JP5898699B2 - 導電性シード層のレーザ除去 - Google Patents

導電性シード層のレーザ除去 Download PDF

Info

Publication number
JP5898699B2
JP5898699B2 JP2013549523A JP2013549523A JP5898699B2 JP 5898699 B2 JP5898699 B2 JP 5898699B2 JP 2013549523 A JP2013549523 A JP 2013549523A JP 2013549523 A JP2013549523 A JP 2013549523A JP 5898699 B2 JP5898699 B2 JP 5898699B2
Authority
JP
Japan
Prior art keywords
substrate
laser beam
laser
seed layer
irradiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013549523A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014504804A (ja
JP2014504804A5 (https=
Inventor
スーター、マシュー・イー
Original Assignee
タマラック サイエンティフィック カンパニー インコーポレイテッド
タマラック サイエンティフィック カンパニー インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by タマラック サイエンティフィック カンパニー インコーポレイテッド, タマラック サイエンティフィック カンパニー インコーポレイテッド filed Critical タマラック サイエンティフィック カンパニー インコーポレイテッド
Publication of JP2014504804A publication Critical patent/JP2014504804A/ja
Publication of JP2014504804A5 publication Critical patent/JP2014504804A5/ja
Application granted granted Critical
Publication of JP5898699B2 publication Critical patent/JP5898699B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
    • B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/042—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers the barrier, adhesion or liner layers being seed or nucleation layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/054—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers by selectively removing parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Drying Of Semiconductors (AREA)
JP2013549523A 2011-01-13 2012-01-11 導電性シード層のレーザ除去 Active JP5898699B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161432539P 2011-01-13 2011-01-13
US61/432,539 2011-01-13
PCT/US2012/020983 WO2012097092A2 (en) 2011-01-13 2012-01-11 Laser removal of conductive seed layers
US13/348,063 US8778799B2 (en) 2011-01-13 2012-01-11 Laser removal of conductive seed layers
US13/348,063 2012-01-11

Publications (3)

Publication Number Publication Date
JP2014504804A JP2014504804A (ja) 2014-02-24
JP2014504804A5 JP2014504804A5 (https=) 2015-03-05
JP5898699B2 true JP5898699B2 (ja) 2016-04-06

Family

ID=46491096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013549523A Active JP5898699B2 (ja) 2011-01-13 2012-01-11 導電性シード層のレーザ除去

Country Status (7)

Country Link
US (2) US8778799B2 (https=)
EP (1) EP2663419A2 (https=)
JP (1) JP5898699B2 (https=)
KR (2) KR101706517B1 (https=)
CN (1) CN103442840B (https=)
TW (1) TWI502683B (https=)
WO (1) WO2012097092A2 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI504322B (zh) * 2012-03-29 2015-10-11 Taiwan Green Point Entpr Co 雙面電路板及其製備方法
US8741691B2 (en) * 2012-04-20 2014-06-03 Taiwan Semiconductor Manufacturing Company, Ltd. Method of fabricating three dimensional integrated circuit
US8975177B2 (en) * 2013-03-14 2015-03-10 Intel Corporation Laser resist removal for integrated circuit (IC) packaging
US9412702B2 (en) 2013-03-14 2016-08-09 Intel Corporation Laser die backside film removal for integrated circuit (IC) packaging
US9908201B2 (en) * 2014-04-22 2018-03-06 Taiwan Semiconductor Manufacturing Company Limited Systems and methods for edge bead removal
US9754823B2 (en) 2014-05-28 2017-09-05 International Business Machines Corporation Substrate including selectively formed barrier layer
CN107850554B (zh) * 2015-08-26 2021-09-07 伊雷克托科学工业股份有限公司 相对于气流的镭射扫描定序及方向
WO2017052633A1 (en) * 2015-09-25 2017-03-30 Vivek Raghunathan Thin electronic package elements using laser spallation
EP3624571A1 (en) * 2018-09-14 2020-03-18 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO A process for the manufacturing of printed conductive tracks on an object and 3d printed electronics
DE102019112030B4 (de) * 2019-05-08 2023-11-02 LSR Engineering & Consulting Limited Verfahren zum Strukturieren eines Substrats
TWI825194B (zh) * 2019-10-14 2023-12-11 雷立光國際股份有限公司 乾式晶圓回收設備
CN114513900A (zh) * 2022-03-25 2022-05-17 深圳市大族数控科技股份有限公司 加工设备
CN114885525B (zh) * 2022-03-25 2025-08-15 深圳市大族数控科技股份有限公司 线路板制作方法及线路板
CN114554704A (zh) * 2022-03-25 2022-05-27 深圳市大族数控科技股份有限公司 线路板的制作方法
US12288763B2 (en) * 2022-03-31 2025-04-29 Texas Instruments Incorporated Flip chip package assembly having post connects with solder-based joints

