JP5873446B2 - Rfモジュール - Google Patents
Rfモジュール Download PDFInfo
- Publication number
- JP5873446B2 JP5873446B2 JP2013000720A JP2013000720A JP5873446B2 JP 5873446 B2 JP5873446 B2 JP 5873446B2 JP 2013000720 A JP2013000720 A JP 2013000720A JP 2013000720 A JP2013000720 A JP 2013000720A JP 5873446 B2 JP5873446 B2 JP 5873446B2
- Authority
- JP
- Japan
- Prior art keywords
- signal
- core
- wiring
- signal wiring
- module according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 claims description 80
- 239000000758 substrate Substances 0.000 claims description 70
- 239000002184 metal Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 230000005540 biological transmission Effects 0.000 claims description 21
- 238000001914 filtration Methods 0.000 claims description 2
- 230000000052 comparative effect Effects 0.000 description 7
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/003—Coplanar lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0046—Printed inductances with a conductive path having a bridge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Waveguides (AREA)
- Coils Or Transformers For Communication (AREA)
Description
Code Division Multiple Access)方式に対応するGHz帯の周波数、又はGSM(登録商標、Global System for
Mobile Communications)方式に対応する数百MHzの周波数を有するRF(Radio Frequency)信号等を含むものである。高周波信号以外の信号とは、例えば数Hz〜数十MHz程度の周波数を有する信号、又は直流信号等である。
絶縁層20の厚さt1:25μm
コア10の厚さt4:150μm
信号配線14aの線幅w:30μm
距離L1、L2、L3、L4:60μm
絶縁層20〜26各々の誘電率:3.4
コア10、導体層12〜18の材質:銅
Gain Amplifier:可変利得アンプ)62a〜62jを含む。IC60は、信号の周波数の変換を行う、ダイレクトコンバータとして機能する。
Acoustic Wave:弾性表面波)フィルタ、弾性境界波フィルタ、又はFBAR(Film Bulk Acoustic Resonator:圧電薄膜共振子)を用いたフィルタ等、弾性波フィルタとすることができる。
10a、10b 凹部
10c、10d、10e 金属板
12、14、16、18 導体層
20、22、24、26 絶縁層
12a、12b、12c、14a、14d、14e、14f、14g、15
信号配線
12d、14b、14c 接地配線
30 電子部品
40a、40b、40c、40d、40e、40f デュプレクサ
42 受信フィルタ
44 送信フィルタ
50 フィルタ回路
52 フィルタ
60 IC
100、100a、100b、200、300、400 多層基板
202 アンテナ
Claims (13)
- アンテナに接続される端子と、
複数の絶縁層と複数の導体層とを積層した多層基板における前記複数の導体層のうち接地配線として機能するコアと、
前記複数の導体層に含まれ、前記複数の絶縁層に含まれる第1絶縁層を介して前記コアに隣接し、アンテナで送受信される周波数の高周波信号を流すための第1信号配線と、
前記コアの前記第1信号配線と対向する領域に設けられ、前記第1絶縁層で埋め込まれ、前記第1信号配線を含み平面視において前記第1信号配線の延伸方向に延伸する凹部と、
前記高周波信号をフィルタリングするフィルタと、を具備し、
前記コアの前記凹部及び前記第1信号配線は所定の特性インピーダンスを有する伝送線路を形成し、前記伝送線路は前記フィルタに接続され、前記高周波信号を伝送することを特徴とするRFモジュール。 - 前記伝送線路は、前記フィルタと前記高周波信号を増幅する集積回路との間に設けられることを特徴とする請求項1記載のRFモジュール。
- 前記高周波信号が入力及び出力する複数のデュプレクサを具備し、
前記コア及び前記第1信号配線が形成する伝送線路は、前記複数のデュプレクサと接続されていることを特徴とする請求項1又は2記載のRFモジュール。 - 前記複数のデュプレクサが、前記アンテナに接続されるスイッチと接続されることを特徴とする請求項3記載のRFモジュール。
- 前記複数の導体層に含まれ、前記第1信号配線を挟んで、前記コアとは反対側に設けられた、前記コアとは別の第1接地配線を具備することを特徴とする請求項1から4いずれか一項記載のRFモジュール。
