JP5886417B2 - 表面処理銅箔 - Google Patents
表面処理銅箔 Download PDFInfo
- Publication number
- JP5886417B2 JP5886417B2 JP2014508074A JP2014508074A JP5886417B2 JP 5886417 B2 JP5886417 B2 JP 5886417B2 JP 2014508074 A JP2014508074 A JP 2014508074A JP 2014508074 A JP2014508074 A JP 2014508074A JP 5886417 B2 JP5886417 B2 JP 5886417B2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- concentration
- layer
- treatment
- treated copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 385
- 239000011889 copper foil Substances 0.000 title claims description 344
- 229910000077 silane Inorganic materials 0.000 claims description 200
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 199
- 238000010168 coupling process Methods 0.000 claims description 81
- 238000007788 roughening Methods 0.000 claims description 80
- 230000008878 coupling Effects 0.000 claims description 73
- 238000005859 coupling reaction Methods 0.000 claims description 73
- 238000000034 method Methods 0.000 claims description 73
- 230000008569 process Effects 0.000 claims description 70
- 230000003746 surface roughness Effects 0.000 claims description 63
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 62
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 59
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 52
- 230000002265 prevention Effects 0.000 claims description 51
- 239000010949 copper Substances 0.000 claims description 42
- 229910052802 copper Inorganic materials 0.000 claims description 41
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 36
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 36
- 229910052759 nickel Inorganic materials 0.000 claims description 28
- 239000002245 particle Substances 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 25
- 239000011164 primary particle Substances 0.000 claims description 22
- 239000011163 secondary particle Substances 0.000 claims description 18
- 229910045601 alloy Inorganic materials 0.000 claims description 17
- 239000000956 alloy Substances 0.000 claims description 17
- 238000005259 measurement Methods 0.000 claims description 13
- 229910017052 cobalt Inorganic materials 0.000 claims description 11
- 239000010941 cobalt Substances 0.000 claims description 11
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 229910002058 ternary alloy Inorganic materials 0.000 claims 1
- 238000007747 plating Methods 0.000 description 81
- 230000000052 comparative effect Effects 0.000 description 74
- 239000010410 layer Substances 0.000 description 64
- 239000000463 material Substances 0.000 description 53
- 239000007788 liquid Substances 0.000 description 30
- 238000007654 immersion Methods 0.000 description 20
- 238000012545 processing Methods 0.000 description 18
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 15
- 239000000203 mixture Substances 0.000 description 14
- 239000011701 zinc Substances 0.000 description 12
- 238000001035 drying Methods 0.000 description 10
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 9
- 229910052725 zinc Inorganic materials 0.000 description 9
- 229910017709 Ni Co Inorganic materials 0.000 description 8
- 229910003267 Ni-Co Inorganic materials 0.000 description 8
- 229910003296 Ni-Mo Inorganic materials 0.000 description 8
- 229910003262 Ni‐Co Inorganic materials 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000004020 conductor Substances 0.000 description 8
