部に接続することを含む、請求項12に記載の方法。
- 装置、構造体または構成要素を加熱することが、装置、構造体または構成要素を除氷することを含む、請求項12に記載の方法。
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2009
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- 2009-05-07 JP JP2011508689A patent/JP5968621B2/ja active Active
- 2009-05-07 WO PCT/US2009/043212 patent/WO2009137725A1/en active Application Filing
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EP2279522A1 (en) | 2011-02-02 |
US9198232B2 (en) | 2015-11-24 |
CA2723619A1 (en) | 2009-11-12 |
US20090277897A1 (en) | 2009-11-12 |
EP2279522A4 (en) | 2013-11-20 |
EP2279522B1 (en) | 2017-01-25 |
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JP2015181102A (ja) | 2015-10-15 |
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