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62104692A (ja) * 1985-11-01 1987-05-15 Fuji Electric Corp Res & Dev Ltd レ−ザ加工装置
US5221426A (en) * 1991-11-29 1993-06-22 Motorola Inc. Laser etch-back process for forming a metal feature on a non-metal substrate
JPH1099978A (ja) * 1996-09-27 1998-04-21 Hitachi Ltd レーザー加工装置
JPH1128900A (ja) * 1997-05-12 1999-02-02 Sumitomo Heavy Ind Ltd レーザ光を用いた塗装除去方法及びレーザ処理装置
JPH11106911A (ja) 1997-10-08 1999-04-20 Canon Inc 薄膜形成装置及びそれを用いた化合物薄膜の形成法
US6262579B1 (en) * 1998-11-13 2001-07-17 Kulicke & Soffa Holdings, Inc. Method and structure for detecting open vias in high density interconnect substrates
US6165892A (en) * 1998-07-31 2000-12-26 Kulicke & Soffa Holdings, Inc. Method of planarizing thin film layers deposited over a common circuit base
JP2000225487A (ja) * 1999-02-08 2000-08-15 Nippon Steel Corp レーザ切断用ノズル及びレーザ切断装置
US7379483B2 (en) * 2003-03-18 2008-05-27 Loma Linda University Medical Center Method and apparatus for material processing
DE10318681B4 (de) * 2003-04-24 2006-07-06 Schott Ag Verfahren und Vorrichtung zum Entfernen eines Randbereichs einer Substratschicht und zur Substratbeschichtung sowie Substrat
JP4479556B2 (ja) * 2005-03-25 2010-06-09 ソニー株式会社 レーザエッチング装置
JP4947973B2 (ja) * 2005-06-02 2012-06-06 ソニー株式会社 レーザ加工装置とその加工方法及びデブリ回収機構とその回収方法
JP2007021528A (ja) 2005-07-15 2007-02-01 Matsushita Electric Ind Co Ltd レーザ加工装置およびその調整方法
US7335611B2 (en) * 2005-08-08 2008-02-26 Applied Materials, Inc. Copper conductor annealing process employing high speed optical annealing with a low temperature-deposited optical absorber layer
JP4993886B2 (ja) * 2005-09-07 2012-08-08 株式会社ディスコ レーザー加工装置
US7528069B2 (en) * 2005-11-07 2009-05-05 Freescale Semiconductor, Inc. Fine pitch interconnect and method of making
WO2007058605A1 (en) 2005-11-18 2007-05-24 Replisaurus Technologies Ab Master electrode and method of forming it
FI124239B (fi) 2006-02-23 2014-05-15 Picodeon Ltd Oy Elementti, jossa on sähköä johtava kalvomainen rakenne lämmittävän ja/tai jäähdyttävän vaikutuksen synnyttämiseksi sähkövirran avulla
FI20060178A7 (fi) * 2006-02-23 2007-08-24 Picodeon Ltd Oy Pinnoitusmenetelmä
JP2009006350A (ja) * 2007-06-27 2009-01-15 Sony Corp レーザ加工装置とその加工方法、デブリ回収機構とその回収方法、並びに表示パネルの製造方法
KR101000466B1 (ko) * 2008-04-02 2010-12-14 에이피시스템 주식회사 레이저 가공장치 및 가공방법
CN105023973A (zh) 2009-04-21 2015-11-04 泰特拉桑有限公司 形成太阳能电池中的结构的方法
US7994045B1 (en) 2009-09-08 2011-08-09 Amkor Technology, Inc. Bumped chip package fabrication method and structure
EP2638510B1 (en) * 2010-11-08 2019-05-22 Smartrac Investment B.V. A method for producing an rfid transponder

Also Published As

Publication number Publication date
JP2014504804A (ja) 2014-02-24
US9132511B2 (en) 2015-09-15
WO2012097092A3 (en) 2013-01-24
TW201238002A (en) 2012-09-16
KR101706517B1 (ko) 2017-02-13
US20120184099A1 (en) 2012-07-19
KR20160012250A (ko) 2016-02-02
KR20140037044A (ko) 2014-03-26
CN103442840B (zh) 2015-07-01
EP2663419A2 (en) 2013-11-20
WO2012097092A2 (en) 2012-07-19
TWI502683B (zh) 2015-10-01
US20150014287A1 (en) 2015-01-15
US8778799B2 (en) 2014-07-15
HK1191608A1 (en) 2014-08-01
CN103442840A (zh) 2013-12-11

Similar Documents

Publication Publication Date Title
JP5898699B2 (ja) 導電性シード層のレーザ除去
KR101962456B1 (ko) 다중 단계 및 비대칭적으로 성형된 레이저 빔 스크라이빙
JP5643293B2 (ja) 太陽電池内の構造部を形成するための方法
EP2266134B1 (en) Processing of multilayer semiconductor wafers
JP2008543072A (ja) 半導体ウェハにおける垂直な電気コンタクト接続の作製方法
JPH0555749A (ja) 多層配線回路基板の製造方法及び誘電体ミラーマスクの製造方法
JP2006513862A (ja) レーザを用いて電気的な回路基板を加工するための装置および方法
JP2008147242A (ja) プリント基板のレーザ加工方法
KR102918388B1 (ko) 고급 패키징을 위한 마이크로 비아 형성 방법들
JP2004527923A (ja) 導体路基板の構造化方法および構造化装置
KR20130106676A (ko) 미세금속전극 제조방법
HK1191608B (en) Laser removal of conductive seed layers
JP2004273771A (ja) 半導体装置の製造方法
JP4235945B2 (ja) 金属配線形成方法および金属配線形成装置
JP2003053580A (ja) レーザ加工方法、プリント配線基板の製造方法及びプリント配線基板の製造装置
US10074608B2 (en) Method for manufacturing a contact bump by thermal expansion of a patterned sacrificial layer underneath a galvanic layer
CN115533338A (zh) 激光切割装置以及晶圆切割方法
TW202111815A (zh) 用於建構基板之方法
Lu et al. Laser applications in integrated circuits and photonics packaging
HK1122454A (en) Laser machining method for printed circuit board

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150109

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150109

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20150109

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20150312

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150512

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20150810

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20150911

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20151013

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151111

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160216

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160304

R150 Certificate of patent or registration of utility model

Ref document number: 5898699

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250