- DDTIGTPWGISMKL-UHFFFAOYSA-N molybdenum nickel Chemical compound [Ni].[Mo] DDTIGTPWGISMKL-UHFFFAOYSA-N 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 229910007567 Zn-Ni Inorganic materials 0.000 description 7
- 229910007614 Zn—Ni Inorganic materials 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000004642 Polyimide Substances 0.000 description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 6
- 125000003277 amino group Chemical group 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 238000005065 mining Methods 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 229910017518 Cu Zn Inorganic materials 0.000 description 5
- 229910017752 Cu-Zn Inorganic materials 0.000 description 5
- 229910017943 Cu—Zn Inorganic materials 0.000 description 5
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 5
- 230000002500 effect on skin Effects 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 4
- 125000001841 imino group Chemical group [H]N=* 0.000 description 4
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 4
- 239000004215 Carbon black (E152) Substances 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- 125000006527 (C1-C5) alkyl group Chemical group 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- KSFBTBXTZDJOHO-UHFFFAOYSA-N diaminosilicon Chemical compound N[Si]N KSFBTBXTZDJOHO-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229930195734 saturated hydrocarbon Natural products 0.000 description 2
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 2
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 2
- 229910000368 zinc sulfate Inorganic materials 0.000 description 2
- 229960001763 zinc sulfate Drugs 0.000 description 2
- OPWQHYSPLFFRMU-UHFFFAOYSA-N 1-trimethoxysilylpropan-1-amine Chemical compound CCC(N)[Si](OC)(OC)OC OPWQHYSPLFFRMU-UHFFFAOYSA-N 0.000 description 1
- KBRVQAUYZUFKAJ-UHFFFAOYSA-N 1-trimethoxysilylpropan-2-amine Chemical compound CO[Si](OC)(OC)CC(C)N KBRVQAUYZUFKAJ-UHFFFAOYSA-N 0.000 description 1
- OEAJGMUUGFQQOA-UHFFFAOYSA-N 1-trimethoxysilylpropane-1,2-diamine Chemical compound CO[Si](OC)(OC)C(N)C(C)N OEAJGMUUGFQQOA-UHFFFAOYSA-N 0.000 description 1
- BYIMSFXYUSZVLI-UHFFFAOYSA-N 3-methoxysilylpropan-1-amine Chemical compound CO[SiH2]CCCN BYIMSFXYUSZVLI-UHFFFAOYSA-N 0.000 description 1
- BRMMQZOSYOCOTI-UHFFFAOYSA-N 3-trimethoxysilylprop-2-en-1-amine Chemical compound CO[Si](OC)(OC)C=CCN BRMMQZOSYOCOTI-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- PRKPGWQEKNEVEU-UHFFFAOYSA-N 4-methyl-n-(3-triethoxysilylpropyl)pentan-2-imine Chemical compound CCO[Si](OCC)(OCC)CCCN=C(C)CC(C)C PRKPGWQEKNEVEU-UHFFFAOYSA-N 0.000 description 1
- NOKQROKSNPFYBJ-UHFFFAOYSA-N CO[SiH2]CCCNC1=CC=CC=C1 Chemical compound CO[SiH2]CCCNC1=CC=CC=C1 NOKQROKSNPFYBJ-UHFFFAOYSA-N 0.000 description 1
- JADOZEDEXQFMGX-UHFFFAOYSA-N CO[Si](OC)(OC)C#CCN Chemical compound CO[Si](OC)(OC)C#CCN JADOZEDEXQFMGX-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 1
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 1
- 125000002015 acyclic group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- -1 butynediol Chemical compound 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- HMDRAGZZZBGZJC-UHFFFAOYSA-N n-[3-[3-aminopropoxy(dimethoxy)silyl]propyl]-1-phenylprop-2-en-1-amine Chemical compound NCCCO[Si](OC)(OC)CCCNC(C=C)C1=CC=CC=C1 HMDRAGZZZBGZJC-UHFFFAOYSA-N 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 229940078494 nickel acetate Drugs 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 1