- 前記コアは、電子部品の少なくとも一部を収納することを特徴とする請求項1から5いずれか一項記載のRFモジュール。
- 前記第1接地配線は、前記複数の絶縁層に含まれ前記第1絶縁層とは別の第2絶縁層を介して前記第1信号配線と隣接することを特徴とする請求項5記載のRFモジュール。
- 前記複数の導体層のうち前記第1信号配線と同じ平面に位置する導体層に含まれ、前記第1信号配線の両側に位置する第2接地配線を具備することを特徴とする請求項1から7いずれか一項記載のRFモジュール。
- 前記第2接地配線と前記第1信号配線との距離は、前記複数の絶縁層と前記複数の導体層との積層方向に前記第1信号配線を前記コアに投影した投影領域と、前記凹部の側面との距離以上であることを特徴とする請求項8記載のRFモジュール。
- 前記複数の導体層に含まれ、前記コアを挟んで、前記第1信号配線とは反対側に設けられた、前記第1信号配線とは別の第2信号配線を具備することを特徴とする請求項1から9いずれか一項記載のRFモジュール。
- 前記コアを挟んで前記第1信号配線と反対側に設けられた、高周波信号を流すための第3信号配線を具備し、
前記コアの前記第3信号配線と対向する領域には、別の凹部が設けられていることを特徴とする請求項1から10いずれか一項記載のRFモジュール。 - 前記コアは、第1金属板と、開口部を有する第2金属板とを貼り合わせて形成されていることを特徴とする請求項1から11いずれか一項記載のRFモジュール。
- 前記第1信号配線の平面視における幅は延伸方向において一定であり、前記第1信号配線と前記凹部の平面視における間隔は延伸方向において一定であることを特徴とする請求項1から12のいずれか一項記載のRFモジュール。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013000720A JP5873446B2 (ja) | 2011-05-27 | 2013-01-07 | Rfモジュール |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011119512 | 2011-05-27 | ||
JP2011119512 | 2011-05-27 | ||
JP2013000720A JP5873446B2 (ja) | 2011-05-27 | 2013-01-07 | Rfモジュール |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011233277A Division JP5178899B2 (ja) | 2011-05-27 | 2011-10-24 | 多層基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013146062A JP2013146062A (ja) | 2013-07-25 |
JP5873446B2 true JP5873446B2 (ja) | 2016-03-01 |
Family
ID=45560423
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011233277A Expired - Fee Related JP5178899B2 (ja) | 2011-05-27 | 2011-10-24 | 多層基板 |
JP2013000720A Expired - Fee Related JP5873446B2 (ja) | 2011-05-27 | 2013-01-07 | Rfモジュール |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011233277A Expired - Fee Related JP5178899B2 (ja) | 2011-05-27 | 2011-10-24 | 多層基板 |
Country Status (7)
Country | Link |
---|---|
US (2) | US8735732B2 (ja) |
JP (2) | JP5178899B2 (ja) |
KR (1) | KR101222257B1 (ja) |
CN (1) | CN102802341B (ja) |
DE (1) | DE102011121221A1 (ja) |
GB (1) | GB2491217B (ja) |
TW (1) | TWI445464B (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5306551B1 (ja) * | 2012-11-27 | 2013-10-02 | 太陽誘電株式会社 | 多層回路基板 |
JP6250934B2 (ja) * | 2013-01-25 | 2017-12-20 | 太陽誘電株式会社 | モジュール基板及びモジュール |
US9277641B2 (en) | 2013-04-04 | 2016-03-01 | Qualcomm Incorporated | Routing and shielding of signal lines to improve isolation |
US9400529B2 (en) * | 2013-09-27 | 2016-07-26 | Apple Inc. | Electronic device having housing with embedded interconnects |
US9729215B2 (en) | 2014-06-23 | 2017-08-08 | Samsung Electronics Co., Ltd. | OFDM signal compression |
US9391370B2 (en) * | 2014-06-30 | 2016-07-12 | Samsung Electronics Co., Ltd. | Antenna feed integrated on multi-layer PCB |
