JP5877745B2 - 複合金属水酸化物粒子、及びそれを含む樹脂組成物 - Google Patents

複合金属水酸化物粒子、及びそれを含む樹脂組成物 Download PDF

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Publication number
JP5877745B2
JP5877745B2 JP2012071182A JP2012071182A JP5877745B2 JP 5877745 B2 JP5877745 B2 JP 5877745B2 JP 2012071182 A JP2012071182 A JP 2012071182A JP 2012071182 A JP2012071182 A JP 2012071182A JP 5877745 B2 JP5877745 B2 JP 5877745B2
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JP
Japan
Prior art keywords
composite metal
metal hydroxide
hydroxide
compound
partially solidified
Prior art date
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JP2012071182A
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English (en)
Japanese (ja)
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JP2013203767A (ja
Inventor
忠輔 亀井
忠輔 亀井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tateho Kagakukogyo KK
Original Assignee
Tateho Kagakukogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tateho Kagakukogyo KK filed Critical Tateho Kagakukogyo KK
Priority to JP2012071182A priority Critical patent/JP5877745B2/ja
Priority to CN201380017234.0A priority patent/CN104220520B/zh
Priority to KR1020147030081A priority patent/KR101966287B1/ko
Priority to MYPI2014702802A priority patent/MY168546A/en
Priority to PCT/JP2013/056719 priority patent/WO2013146222A1/ja
Priority to TW102109432A priority patent/TWI564246B/zh
Publication of JP2013203767A publication Critical patent/JP2013203767A/ja
Application granted granted Critical
Publication of JP5877745B2 publication Critical patent/JP5877745B2/ja
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Classifications

    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01GCOMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G9/00Compounds of zinc
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/30Particle morphology extending in three dimensions
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/61Micrometer sized, i.e. from 1-100 micrometer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2012071182A 2012-03-27 2012-03-27 複合金属水酸化物粒子、及びそれを含む樹脂組成物 Active JP5877745B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012071182A JP5877745B2 (ja) 2012-03-27 2012-03-27 複合金属水酸化物粒子、及びそれを含む樹脂組成物
CN201380017234.0A CN104220520B (zh) 2012-03-27 2013-03-12 复合金属氢氧化物颗粒、及含有其的树脂组合物
KR1020147030081A KR101966287B1 (ko) 2012-03-27 2013-03-12 복합 금속수산화물 입자 및 그것을 포함하는 수지조성물
MYPI2014702802A MY168546A (en) 2012-03-27 2013-03-12 Composite metal hydroxide particles and resin composition containing the same
PCT/JP2013/056719 WO2013146222A1 (ja) 2012-03-27 2013-03-12 複合金属水酸化物粒子、及びそれを含む樹脂組成物
TW102109432A TWI564246B (zh) 2012-03-27 2013-03-18 複合金屬氫氧化物粒子,及含有該粒子之樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012071182A JP5877745B2 (ja) 2012-03-27 2012-03-27 複合金属水酸化物粒子、及びそれを含む樹脂組成物

Publications (2)

Publication Number Publication Date
JP2013203767A JP2013203767A (ja) 2013-10-07
JP5877745B2 true JP5877745B2 (ja) 2016-03-08

Family

ID=49259490

Family Applications (1)

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JP2012071182A Active JP5877745B2 (ja) 2012-03-27 2012-03-27 複合金属水酸化物粒子、及びそれを含む樹脂組成物

Country Status (6)

Country Link
JP (1) JP5877745B2 (ko)
KR (1) KR101966287B1 (ko)
CN (1) CN104220520B (ko)
MY (1) MY168546A (ko)
TW (1) TWI564246B (ko)
WO (1) WO2013146222A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5952676B2 (ja) * 2012-04-27 2016-07-13 花王株式会社 疎水化処理した酸化亜鉛粒子の製造方法
KR102634294B1 (ko) * 2019-09-27 2024-02-07 주식회사 엘지화학 난연 조제의 제조 방법 및 그 제조 방법에 의해 제조된 난연 조제를 포함하는 난연성 수지 조성물

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH085990B2 (ja) * 1991-02-06 1996-01-24 株式会社海水化学研究所 難燃剤、および難燃性樹脂および/またはゴム組成物
US5401442A (en) * 1991-02-06 1995-03-28 Kabushiki Kaisha Kaisui Kagau Kenkyujo Composite metal hydroxide and its use
JP3154535B2 (ja) * 1991-12-24 2001-04-09 株式会社海水化学研究所 複合金属水酸化物およびその使用
JP3086566B2 (ja) * 1993-05-06 2000-09-11 株式会社海水化学研究所 安定化された含ハロゲン樹脂組成物
IN189465B (ko) * 1995-08-03 2003-03-01 Tateho Kagaku Kogyo Kk
JP3432134B2 (ja) * 1997-04-21 2003-08-04 タテホ化学工業株式会社 金属水酸化物固溶体および金属酸化物固溶体ならびにこれらの製法
EP0978542B1 (en) * 1997-04-21 2007-10-24 Nitto Denko Corporation Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor device
JP2001192533A (ja) * 2000-01-14 2001-07-17 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2002003848A (ja) * 2000-04-12 2002-01-09 Mizusawa Ind Chem Ltd 難燃剤
JP2002348574A (ja) * 2001-05-25 2002-12-04 Sakai Chem Ind Co Ltd 難燃剤とその製造方法とそれを含む難燃性樹脂組成物
JP2003064185A (ja) * 2001-08-27 2003-03-05 Sumitomo Bakelite Co Ltd エポキシ樹脂成形材料の製造方法及び半導体装置
JP4189492B2 (ja) 2004-03-22 2008-12-03 独立行政法人物質・材料研究機構 層状複水酸化物/ゼオライト複合体
JP4997704B2 (ja) * 2005-02-24 2012-08-08 富士ゼロックス株式会社 表面被覆難燃性粒子及びその製造方法、並びに難燃性樹脂組成物及びその製造方法
JP4774236B2 (ja) * 2005-04-28 2011-09-14 タテホ化学工業株式会社 水酸化マグネシウム粒子及びその製造方法及びそれを含む樹脂組成物
CN101905861A (zh) * 2009-06-05 2010-12-08 北京化工大学 一种纳米层状复合金属氢氧化物的制备方法

Also Published As

Publication number Publication date
CN104220520A (zh) 2014-12-17
MY168546A (en) 2018-11-12
TW201343553A (zh) 2013-11-01
KR20140139599A (ko) 2014-12-05
KR101966287B1 (ko) 2019-04-05
JP2013203767A (ja) 2013-10-07
TWI564246B (zh) 2017-01-01
WO2013146222A1 (ja) 2013-10-03
CN104220520B (zh) 2016-06-22

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