JP5886027B2 - 両面金属張積層板およびその製造方法 - Google Patents

両面金属張積層板およびその製造方法 Download PDF

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Publication number
JP5886027B2
JP5886027B2 JP2011280017A JP2011280017A JP5886027B2 JP 5886027 B2 JP5886027 B2 JP 5886027B2 JP 2011280017 A JP2011280017 A JP 2011280017A JP 2011280017 A JP2011280017 A JP 2011280017A JP 5886027 B2 JP5886027 B2 JP 5886027B2
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Japan
Prior art keywords
polyimide resin
resin layer
layer
metal
polyimide
Prior art date
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Active
Application number
JP2011280017A
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English (en)
Japanese (ja)
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JP2013129116A (ja
Inventor
栄吾 近藤
栄吾 近藤
健太郎 矢熊
健太郎 矢熊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel and Sumikin Chemical Co Ltd
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Nippon Steel and Sumikin Chemical Co Ltd
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Publication date
Application filed by Nippon Steel and Sumikin Chemical Co Ltd filed Critical Nippon Steel and Sumikin Chemical Co Ltd
Priority to JP2011280017A priority Critical patent/JP5886027B2/ja
Priority to KR1020120147272A priority patent/KR101987038B1/ko
Priority to TW101148013A priority patent/TWI547368B/zh
Priority to CN201210558943.7A priority patent/CN103171190B/zh
Publication of JP2013129116A publication Critical patent/JP2013129116A/ja
Application granted granted Critical
Publication of JP5886027B2 publication Critical patent/JP5886027B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2011280017A 2011-12-21 2011-12-21 両面金属張積層板およびその製造方法 Active JP5886027B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011280017A JP5886027B2 (ja) 2011-12-21 2011-12-21 両面金属張積層板およびその製造方法
KR1020120147272A KR101987038B1 (ko) 2011-12-21 2012-12-17 양면 금속장 적층판 및 그 제조 방법
TW101148013A TWI547368B (zh) 2011-12-21 2012-12-18 雙面被覆金屬之積層板及其製造方法
CN201210558943.7A CN103171190B (zh) 2011-12-21 2012-12-20 两面覆金属层叠板及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011280017A JP5886027B2 (ja) 2011-12-21 2011-12-21 両面金属張積層板およびその製造方法

Publications (2)

Publication Number Publication Date
JP2013129116A JP2013129116A (ja) 2013-07-04
JP5886027B2 true JP5886027B2 (ja) 2016-03-16

Family

ID=48631589

Family Applications (1)

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JP2011280017A Active JP5886027B2 (ja) 2011-12-21 2011-12-21 両面金属張積層板およびその製造方法

Country Status (4)

Country Link
JP (1) JP5886027B2 (zh)
KR (1) KR101987038B1 (zh)
CN (1) CN103171190B (zh)
TW (1) TWI547368B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210036342A (ko) 2018-07-25 2021-04-02 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 금속 피복 적층판 및 회로 기판
KR20230099675A (ko) 2021-12-27 2023-07-04 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 수지적층체, 금속박적층판, 회로기판, 전자 디바이스 및 전자기기

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103456900B (zh) * 2013-08-20 2016-07-06 Tcl集团股份有限公司 柔性显示装置的制造方法
US20160221870A1 (en) * 2013-09-20 2016-08-04 Dai Nippon Printing Co., Ltd. Organic glass laminate
JP5793720B1 (ja) * 2014-04-11 2015-10-14 パナソニックＩｐマネジメント株式会社 金属箔付き接着シート、金属箔付き積層板、金属箔付き多層基板、回路基板の製造方法
KR102239605B1 (ko) * 2014-12-23 2021-04-12 주식회사 두산 양면 연성 금속 적층판 및 그 제조방법
JP6528597B2 (ja) * 2015-08-20 2019-06-12 住友金属鉱山株式会社 導電性基板、および導電性基板の製造方法
CN112714691B (zh) * 2018-09-25 2022-03-29 株式会社可乐丽 覆金属层叠体的制造方法
WO2020066595A1 (ja) * 2018-09-28 2020-04-02 日鉄ケミカル＆マテリアル株式会社 金属張積層板の製造方法及び回路基板の製造方法
JP7446741B2 (ja) * 2018-09-28 2024-03-11 日鉄ケミカル＆マテリアル株式会社 金属張積層板及び回路基板
JP2021106248A (ja) * 2019-12-27 2021-07-26 日鉄ケミカル＆マテリアル株式会社 金属張積層板及び回路基板
CN113147151B (zh) * 2021-04-20 2023-09-22 合肥佩尔哲汽车内饰系统有限公司 一种汽车内饰生产用环保设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0693537A (ja) 1992-09-07 1994-04-05 Kanebo Ltd 織機管理装置
JP2875186B2 (ja) 1995-06-08 1999-03-24 日鉱グールド・フォイル株式会社 印刷回路用銅箔の処理方法
CN101652244B (zh) * 2007-04-18 2013-06-26 旭化成电子材料株式会社 金属-树脂层压体
JP5176886B2 (ja) * 2007-11-12 2013-04-03 東洋紡株式会社 フレキシブル金属積層体及びフレキシブルプリント基板
WO2009063742A1 (ja) * 2007-11-12 2009-05-22 Toyo Boseki Kabushiki Kaisha 金属積層体
TWI462826B (zh) 2008-07-22 2014-12-01 Furukawa Electric Co Ltd Flexible copper clad sheet

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210036342A (ko) 2018-07-25 2021-04-02 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 금속 피복 적층판 및 회로 기판
KR20230099675A (ko) 2021-12-27 2023-07-04 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 수지적층체, 금속박적층판, 회로기판, 전자 디바이스 및 전자기기

Also Published As

Publication number Publication date
CN103171190B (zh) 2017-10-24
KR20130072145A (ko) 2013-07-01
JP2013129116A (ja) 2013-07-04
TW201338971A (zh) 2013-10-01
CN103171190A (zh) 2013-06-26
TWI547368B (zh) 2016-09-01
KR101987038B1 (ko) 2019-06-10

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