JP5473148B2 - 導電性が改善された透明導電性フィルム及びその製造方法 - Google Patents
導電性が改善された透明導電性フィルム及びその製造方法 Download PDFInfo
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- JP5473148B2 JP5473148B2 JP2010533967A JP2010533967A JP5473148B2 JP 5473148 B2 JP5473148 B2 JP 5473148B2 JP 2010533967 A JP2010533967 A JP 2010533967A JP 2010533967 A JP2010533967 A JP 2010533967A JP 5473148 B2 JP5473148 B2 JP 5473148B2
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- OGQYPPBGSLZBEG-UHFFFAOYSA-N dimethyl(dioctadecyl)azanium Chemical group CCCCCCCCCCCCCCCCCC[N+](C)(C)CCCCCCCCCCCCCCCCCC OGQYPPBGSLZBEG-UHFFFAOYSA-N 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
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- 238000007654 immersion Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
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- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
- C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C09D127/18—Homopolymers or copolymers of tetrafluoroethene
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- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
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- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
- H01L29/0673—Nanowires or nanotubes oriented parallel to a substrate
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K2201/003—Additives being defined by their diameter
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Description
本発明の他の実施形態は、添付の図面を参照して以下説明する。
また、カーボンナノチューブ220はナノサイズ(形状)であるため、表面積が大きく形成されている。
次に、本発明の実施例を詳細に説明し、カーボンナノチューブ複合体組成物の酸処理が、透明性を維持する一方で、透明導電性フィルムに優れた電気伝導度及び密着特性をもたらすことを示す。
1)カーボンナノチューブ:アーク放電方法で製造された単層カーボンナノチューブ(SAP:純度60〜70%)を用いた。カーボンナノチューブの長さは約20μmであり、厚さは約1.4nmである。
透明導電性フィルムの電気伝導度は、電極を形成するためにフィルム上の四隅を金でコーティングし、その表面抵抗を4点プローブ法(4point−probe)を用いてΩ/cm2の単位で測定した。
透明導電性フィルムの透過率は、紫外/可視分光光度計を用いて波長550nmで測定し、用いたベース基板又はガラスの透過率を100として換算した。
透明導電性フィルムの接着力は、透明電極がその上に形成されたPETフィルムにスコッチテープを貼り、一定時間後に剥がして、剥がしたスコッチテープに高分子バインダーまたはカーボンナノチューブが付着しているかどうかを判断した。
実施例1〜8
単層CNTを、水、及びSDSまたは界面活性剤を用いて調製した溶媒中に分散させた後、超音波分散法を用いて均一の分散溶液を調製した。CNTとSDSとは比率は1:1で存在し、溶液中にそれぞれ0.1wt%の濃度で分散させた。
単層CNTを、水及びイソプロピルアルコールの40:60混合溶液に分散させ、イオン伝導性高分子であるナフィオン(登録商標)とカーボンナノチューブとを1:1の比率で混合した。そして、溶媒中にそれぞれ0.1wt%の濃度になるように分散させた。
Claims (15)
- 溶媒にカーボンナノチューブならびに界面活性剤および高分子バインダーのいずれか一つを混合してカーボンナノチューブ複合体組成物を調製する段階と、
前記カーボンナノチューブ複合体組成物でベース基板上を被覆してカーボンナノチューブ複合体フィルムを形成する段階と、
前記カーボンナノチューブ複合体フィルムを酸溶液中に浸漬させ、カーボンナノチューブ複合体フィルムを蒸溜水で洗浄し、前記洗浄したカーボンナノチューブ複合体フィルムを乾燥する、前記ベース基板上に透明電極を形成するための、酸処理する段階と、
を有し、
前記高分子バインダーは、イオン伝導性又はイオン交換特性を有する樹脂を含み、前記樹脂は、フッ素原子を含み、かつ、カルボキシル、スルホニル、ホスホニル及びスルホンイミドから選択された少なくとも1つの官能基を含む、
透明導電性フィルムの製造方法。 - 前記溶媒は、水:イソプロピルアルコールが20:80〜80:20の体積比(vol%)である混合溶液であることを特徴とする請求項1に記載の透明導電性フィルムの製造方法。
- 前記カーボンナノチューブ複合体組成物は、前記溶媒100重量部に対して界面活性剤0.01〜2重量部、カーボンナノチューブ0.01〜2重量部を含むことを特徴とする請求項2に記載の透明導電性フィルムの製造方法。
- 前記界面活性剤は、ドデシル硫酸ナトリウム(SDS)又はドデシルベンゼンスルホン酸ナトリウム(NaDDBS)であることを特徴とする請求項1〜3のいずれか一項に記載の透明導電性フィルムの製造方法。
- 前記カーボンナノチューブ複合体組成物は、前記溶媒100重量部に対して高分子バインダー0.05〜1重量部、カーボンナノチューブ0.05〜1重量部を含むことを特徴とする請求項1〜4のいずれか一項に記載の透明導電性フィルムの製造方法。
- 前記高分子バインダーと前記カーボンナノチューブは、1:5〜5:1で混合されることを特徴とする請求項5に記載の透明導電性フィルムの製造方法。
- 前記カーボンナノチューブ複合体組成物は、スプレイ法又はインクジェット法により前記ベース基板上を被覆することを特徴とする請求項1〜6のいずれか一項に記載の透明導電性フィルムの製造方法。
- 前記ベース基板は、ポリエステル系、ポリカーボネート系、ポリエーテルスルホン系、及びアクリル系高分子から選択される高分子フィルムであることを特徴とする請求項1〜7のいずれか一項に記載の透明導電性フィルムの製造方法。
- 前記ベース基板は、ガラス基板であることを特徴とする請求項1〜7のいずれか一項に記載の透明導電性フィルムの製造方法。
- 前記酸処理に用いられる前記酸溶液は、pHの範囲が−1〜3であることを特徴とする請求項1〜9のいずれか一項に記載の透明導電性フィルムの製造方法。
- 前記酸溶液は、過塩素酸、硝酸、塩酸、硫酸及びこれらの混合物からなる群より選択された一種を含むことを特徴とする請求項1〜10のいずれか一項に記載の透明導電性フィルムの製造方法。
- 前記カーボンナノチューブ複合体フィルムは、前記酸溶液に30分〜5時間浸漬させることを特徴とする請求項1〜11のいずれか一項に記載の透明導電性フィルムの製造方法。
- 請求項1〜12のいずれか一項に記載の透明導電性フィルムの製造方法により、ベース基板上のカーボンナノチューブで形成された透明電極を含むことを特徴とする透明導電性フィルム。
- 前記透明電極は、紫外/可視分光光度計を用いて、550nmの波長で測定した透過率が80%以上であることを特徴とする請求項13に記載の透明導電性フィルム。
- 前記透明電極は、4点プローブ法(4point−probe)法を用いて測定した表面抵抗が1000Ω/cm2以下であることを特徴とする請求項14に記載の透明導電性フィルム。
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