MY169065A - Surface-treated copper foil - Google Patents
Surface-treated copper foilInfo
- Publication number
- MY169065A MY169065A MYPI2014702857A MYPI2014702857A MY169065A MY 169065 A MY169065 A MY 169065A MY PI2014702857 A MYPI2014702857 A MY PI2014702857A MY PI2014702857 A MYPI2014702857 A MY PI2014702857A MY 169065 A MY169065 A MY 169065A
- Authority
- MY
- Malaysia
- Prior art keywords
- copper foil
- treated copper
- concentration
- treated
- lcp
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/24—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/82—After-treatment
- C23C22/83—Chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
- C23C2222/20—Use of solutions containing silanes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electrochemistry (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Chemical Treatment Of Metals (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012076711 | 2012-03-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY169065A true MY169065A (en) | 2019-02-12 |
Family
ID=49260358
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2014702857A MY169065A (en) | 2012-03-29 | 2013-03-29 | Surface-treated copper foil |
Country Status (6)
Country | Link |
---|---|
JP (3) | JP5886417B2 (zh) |
KR (2) | KR101824827B1 (zh) |
CN (1) | CN104246013B (zh) |
MY (1) | MY169065A (zh) |
TW (1) | TWI565833B (zh) |
WO (1) | WO2013147116A1 (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY169065A (en) * | 2012-03-29 | 2019-02-12 | Jx Nippon Mining & Metals Corp | Surface-treated copper foil |
US10070521B2 (en) | 2012-03-29 | 2018-09-04 | Jx Nippon Mining & Metals Corporation | Surface-treated copper foil |
JP6854114B2 (ja) * | 2016-01-04 | 2021-04-07 | Jx金属株式会社 | 表面処理銅箔 |
US10383222B2 (en) | 2016-01-04 | 2019-08-13 | Jx Nippon Mining & Metals Corporation | Surface-treated copper foil |
JP6697759B2 (ja) * | 2016-02-05 | 2020-05-27 | パナソニックIpマネジメント株式会社 | 金属張積層板、金属張積層板の製造方法、樹脂付き金属部材、樹脂付き金属部材の製造方法、配線板、及び配線板の製造方法 |
JP7193915B2 (ja) * | 2017-02-03 | 2022-12-21 | Jx金属株式会社 | 表面処理銅箔並びにこれを用いた集電体、電極及び電池 |
US10529992B2 (en) | 2017-02-03 | 2020-01-07 | Jx Nippon Mining & Metals Corporation | Surface-treated copper foil, and current collector, electrode, and battery cell using the surface-treated copper foil |
US10337115B1 (en) * | 2018-01-05 | 2019-07-02 | Chang Chun Petrochemical Co., Ltd. | Surface treated copper foil for high speed printed circuit board products including the copper foil and methods of making |
JP6413039B1 (ja) * | 2018-03-29 | 2018-10-24 | Jx金属株式会社 | 表面処理銅箔及び銅張積層板 |
EP3786317A4 (en) * | 2018-04-27 | 2022-04-20 | JX Nippon Mining & Metals Corporation | SURFACE TREATED COPPER FOIL, COPPER COATED LAMINATE AND CIRCUIT BOARD |
CN109467722B (zh) * | 2018-09-29 | 2022-04-08 | 苏州市新广益电子有限公司 | 一种用于fpc行业的lcp薄膜及其制备方法 |