- 229940081974 saccharin Drugs 0.000 description 1
- 235000019204 saccharin Nutrition 0.000 description 1
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 description 1
- 239000011684 sodium molybdate Substances 0.000 description 1
- 235000015393 sodium molybdate Nutrition 0.000 description 1
- TVXXNOYZHKPKGW-UHFFFAOYSA-N sodium molybdate (anhydrous) Chemical compound [Na+].[Na+].[O-][Mo]([O-])(=O)=O TVXXNOYZHKPKGW-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 description 1
- 229940038773 trisodium citrate Drugs 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/24—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/82—After-treatment
- C23C22/83—Chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
- C23C2222/20—Use of solutions containing silanes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Chemical Treatment Of Metals (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014508074A JP5886417B2 (ja) | 2012-03-29 | 2013-03-29 | 表面処理銅箔 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012076711 | 2012-03-29 | ||
| JP2012076711 | 2012-03-29 | ||
| PCT/JP2013/059455 WO2013147116A1 (ja) | 2012-03-29 | 2013-03-29 | 表面処理銅箔 |
| JP2014508074A JP5886417B2 (ja) | 2012-03-29 | 2013-03-29 | 表面処理銅箔 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015095267A Division JP6149066B2 (ja) | 2012-03-29 | 2015-05-07 | 表面処理銅箔 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2013147116A1 JPWO2013147116A1 (ja) | 2015-12-14 |
| JP5886417B2 true JP5886417B2 (ja) | 2016-03-16 |
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| JP2014508074A Active JP5886417B2 (ja) | 2012-03-29 | 2013-03-29 | 表面処理銅箔 |
| JP2015095267A Active JP6149066B2 (ja) | 2012-03-29 | 2015-05-07 | 表面処理銅箔 |
| JP2015197909A Withdrawn JP2016033261A (ja) | 2012-03-29 | 2015-10-05 | 表面処理銅箔 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
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| JP2015095267A Active JP6149066B2 (ja) | 2012-03-29 | 2015-05-07 | 表面処理銅箔 |
| JP2015197909A Withdrawn JP2016033261A (ja) | 2012-03-29 | 2015-10-05 | 表面処理銅箔 |
Country Status (6)
| Country | Link |
|---|---|
| JP (3) | JP5886417B2 (zh) |
| KR (2) | KR101824827B1 (zh) |
| CN (1) | CN104246013B (zh) |
| MY (1) | MY169065A (zh) |
| TW (1) | TWI565833B (zh) |
| WO (1) | WO2013147116A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016033261A (ja) * | 2012-03-29 | 2016-03-10 | Ｊｘ金属株式会社 | 表面処理銅箔 |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104220642B (zh) | 2012-03-29 | 2018-02-02 | Jx日矿日石金属株式会社 | 表面处理铜箔 |
| JP6854114B2 (ja) | 2016-01-04 | 2021-04-07 | Ｊｘ金属株式会社 | 表面処理銅箔 |
| US10383222B2 (en) | 2016-01-04 | 2019-08-13 | Jx Nippon Mining & Metals Corporation | Surface-treated copper foil |
| JP6697759B2 (ja) * | 2016-02-05 | 2020-05-27 | パナソニックＩｐマネジメント株式会社 | 金属張積層板、金属張積層板の製造方法、樹脂付き金属部材、樹脂付き金属部材の製造方法、配線板、及び配線板の製造方法 |
| JP7193915B2 (ja) * | 2017-02-03 | 2022-12-21 | Ｊｘ金属株式会社 | 表面処理銅箔並びにこれを用いた集電体、電極及び電池 |
| US10529992B2 (en) | 2017-02-03 | 2020-01-07 | Jx Nippon Mining & Metals Corporation | Surface-treated copper foil, and current collector, electrode, and battery cell using the surface-treated copper foil |
| US10337115B1 (en) * | 2018-01-05 | 2019-07-02 | Chang Chun Petrochemical Co., Ltd. | Surface treated copper foil for high speed printed circuit board products including the copper foil and methods of making |
