JP5949941B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5949941B2 JP5949941B2 JP2014550154A JP2014550154A JP5949941B2 JP 5949941 B2 JP5949941 B2 JP 5949941B2 JP 2014550154 A JP2014550154 A JP 2014550154A JP 2014550154 A JP2014550154 A JP 2014550154A JP 5949941 B2 JP5949941 B2 JP 5949941B2
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- 239000004065 semiconductor Substances 0.000 title claims description 80
- 229910052751 metal Inorganic materials 0.000 claims description 60
- 239000002184 metal Substances 0.000 claims description 60
- 230000004888 barrier function Effects 0.000 claims description 46
- 230000005684 electric field Effects 0.000 claims description 40
- 239000011229 interlayer Substances 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 34
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 17
- 229920005591 polysilicon Polymers 0.000 claims description 17
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000002344 surface layer Substances 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 3
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 claims description 2
- 239000010408 film Substances 0.000 description 131
- 229910000838 Al alloy Inorganic materials 0.000 description 12
- 239000010410 layer Substances 0.000 description 11
- 238000000059 patterning Methods 0.000 description 8
- 238000009826 distribution Methods 0.000 description 7
- 238000001312 dry etching Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000001965 increasing effect Effects 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 229910018125 Al-Si Inorganic materials 0.000 description 4
- 229910018520 Al—Si Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000001039 wet etching Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910021364 Al-Si alloy Inorganic materials 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
- H01L29/404—Multiple field plate structures
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/408—Electrodes ; Multistep manufacturing processes therefor with an insulating layer with a particular dielectric or electrostatic property, e.g. with static charges or for controlling trapped charges or moving ions, or with a plate acting on the insulator potential or the insulator charges, e.g. for controlling charges effect or potential distribution in the insulating layer, or with a semi-insulating layer contacting directly the semiconductor surface
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4916—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen
- H01L29/4925—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen with a multiple layer structure, e.g. several silicon layers with different crystal structure or grain arrangement
- H01L29/4941—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen with a multiple layer structure, e.g. several silicon layers with different crystal structure or grain arrangement with a barrier layer between the silicon and the metal or metal silicide upper layer, e.g. Silicide/TiN/Polysilicon
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7811—Vertical DMOS transistors, i.e. VDMOS transistors with an edge termination structure
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/8611—Planar PN junction diodes
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electrodes Of Semiconductors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
本発明の実施の形態にかかる半導体装置の構造について説明する。図1は、本発明の実施の形態にかかる半導体装置のエッジターミネーション領域の構造を示す断面図である。図1(a)には、主電流が流れる活性領域101の外周を取り巻くエッジターミネーション領域100の要部断面図を示す。図1(b)には、図1(a)の破線枠内の拡大断面図を示す。図1(a)において、切断端面とは、半導体ウェハを個々のチップ状にダイシング(切断)して露出されたチップ切断面である。図1に示すように、実施の形態にかかる半導体装置は、前述した従来の半導体装置と同様に、主電流にかかる活性領域101と、この活性領域101の外周を取り巻くエッジターミネーション領域100とを有する。エッジターミネーション領域100には、ガードリング2および第1,2フィールドプレート4,7からなる電界緩和構造が設けられている。
2 ガードリング
3 フィールド絶縁膜
4 第1フィールドプレート
5 層間絶縁膜
6 バリアメタル膜
7 第2フィールドプレート
8 ポリイミド膜
100 エッジターミネーション領域
101 活性領域
LFP1 第1フィールドプレートのリング幅
LFP2 第2フィールドプレートのリング幅
