JP5890018B2 - 薬液処理装置 - Google Patents

薬液処理装置 Download PDF

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Publication number
JP5890018B2
JP5890018B2 JP2014519825A JP2014519825A JP5890018B2 JP 5890018 B2 JP5890018 B2 JP 5890018B2 JP 2014519825 A JP2014519825 A JP 2014519825A JP 2014519825 A JP2014519825 A JP 2014519825A JP 5890018 B2 JP5890018 B2 JP 5890018B2
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JP
Japan
Prior art keywords
chemical
substrate
etching
processed
ceiling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2014519825A
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English (en)
Japanese (ja)
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JPWO2013183260A1 (ja
Inventor
亮 村田
亮 村田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP2014519825A priority Critical patent/JP5890018B2/ja
Publication of JPWO2013183260A1 publication Critical patent/JPWO2013183260A1/ja
Application granted granted Critical
Publication of JP5890018B2 publication Critical patent/JP5890018B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2014519825A 2012-06-06 2013-05-30 薬液処理装置 Expired - Fee Related JP5890018B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014519825A JP5890018B2 (ja) 2012-06-06 2013-05-30 薬液処理装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012129190 2012-06-06
JP2012129190 2012-06-06
JP2014519825A JP5890018B2 (ja) 2012-06-06 2013-05-30 薬液処理装置
PCT/JP2013/003410 WO2013183260A1 (ja) 2012-06-06 2013-05-30 薬液処理装置

Publications (2)

Publication Number Publication Date
JPWO2013183260A1 JPWO2013183260A1 (ja) 2016-01-28
JP5890018B2 true JP5890018B2 (ja) 2016-03-22

Family

ID=49711668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014519825A Expired - Fee Related JP5890018B2 (ja) 2012-06-06 2013-05-30 薬液処理装置

Country Status (3)

Country Link
JP (1) JP5890018B2 (zh)
CN (1) CN104246988B (zh)
WO (1) WO2013183260A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104282598A (zh) * 2014-09-23 2015-01-14 安徽省大富光电科技有限公司 蚀刻、显影、清洗以及褪膜设备、喷淋处理设备及方法
CN111096071A (zh) * 2017-09-04 2020-05-01 夏普株式会社 蚀刻装置以及显示装置的制造方法
CN110586552A (zh) * 2019-10-17 2019-12-20 攀钢集团矿业有限公司 一种往复式高梯度磁选机冲洗装置
JP2022138907A (ja) * 2021-03-11 2022-09-26 キオクシア株式会社 基板洗浄装置および基板洗浄方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03284386A (ja) * 1990-03-30 1991-12-16 Shibaura Eng Works Co Ltd 洗浄用処理槽
JPH04196425A (ja) * 1990-11-28 1992-07-16 Sigma Merutetsuku Kk 薬液処理装置
JPH0737858A (ja) * 1993-07-19 1995-02-07 Dainippon Screen Mfg Co Ltd 基板処理装置

Also Published As

Publication number Publication date
CN104246988A (zh) 2014-12-24
WO2013183260A1 (ja) 2013-12-12
CN104246988B (zh) 2016-09-14
JPWO2013183260A1 (ja) 2016-01-28

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