| JP6413039B1 (ja) * | 2018-03-29 | 2018-10-24 | Ｊｘ金属株式会社 | 表面処理銅箔及び銅張積層板 |
| JPWO2019208520A1 (ja) * | 2018-04-27 | 2021-06-17 | Ｊｘ金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
| CN109467722B (zh) * | 2018-09-29 | 2022-04-08 | 苏州市新广益电子有限公司 | 一种用于fpc行业的lcp薄膜及其制备方法 |
| KR20220006035A (ko) * | 2019-05-09 | 2022-01-14 | 나믹스 가부시끼가이샤 | 복합 구리 부재 |
| JP7352939B2 (ja) * | 2019-05-09 | 2023-09-29 | ナミックス株式会社 | 複合銅部材 |
| US10697082B1 (en) * | 2019-08-12 | 2020-06-30 | Chang Chun Petrochemical Co., Ltd. | Surface-treated copper foil |
| JP7421208B2 (ja) | 2019-12-24 | 2024-01-24 | 日本電解株式会社 | 表面処理銅箔及びその製造方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6015654B2 (ja) * | 1980-11-18 | 1985-04-20 | 日本電解株式会社 | 銅箔のクロメ−ト処理層と樹脂基材との接着方法 |
| JPS6154592A (ja) | 1984-08-24 | 1986-03-18 | 株式会社日立製作所 | 現金自動取引装置 |
| JPH0334679A (ja) | 1989-06-30 | 1991-02-14 | Canon Inc | 画像処理装置 |
| JPH0555746A (ja) | 1991-08-29 | 1993-03-05 | Hitachi Chem Co Ltd | 高周波用銅張り積層板及びプリント配線板 |
| JP3135098B2 (ja) | 1993-06-21 | 2001-02-13 | キヤノン株式会社 | 光学素子の成形装置 |
| JP3300160B2 (ja) * | 1994-06-06 | 2002-07-08 | 株式会社ジャパンエナジー | 銅箔の処理方法 |
| JP2003193211A (ja) | 2001-12-27 | 2003-07-09 | Nippon Mining & Metals Co Ltd | 銅張積層板用圧延銅箔 |
| JP4295800B2 (ja) * | 2002-05-13 | 2009-07-15 | 三井金属鉱業株式会社 | 電解銅箔 |
| US6969557B2 (en) * | 2002-06-04 | 2005-11-29 | Mitsui Mining & Smelting Co., Ltd. | Surface-treated copper foil low-dielectric substrate and copper-clad laminate and printed wiring board using the same |
| WO2009081889A1 (ja) * | 2007-12-21 | 2009-07-02 | Nippon Mining & Metals Co., Ltd. | プリント配線板用銅箔 |
| CN102150479B (zh) * | 2009-06-30 | 2013-03-27 | Jx日矿日石金属株式会社 | 印刷配线板用铜箔 |
| JP5463117B2 (ja) * | 2009-10-20 | 2014-04-09 | 株式会社日立製作所 | 低損失配線板，多層配線板、それに用いる銅箔及び積層板 |
| JP5242710B2 (ja) * | 2010-01-22 | 2013-07-24 | 古河電気工業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
| EP2557204A1 (en) * | 2010-05-07 | 2013-02-13 | JX Nippon Mining & Metals Corp. | Copper foil for printed circuit |
| WO2013147116A1 (ja) * | 2012-03-29 | 2013-10-03 | Jx日鉱日石金属株式会社 | 表面処理銅箔 |
-
2013
- 2013-03-29 WO PCT/JP2013/059455 patent/WO2013147116A1/ja active Application Filing
- 2013-03-29 CN CN201380018060.XA patent/CN104246013B/zh active Active
- 2013-03-29 KR KR1020167016480A patent/KR101824827B1/ko active IP Right Grant
- 2013-03-29 KR KR1020147030308A patent/KR101658722B1/ko active IP Right Grant
- 2013-03-29 TW TW102111623A patent/TWI565833B/zh active
- 2013-03-29 MY MYPI2014702857A patent/MY169065A/en unknown
- 2013-03-29 JP JP2014508074A patent/JP5886417B2/ja active Active
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2015
- 2015-05-07 JP JP2015095267A patent/JP6149066B2/ja active Active
- 2015-10-05 JP JP2015197909A patent/JP2016033261A/ja not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016033261A (ja) * | 2012-03-29 | 2016-03-10 | Ｊｘ金属株式会社 | 表面処理銅箔 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104246013A (zh) | 2014-12-24 |
| WO2013147116A1 (ja) | 2013-10-03 |
| JP6149066B2 (ja) | 2017-06-14 |
| KR101824827B1 (ko) | 2018-02-01 |
| TWI565833B (zh) | 2017-01-11 |
| TW201404935A (zh) | 2014-02-01 |
| KR20160075865A (ko) | 2016-06-29 |
| KR101658722B1 (ko) | 2016-09-21 |
| JPWO2013147116A1 (ja) | 2015-12-14 |
| JP2015206119A (ja) | 2015-11-19 |
| KR20140142341A (ko) | 2014-12-11 |
| MY169065A (en) | 2019-02-12 |
| JP2016033261A (ja) | 2016-03-10 |
| CN104246013B (zh) | 2018-01-23 |
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