KR20220006035A (ko) * | 2019-05-09 | 2022-01-14 | 나믹스 가부시끼가이샤 | 복합 구리 부재 |
JP7352939B2 (ja) * | 2019-05-09 | 2023-09-29 | ナミックス株式会社 | 複合銅部材 |
US10697082B1 (en) * | 2019-08-12 | 2020-06-30 | Chang Chun Petrochemical Co., Ltd. | Surface-treated copper foil |
JP7421208B2 (ja) | 2019-12-24 | 2024-01-24 | 日本電解株式会社 | 表面処理銅箔及びその製造方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6015654B2 (ja) * | 1980-11-18 | 1985-04-20 | 日本電解株式会社 | 銅箔のクロメ−ト処理層と樹脂基材との接着方法 |
JPS6154592A (ja) | 1984-08-24 | 1986-03-18 | 株式会社日立製作所 | 現金自動取引装置 |
JPH0334679A (ja) | 1989-06-30 | 1991-02-14 | Canon Inc | 画像処理装置 |
JPH0555746A (ja) | 1991-08-29 | 1993-03-05 | Hitachi Chem Co Ltd | 高周波用銅張り積層板及びプリント配線板 |
JP3135098B2 (ja) | 1993-06-21 | 2001-02-13 | キヤノン株式会社 | 光学素子の成形装置 |
JP3300160B2 (ja) * | 1994-06-06 | 2002-07-08 | 株式会社ジャパンエナジー | 銅箔の処理方法 |
JP2003193211A (ja) | 2001-12-27 | 2003-07-09 | Nippon Mining & Metals Co Ltd | 銅張積層板用圧延銅箔 |
JP4295800B2 (ja) * | 2002-05-13 | 2009-07-15 | 三井金属鉱業株式会社 | 電解銅箔 |
KR100602896B1 (ko) * | 2002-06-04 | 2006-07-19 | 미쓰이 긴조꾸 고교 가부시키가이샤 | 저유전성 기재용 표면처리 동박과 그것을 사용한 동클래드적층판 및 프린트 배선판 |
CN101904228B (zh) * | 2007-12-21 | 2014-01-01 | Jx日矿日石金属株式会社 | 印刷配线板用铜箔 |
CN102150479B (zh) * | 2009-06-30 | 2013-03-27 | Jx日矿日石金属株式会社 | 印刷配线板用铜箔 |
JP5463117B2 (ja) * | 2009-10-20 | 2014-04-09 | 株式会社日立製作所 | 低損失配線板,多層配線板、それに用いる銅箔及び積層板 |
JP5242710B2 (ja) * | 2010-01-22 | 2013-07-24 | 古河電気工業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
KR101328235B1 (ko) * | 2010-05-07 | 2013-11-14 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 인쇄 회로용 동박 |
MY169065A (en) * | 2012-03-29 | 2019-02-12 | Jx Nippon Mining & Metals Corp | Surface-treated copper foil |
-
2013
- 2013-03-29 MY MYPI2014702857A patent/MY169065A/en unknown
- 2013-03-29 CN CN201380018060.XA patent/CN104246013B/zh active Active
- 2013-03-29 KR KR1020167016480A patent/KR101824827B1/ko active IP Right Grant
- 2013-03-29 JP JP2014508074A patent/JP5886417B2/ja active Active
- 2013-03-29 KR KR1020147030308A patent/KR101658722B1/ko active IP Right Grant
- 2013-03-29 TW TW102111623A patent/TWI565833B/zh active
- 2013-03-29 WO PCT/JP2013/059455 patent/WO2013147116A1/ja active Application Filing
-
2015
- 2015-05-07 JP JP2015095267A patent/JP6149066B2/ja active Active
- 2015-10-05 JP JP2015197909A patent/JP2016033261A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
KR20140142341A (ko) | 2014-12-11 |
JPWO2013147116A1 (ja) | 2015-12-14 |
JP5886417B2 (ja) | 2016-03-16 |
TW201404935A (zh) | 2014-02-01 |
JP2015206119A (ja) | 2015-11-19 |
TWI565833B (zh) | 2017-01-11 |
WO2013147116A1 (ja) | 2013-10-03 |
KR20160075865A (ko) | 2016-06-29 |
CN104246013B (zh) | 2018-01-23 |
JP6149066B2 (ja) | 2017-06-14 |
KR101658722B1 (ko) | 2016-09-21 |
CN104246013A (zh) | 2014-12-24 |
KR101824827B1 (ko) | 2018-02-01 |
JP2016033261A (ja) | 2016-03-10 |
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