US20170092412A1 (en) * | 2015-09-26 | 2017-03-30 | Mathew J. Manusharow | Package integrated power inductors using lithographically defined vias |
WO2017154167A1 (ja) * | 2016-03-10 | 2017-09-14 | 三井金属鉱業株式会社 | 多層積層板及びこれを用いた多層プリント配線板の製造方法 |
US10447834B2 (en) | 2016-09-21 | 2019-10-15 | Apple Inc. | Electronic device having a composite structure |
CN107318220B (zh) * | 2017-08-21 | 2019-12-03 | Oppo广东移动通信有限公司 | 印制电路板和电子设备 |
CN107318219B (zh) * | 2017-08-21 | 2019-12-31 | Oppo广东移动通信有限公司 | 印制电路板和电子设备 |
CN107404802B (zh) * | 2017-08-21 | 2020-01-31 | Oppo广东移动通信有限公司 | 印制电路板、印制电路板的制作方法和电子设备 |
CN107404803B (zh) * | 2017-08-21 | 2019-12-03 | Oppo广东移动通信有限公司 | 印制电路板和电子设备 |
TWI696197B (zh) * | 2018-11-21 | 2020-06-11 | 貿聯國際股份有限公司 | 高頻軟性扁平排線 |
EP3855872A1 (en) | 2020-01-22 | 2021-07-28 | Delta Electronics (Shanghai) Co., Ltd. | Carrier board comprising a metal block |
US11350519B2 (en) | 2020-01-22 | 2022-05-31 | Delta Electronics (Shanghai) Co., Ltd. | Power module |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06188572A (ja) * | 1992-12-18 | 1994-07-08 | Sumitomo Bakelite Co Ltd | 金属コア入りプリント配線基板 |
JP2000101245A (ja) * | 1998-09-24 | 2000-04-07 | Ngk Spark Plug Co Ltd | 積層樹脂配線基板及びその製造方法 |
JP3809053B2 (ja) * | 2000-01-20 | 2006-08-16 | 新光電気工業株式会社 | 電子部品パッケージ |
US6499214B2 (en) * | 2000-05-26 | 2002-12-31 | Visteon Global Tech, Inc. | Method of making a circuit board |
US6744135B2 (en) * | 2001-05-22 | 2004-06-01 | Hitachi, Ltd. | Electronic apparatus |
JP2003264348A (ja) * | 2002-03-07 | 2003-09-19 | Sony Corp | 高周波モジュール |
JP3953900B2 (ja) * | 2002-06-27 | 2007-08-08 | 日本特殊陶業株式会社 | 積層樹脂配線基板及びその製造方法 |
JP2004228344A (ja) * | 2003-01-23 | 2004-08-12 | Oki Electric Cable Co Ltd | 多層fpc |
JP4418250B2 (ja) | 2004-02-05 | 2010-02-17 | 株式会社ルネサステクノロジ | 高周波回路モジュール |
JP4339739B2 (ja) * | 2004-04-26 | 2009-10-07 | 太陽誘電株式会社 | 部品内蔵型多層基板 |
JP2006074014A (ja) | 2004-08-06 | 2006-03-16 | Toyota Industries Corp | 多層プリント基板、及びマイクロストリップラインのインピーダンス管理方法 |
JP4341588B2 (ja) | 2005-06-09 | 2009-10-07 | 株式会社デンソー | 多層基板及びその製造方法 |
JP2007174075A (ja) * | 2005-12-20 | 2007-07-05 | Shinko Electric Ind Co Ltd | 差動伝送路構造および配線基板 |
JP2007189152A (ja) | 2006-01-16 | 2007-07-26 | Toshiba Corp | 誘電体多層基板構造と配線パターンの特性インピーダンス調整方法 |
JP2008125038A (ja) * | 2006-11-16 | 2008-05-29 | Shinko Electric Ind Co Ltd | 高周波用基板構造及び高周波用パッケージ |
US8314343B2 (en) | 2007-09-05 | 2012-11-20 | Taiyo Yuden Co., Ltd. | Multi-layer board incorporating electronic component and method for producing the same |
