JP5953368B2 - 大きな粒子径を有する多結晶材料を製造するための装置及び方法 - Google Patents
大きな粒子径を有する多結晶材料を製造するための装置及び方法 Download PDFInfo
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- JP5953368B2 JP5953368B2 JP2014509339A JP2014509339A JP5953368B2 JP 5953368 B2 JP5953368 B2 JP 5953368B2 JP 2014509339 A JP2014509339 A JP 2014509339A JP 2014509339 A JP2014509339 A JP 2014509339A JP 5953368 B2 JP5953368 B2 JP 5953368B2
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- crucible
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- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000000463 material Substances 0.000 title description 18
- 239000002245 particle Substances 0.000 title description 15
- 239000013078 crystal Substances 0.000 claims description 59
- 239000011800 void material Substances 0.000 claims description 40
- 239000002826 coolant Substances 0.000 claims description 36
- 239000002994 raw material Substances 0.000 claims description 33
- 239000007787 solid Substances 0.000 claims description 21
- 239000002178 crystalline material Substances 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 12
- 238000009413 insulation Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 15
- 229910052710 silicon Inorganic materials 0.000 description 15
- 239000010703 silicon Substances 0.000 description 15
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
- 229910002804 graphite Inorganic materials 0.000 description 8
- 239000010439 graphite Substances 0.000 description 8
- 229910052581 Si3N4 Inorganic materials 0.000 description 7
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 7
- 229910010271 silicon carbide Inorganic materials 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 7
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 238000012733 comparative method Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000011819 refractory material Substances 0.000 description 2
- 239000011343 solid material Substances 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- HMDDXIMCDZRSNE-UHFFFAOYSA-N [C].[Si] Chemical compound [C].[Si] HMDDXIMCDZRSNE-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
- C30B11/002—Crucibles or containers for supporting the melt
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
- C30B11/003—Heating or cooling of the melt or the crystallised material
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B35/00—Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Silicon Compounds (AREA)
Description
本出願は、2011年5月2日に出願された米国特許出願第13/098,989号の利益を主張し、その開示内容全体を参照により明示的に本明細書に組み込むものである。
Claims (5)
- 断熱材に囲まれた高温帯と、
前記高温帯内のるつぼ支持ブロックに隣接するるつぼ枠であって、前記るつぼ支持ブロックと熱的に接触している底板を有するるつぼ枠と、
前記るつぼ枠の底板と熱的に接触している底を有する前記るつぼ枠内に収められたるつぼ
を備える、結晶成長装置であって、
前記るつぼ支持ブロック、前記るつぼ枠の底板、又は前記るつぼ支持ブロックと前記るつぼ枠の底板の両方が、冷却剤を内部に有する少なくとも1つの空隙を備え、前記少なくとも1つの空隙はるつぼ枠の底板の中心又はるつぼの底の中心に隣接し、
前記空隙は入口及び出口を含み、これによって冷却剤は空隙に入り、空隙内を循環して、るつぼ枠の底板又はるつぼの底に直接熱的に接触し、空隙を出ることができる、
結晶成長装置。 - 前記るつぼ支持ブロックが、前記少なくとも1つの空隙を備える、請求項1に記載の結晶成長装置。
- 前記るつぼ枠の底板が、前記少なくとも1つの空隙を備える、請求項1に記載の結晶成長装置。
- 前記るつぼの底が、前記るつぼ枠の底板と接触している少なくとも1つの空隙を備え、前記るつぼ枠の底板と接触している前記少なくとも1つの空隙が、冷却剤を内部に循環させるように構成された、請求項1に記載の結晶成長装置。
- 結晶材料を製造する方法であって、
i)結晶成長装置の高温帯内のるつぼ支持ブロック上のるつぼ枠に含まれるるつぼを設置するステップであって、前記るつぼ枠が、前記るつぼ支持ブロックと熱的に接触している底板を有し、前記るつぼが、固体の原料を含み、前記るつぼ枠の底板と熱的に接触している底を有しているステップと、
ii)前記るつぼ内の前記固体の原料を加熱して、液状の原料溶融体を生成するステップと、
iii)前記るつぼ支持ブロック、前記るつぼ枠の底板、又は前記るつぼ支持ブロックと前記るつぼ枠の底板の両方の内部の少なくとも1つの空隙に少なくとも1種類の冷却剤を循環させるステップであって、前記少なくとも1つの空隙はるつぼ枠の底板の中心又はるつぼの底の中心に隣接し、前記冷却剤は入口から空隙に入り、空隙内を循環して、るつぼ枠の底板又はるつぼの底に直接熱的に接触し、出口から空隙を出るステップと、
iv)前記高温帯から熱を除去して、前記結晶材料を生成するステップと
