JP5936313B2 - 電子部品の実装構造体 - Google Patents

電子部品の実装構造体 Download PDF

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Publication number
JP5936313B2
JP5936313B2 JP2011096111A JP2011096111A JP5936313B2 JP 5936313 B2 JP5936313 B2 JP 5936313B2 JP 2011096111 A JP2011096111 A JP 2011096111A JP 2011096111 A JP2011096111 A JP 2011096111A JP 5936313 B2 JP5936313 B2 JP 5936313B2
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Japan
Prior art keywords
electronic component
cover
mounting structure
heat transfer
transfer material
Prior art date
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Active
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JP2011096111A
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English (en)
Japanese (ja)
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JP2012227472A5 (enrdf_load_stackoverflow
JP2012227472A (ja
Inventor
潤 田原
潤 田原
熊谷　隆
隆 熊谷
中島　泰
泰 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2011096111A priority Critical patent/JP5936313B2/ja
Publication of JP2012227472A publication Critical patent/JP2012227472A/ja
Publication of JP2012227472A5 publication Critical patent/JP2012227472A5/ja
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Publication of JP5936313B2 publication Critical patent/JP5936313B2/ja
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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2011096111A 2011-04-22 2011-04-22 電子部品の実装構造体 Active JP5936313B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011096111A JP5936313B2 (ja) 2011-04-22 2011-04-22 電子部品の実装構造体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011096111A JP5936313B2 (ja) 2011-04-22 2011-04-22 電子部品の実装構造体

Publications (3)

Publication Number Publication Date
JP2012227472A JP2012227472A (ja) 2012-11-15
JP2012227472A5 JP2012227472A5 (enrdf_load_stackoverflow) 2013-11-28
JP5936313B2 true JP5936313B2 (ja) 2016-06-22

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ID=47277278

Family Applications (1)

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JP2011096111A Active JP5936313B2 (ja) 2011-04-22 2011-04-22 電子部品の実装構造体

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JP (1) JP5936313B2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110678032A (zh) * 2019-11-01 2020-01-10 珠海格力电器股份有限公司 电器盒和空调器

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5949681B2 (ja) * 2013-06-25 2016-07-13 株式会社豊田自動織機 電動圧縮機
JP6453195B2 (ja) * 2015-09-29 2019-01-16 日立オートモティブシステムズ株式会社 車載制御装置
JP6672724B2 (ja) * 2015-11-10 2020-03-25 Tdk株式会社 電源装置
JP6402942B2 (ja) * 2015-12-11 2018-10-10 株式会社オートネットワーク技術研究所 電気接続箱
WO2017098899A1 (ja) * 2015-12-11 2017-06-15 株式会社オートネットワーク技術研究所 電気接続箱
JP2018034587A (ja) * 2016-08-30 2018-03-08 ダイキョーニシカワ株式会社 被接続部品の放熱構造
JP2018098927A (ja) * 2016-12-14 2018-06-21 株式会社オートネットワーク技術研究所 電気接続箱
JP6958438B2 (ja) 2018-03-08 2021-11-02 株式会社デンソー 電子部品用放熱装置
JP7124795B2 (ja) * 2019-06-27 2022-08-24 株式会社村田製作所 電子部品モジュール、電子部品ユニット、および、電子部品モジュールの製造方法
JP7452184B2 (ja) * 2020-03-30 2024-03-19 富士電機株式会社 電力変換装置
JP7152465B2 (ja) * 2020-12-16 2022-10-12 Ｎｅｃプラットフォームズ株式会社 冷却構造、および、コンピュータ
KR20230026887A (ko) * 2021-08-18 2023-02-27 현대자동차주식회사 모빌리티의 인버터 장치
JP2024037427A (ja) * 2022-09-07 2024-03-19 ヤマハ発動機株式会社 電動式の車両
CN119383830B (zh) * 2024-12-30 2025-04-01 深圳市凌航达电子有限公司 一种新能源汽车用线路板结构

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0747902Y2 (ja) * 1989-03-30 1995-11-01 ローム株式会社 チップ型電子部品の実装用取付け装置
JPH06104139A (ja) * 1992-09-21 1994-04-15 Matsushita Electric Ind Co Ltd セラミックチップ部品
JPH1065385A (ja) * 1996-08-21 1998-03-06 Mitsubishi Electric Corp 基板ケース構造体
JPH1145821A (ja) * 1997-07-25 1999-02-16 Tdk Corp 金属端子付き複合積層セラミックコンデンサ
JP3492504B2 (ja) * 1997-11-28 2004-02-03 エヌイーシーコンピュータテクノ株式会社 電子部品の放熱装置
JP4023054B2 (ja) * 1999-12-07 2007-12-19 株式会社デンソー 電子回路ユニット
JP4273673B2 (ja) * 2001-03-19 2009-06-03 株式会社デンソー 発熱素子の実装構造
JP2004186294A (ja) * 2002-12-02 2004-07-02 Denso Corp 電子装置
JP4860552B2 (ja) * 2007-06-08 2012-01-25 日本オプネクスト株式会社 半導体装置
JP4796999B2 (ja) * 2007-07-17 2011-10-19 日立オートモティブシステムズ株式会社 電子制御装置
JP4400662B2 (ja) * 2007-09-12 2010-01-20 株式会社デンソー 電子回路部品実装構造
JP2009176990A (ja) * 2008-01-25 2009-08-06 Panasonic Corp 電子機器ユニット
JP5045649B2 (ja) * 2008-11-17 2012-10-10 株式会社村田製作所 セラミックコンデンサ及びそれを備えた電子部品
JP5353251B2 (ja) * 2009-01-07 2013-11-27 Ｔｄｋ株式会社 積層コンデンサ及び積層コンデンサの実装構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110678032A (zh) * 2019-11-01 2020-01-10 珠海格力电器股份有限公司 电器盒和空调器

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