LFP3 バリアメタル膜のリング幅
Claims (9)
- 半導体基板の一方の主面側に設けられた活性領域と、
前記活性領域の周囲を取り巻くエッジターミネーション領域と、
前記エッジターミネーション領域において、前記半導体基板の一方の主面の表面層に設けられた複数のガードリング、および、前記ガードリング上に設けられ、前記ガードリングと同電位のフィールドプレートからなる電界緩和機構と、
を備え、
前記フィールドプレートは
前記ガードリングの表面に設けられた第1フィールドプレートと、
前記第1フィールドプレート上に層間絶縁膜を介して設けられ、前記第1フィールドプレート間の間隔よりも広い間隔で配置された、前記第1フィールドプレートより厚さが厚い第2フィールドプレートと、からなり、
前記第2フィールドプレートと前記層間絶縁膜との間に、前記第2フィールドプレートに導電接触するバリアメタル膜を有し、
前記バリアメタル膜間の間隔は、前記第1フィールドプレート間の間隔とほぼ等しいことを特徴とする半導体装置。 - 前記バリアメタル膜は、前記第2フィールドプレートよりも高融点の金属を主成分とすることを特徴とする請求項1に記載の半導体装置。
- 前記バリアメタル膜は、チタン、窒化チタン、タンタル、窒化タンタル、チタンタングステン、モリブデンのいずれかを主成分とすることを特徴とする請求項2に記載の半導体装置。
- 前記バリアメタル膜の厚さは、50nm以上300nm以下であることを特徴とする請求項1に記載の半導体装置。
- 前記層間絶縁膜の厚さは、プロセスが許容する範囲で厚いことを特徴とする請求項1に記載の半導体装置。
- 前記第1フィールドプレートは、ポリシリコン膜であることを特徴とする請求項1に記載の半導体装置。
- 前記第1フィールドプレートの厚さは、1μm以下であることを特徴とする請求項6に記載の半導体装置。
- 前記第2フィールドプレートは、アルミニウムおよびシリコンを含む金属を主成分とすることを特徴とする請求項1に記載の半導体装置。
- 前記第2フィールドプレートの厚さは、5μm以上であることを特徴とする請求項1〜8のいずれか一つに記載の半導体装置。
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JP2012261222 | 2012-11-29 | ||
JP2012261222 | 2012-11-29 | ||
PCT/JP2013/081438 WO2014084124A1 (ja) | 2012-11-29 | 2013-11-21 | 半導体装置 |
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JP5949941B2 true JP5949941B2 (ja) | 2016-07-13 |
JPWO2014084124A1 JPWO2014084124A1 (ja) | 2017-01-05 |
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US (1) | US9299771B2 (ja) |
EP (1) | EP2927961B1 (ja) |
JP (1) | JP5949941B2 (ja) |
CN (1) | CN104662667B (ja) |
WO (1) | WO2014084124A1 (ja) |
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US9281360B1 (en) * | 2014-08-12 | 2016-03-08 | Infineon Technologies Ag | Semiconductor device with a shielding structure |
JP6575398B2 (ja) * | 2016-03-01 | 2019-09-18 | 三菱電機株式会社 | 半導体装置 |
JP6834156B2 (ja) * | 2016-03-16 | 2021-02-24 | 富士電機株式会社 | 半導体装置および製造方法 |
CN109243977B (zh) * | 2017-07-10 | 2021-08-17 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体器件及其制造方法和电子装置 |
EP3490006A1 (en) * | 2017-11-24 | 2019-05-29 | Nexperia B.V. | Semiconductor device with edge termination structure and method of manufacture |
JP2021185593A (ja) | 2020-05-25 | 2021-12-09 | 株式会社 日立パワーデバイス | 半導体装置および電力変換装置 |
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JP2009117715A (ja) * | 2007-11-08 | 2009-05-28 | Toshiba Corp | 半導体装置及びその製造方法 |
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JP3111827B2 (ja) | 1994-09-20 | 2000-11-27 | 株式会社日立製作所 | 半導体装置及びそれを使った電力変換装置 |
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JP5378045B2 (ja) * | 2009-04-13 | 2013-12-25 | 株式会社日立製作所 | 半導体装置 |
JP5218474B2 (ja) * | 2010-05-27 | 2013-06-26 | 富士電機株式会社 | 半導体装置 |
TWM435722U (en) * | 2012-03-22 | 2012-08-11 | Excelliance Mos Corp | Power MOSFET |
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2013
- 2013-11-21 EP EP13858222.6A patent/EP2927961B1/en active Active
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- 2013-11-21 WO PCT/JP2013/081438 patent/WO2014084124A1/ja active Application Filing
- 2013-11-21 CN CN201380047787.0A patent/CN104662667B/zh active Active
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2015
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JP2009117715A (ja) * | 2007-11-08 | 2009-05-28 | Toshiba Corp | 半導体装置及びその製造方法 |
JP2010251553A (ja) * | 2009-04-16 | 2010-11-04 | Mitsubishi Electric Corp | 半導体装置 |
JP2011171552A (ja) * | 2010-02-19 | 2011-09-01 | Fuji Electric Co Ltd | 半導体装置およびその製造方法 |
JP2012134198A (ja) * | 2010-12-20 | 2012-07-12 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
WO2013021727A1 (ja) * | 2011-08-05 | 2013-02-14 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
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CN104662667B (zh) | 2017-07-11 |
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EP2927961A4 (en) | 2016-07-20 |
WO2014084124A1 (ja) | 2014-06-05 |
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EP2927961B1 (en) | 2017-10-18 |
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