を備える、方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/098,989 | 2011-05-02 | ||
US13/098,989 US20120280429A1 (en) | 2011-05-02 | 2011-05-02 | Apparatus and method for producing a multicrystalline material having large grain sizes |
PCT/US2012/035803 WO2012151155A2 (en) | 2011-05-02 | 2012-04-30 | Apparatus and method for producing a multicrystalline material having large grain sizes |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014521577A JP2014521577A (ja) | 2014-08-28 |
JP2014521577A5 JP2014521577A5 (ja) | 2015-04-30 |
JP5953368B2 true JP5953368B2 (ja) | 2016-07-20 |
Family
ID=47089731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014509339A Expired - Fee Related JP5953368B2 (ja) | 2011-05-02 | 2012-04-30 | 大きな粒子径を有する多結晶材料を製造するための装置及び方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20120280429A1 (ja) |
EP (1) | EP2705177A4 (ja) |
JP (1) | JP5953368B2 (ja) |
KR (1) | KR20140044809A (ja) |
CN (1) | CN103703169A (ja) |
TW (1) | TWI547603B (ja) |
WO (1) | WO2012151155A2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI441962B (zh) * | 2011-10-14 | 2014-06-21 | Sino American Silicon Prod Inc | 矽晶鑄錠及其製造方法(一) |
CN103184516B (zh) * | 2013-03-25 | 2015-07-01 | 湖南红太阳光电科技有限公司 | 一种降低阴影和硬质点的多晶硅铸锭热场结构及方法 |
CN103233264A (zh) * | 2013-05-03 | 2013-08-07 | 江苏海翔化工有限公司 | 避免直拉法石英坩埚渗硅的硅料融化加热工艺 |
CN103469293B (zh) * | 2013-09-02 | 2015-10-28 | 湖南红太阳光电科技有限公司 | 一种多晶硅的制备方法 |
US10415151B1 (en) | 2014-03-27 | 2019-09-17 | Varian Semiconductor Equipment Associates, Inc | Apparatus for controlling heat flow within a silicon melt |
US10658222B2 (en) | 2015-01-16 | 2020-05-19 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
KR102477163B1 (ko) * | 2018-02-23 | 2022-12-14 | 오씨아이 주식회사 | 결정 성장 장치 및 그 구동 방법 |
US11127572B2 (en) | 2018-08-07 | 2021-09-21 | Silfex, Inc. | L-shaped plasma confinement ring for plasma chambers |
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JPH09100199A (ja) * | 1995-10-02 | 1997-04-15 | Kyocera Corp | ルチル単結晶の製造方法 |
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JPH11310496A (ja) * | 1998-02-25 | 1999-11-09 | Mitsubishi Materials Corp | 一方向凝固組織を有するシリコンインゴットの製造方法およびその製造装置 |
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TWI265198B (en) * | 2002-12-02 | 2006-11-01 | Univ Nat Taiwan | The method and equipments for controlling the solidification of alloys in induction melting using cold crucible |
JP2005162507A (ja) * | 2003-11-28 | 2005-06-23 | Sharp Corp | 多結晶半導体インゴット製造装置、多結晶半導体インゴットの製造方法および多結晶半導体インゴット |
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-
2011
- 2011-05-02 US US13/098,989 patent/US20120280429A1/en not_active Abandoned
-
2012
- 2012-04-30 EP EP12779465.9A patent/EP2705177A4/en not_active Withdrawn
- 2012-04-30 WO PCT/US2012/035803 patent/WO2012151155A2/en active Application Filing
- 2012-04-30 JP JP2014509339A patent/JP5953368B2/ja not_active Expired - Fee Related
- 2012-04-30 CN CN201280032882.9A patent/CN103703169A/zh active Pending
- 2012-04-30 KR KR1020137031928A patent/KR20140044809A/ko not_active Application Discontinuation
- 2012-05-02 TW TW101115531A patent/TWI547603B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP2705177A4 (en) | 2014-10-01 |
TWI547603B (zh) | 2016-09-01 |
JP2014521577A (ja) | 2014-08-28 |
TW201311949A (zh) | 2013-03-16 |
WO2012151155A3 (en) | 2013-03-21 |
US20120280429A1 (en) | 2012-11-08 |
WO2012151155A2 (en) | 2012-11-08 |
EP2705177A2 (en) | 2014-03-12 |
CN103703169A (zh) | 2014-04-02 |
KR20140044809A (ko) | 2014-04-15 |
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