JP5877745B2 - 複合金属水酸化物粒子、及びそれを含む樹脂組成物 - Google Patents
複合金属水酸化物粒子、及びそれを含む樹脂組成物 Download PDFInfo
- Publication number
- JP5877745B2 JP5877745B2 JP2012071182A JP2012071182A JP5877745B2 JP 5877745 B2 JP5877745 B2 JP 5877745B2 JP 2012071182 A JP2012071182 A JP 2012071182A JP 2012071182 A JP2012071182 A JP 2012071182A JP 5877745 B2 JP5877745 B2 JP 5877745B2
- Authority
- JP
- Japan
- Prior art keywords
- composite metal
- metal hydroxide
- hydroxide
- compound
- partially solidified
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G9/00—Compounds of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/30—Particle morphology extending in three dimensions
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012071182A JP5877745B2 (ja) | 2012-03-27 | 2012-03-27 | 複合金属水酸化物粒子、及びそれを含む樹脂組成物 |
CN201380017234.0A CN104220520B (zh) | 2012-03-27 | 2013-03-12 | 复合金属氢氧化物颗粒、及含有其的树脂组合物 |
KR1020147030081A KR101966287B1 (ko) | 2012-03-27 | 2013-03-12 | 복합 금속수산화물 입자 및 그것을 포함하는 수지조성물 |
MYPI2014702802A MY168546A (en) | 2012-03-27 | 2013-03-12 | Composite metal hydroxide particles and resin composition containing the same |
PCT/JP2013/056719 WO2013146222A1 (ja) | 2012-03-27 | 2013-03-12 | 複合金属水酸化物粒子、及びそれを含む樹脂組成物 |
TW102109432A TWI564246B (zh) | 2012-03-27 | 2013-03-18 | 複合金屬氫氧化物粒子,及含有該粒子之樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012071182A JP5877745B2 (ja) | 2012-03-27 | 2012-03-27 | 複合金属水酸化物粒子、及びそれを含む樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013203767A JP2013203767A (ja) | 2013-10-07 |
JP5877745B2 true JP5877745B2 (ja) | 2016-03-08 |
Family
ID=49259490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012071182A Active JP5877745B2 (ja) | 2012-03-27 | 2012-03-27 | 複合金属水酸化物粒子、及びそれを含む樹脂組成物 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5877745B2 (ko) |
KR (1) | KR101966287B1 (ko) |
CN (1) | CN104220520B (ko) |
MY (1) | MY168546A (ko) |
TW (1) | TWI564246B (ko) |
WO (1) | WO2013146222A1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5952676B2 (ja) * | 2012-04-27 | 2016-07-13 | 花王株式会社 | 疎水化処理した酸化亜鉛粒子の製造方法 |
KR102634294B1 (ko) * | 2019-09-27 | 2024-02-07 | 주식회사 엘지화학 | 난연 조제의 제조 방법 및 그 제조 방법에 의해 제조된 난연 조제를 포함하는 난연성 수지 조성물 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH085990B2 (ja) * | 1991-02-06 | 1996-01-24 | 株式会社海水化学研究所 | 難燃剤、および難燃性樹脂および/またはゴム組成物 |
US5401442A (en) * | 1991-02-06 | 1995-03-28 | Kabushiki Kaisha Kaisui Kagau Kenkyujo | Composite metal hydroxide and its use |
JP3154535B2 (ja) * | 1991-12-24 | 2001-04-09 | 株式会社海水化学研究所 | 複合金属水酸化物およびその使用 |
JP3086566B2 (ja) * | 1993-05-06 | 2000-09-11 | 株式会社海水化学研究所 | 安定化された含ハロゲン樹脂組成物 |
IN189465B (ko) * | 1995-08-03 | 2003-03-01 | Tateho Kagaku Kogyo Kk | |
JP3432134B2 (ja) * | 1997-04-21 | 2003-08-04 | タテホ化学工業株式会社 | 金属水酸化物固溶体および金属酸化物固溶体ならびにこれらの製法 |
EP0978542B1 (en) * | 1997-04-21 | 2007-10-24 | Nitto Denko Corporation | Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor device |
JP2001192533A (ja) * | 2000-01-14 | 2001-07-17 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2002003848A (ja) * | 2000-04-12 | 2002-01-09 | Mizusawa Ind Chem Ltd | 難燃剤 |
JP2002348574A (ja) * | 2001-05-25 | 2002-12-04 | Sakai Chem Ind Co Ltd | 難燃剤とその製造方法とそれを含む難燃性樹脂組成物 |
JP2003064185A (ja) * | 2001-08-27 | 2003-03-05 | Sumitomo Bakelite Co Ltd | エポキシ樹脂成形材料の製造方法及び半導体装置 |
JP4189492B2 (ja) | 2004-03-22 | 2008-12-03 | 独立行政法人物質・材料研究機構 | 層状複水酸化物/ゼオライト複合体 |
JP4997704B2 (ja) * | 2005-02-24 | 2012-08-08 | 富士ゼロックス株式会社 | 表面被覆難燃性粒子及びその製造方法、並びに難燃性樹脂組成物及びその製造方法 |
JP4774236B2 (ja) * | 2005-04-28 | 2011-09-14 | タテホ化学工業株式会社 | 水酸化マグネシウム粒子及びその製造方法及びそれを含む樹脂組成物 |
CN101905861A (zh) * | 2009-06-05 | 2010-12-08 | 北京化工大学 | 一种纳米层状复合金属氢氧化物的制备方法 |
-
2012
- 2012-03-27 JP JP2012071182A patent/JP5877745B2/ja active Active
-
2013
- 2013-03-12 MY MYPI2014702802A patent/MY168546A/en unknown
- 2013-03-12 CN CN201380017234.0A patent/CN104220520B/zh active Active
- 2013-03-12 KR KR1020147030081A patent/KR101966287B1/ko active IP Right Grant
- 2013-03-12 WO PCT/JP2013/056719 patent/WO2013146222A1/ja active Application Filing
- 2013-03-18 TW TW102109432A patent/TWI564246B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN104220520A (zh) | 2014-12-17 |
MY168546A (en) | 2018-11-12 |
TW201343553A (zh) | 2013-11-01 |
KR20140139599A (ko) | 2014-12-05 |
KR101966287B1 (ko) | 2019-04-05 |
JP2013203767A (ja) | 2013-10-07 |
TWI564246B (zh) | 2017-01-01 |
WO2013146222A1 (ja) | 2013-10-03 |
CN104220520B (zh) | 2016-06-22 |
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