JP4551468B2 (ja) * | 2007-09-05 | 2010-09-29 | 太陽誘電株式会社 | 電子部品内蔵型多層基板 |
TWI350655B (en) | 2008-03-20 | 2011-10-11 | Ind Tech Res Inst | Circuit device with inductor and capacitor in parallel connection |
JP2010010765A (ja) * | 2008-06-24 | 2010-01-14 | Hitachi Media Electoronics Co Ltd | 移動通信端末用電子回路モジュール及びこれを備えた移動通信端末用回路 |
-
2011
- 2011-10-24 JP JP2011233277A patent/JP5178899B2/ja not_active Expired - Fee Related
- 2011-12-13 KR KR1020110133641A patent/KR101222257B1/ko active IP Right Grant
- 2011-12-14 GB GB1121453.3A patent/GB2491217B/en not_active Expired - Fee Related
- 2011-12-15 DE DE102011121221A patent/DE102011121221A1/de not_active Withdrawn
- 2011-12-16 TW TW100146946A patent/TWI445464B/zh not_active IP Right Cessation
- 2011-12-20 US US13/331,306 patent/US8735732B2/en not_active Expired - Fee Related
-
2012
- 2012-01-17 CN CN201210015359.7A patent/CN102802341B/zh not_active Expired - Fee Related
-
2013
- 2013-01-07 JP JP2013000720A patent/JP5873446B2/ja not_active Expired - Fee Related
- 2013-12-13 US US14/106,517 patent/US9107305B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2013012699A (ja) | 2013-01-17 |
GB2491217B (en) | 2015-07-08 |
US8735732B2 (en) | 2014-05-27 |
DE102011121221A1 (de) | 2012-11-29 |
GB2491217A (en) | 2012-11-28 |
TWI445464B (zh) | 2014-07-11 |
TW201249265A (en) | 2012-12-01 |
GB201121453D0 (en) | 2012-01-25 |
US20120300416A1 (en) | 2012-11-29 |
US9107305B2 (en) | 2015-08-11 |
JP5178899B2 (ja) | 2013-04-10 |
JP2013146062A (ja) | 2013-07-25 |
US20140104801A1 (en) | 2014-04-17 |
KR20120132293A (ko) | 2012-12-05 |
CN102802341A (zh) | 2012-11-28 |
CN102802341B (zh) | 2016-04-06 |
KR101222257B1 (ko) | 2013-01-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5873446B2 (ja) | Rfモジュール | |
US7978031B2 (en) | High frequency module provided with power amplifier | |
JP4579198B2 (ja) | 多層帯域通過フィルタ | |
US9413336B2 (en) | Multiband-support radio-frequency module | |
JP4450079B2 (ja) | 高周波モジュール | |
WO2018079614A1 (ja) | 方向性結合器内蔵基板、高周波フロントエンド回路及び通信装置 | |
JP6098842B2 (ja) | 方向性結合器および無線通信装置 | |
JP5422078B1 (ja) | 高周波回路モジュール | |
JP4492708B2 (ja) | 高周波モジュール | |
JPWO2013047358A1 (ja) | 高周波モジュール | |
KR102452114B1 (ko) | 고주파 모듈 및 통신 장치 | |
JP4593503B2 (ja) | 偶高調波ミクサおよびそのバンドパスフィルタ | |
JP4901823B2 (ja) | フィルタ装置、これを用いた無線通信モジュール及び無線通信機器 | |
JP5787123B2 (ja) | 方向性結合器および無線通信装置 | |
US7583165B2 (en) | High Q cavity resonators for microelectronics | |
JP5979402B2 (ja) | 方向性結合器および無線通信装置 | |
JP4502019B2 (ja) | 高周波モジュール | |
US20230077950A1 (en) | Filter device and multiplexer | |
JP4381933B2 (ja) | 高周波モジュール及び無線通信装置 | |
JP2015109320A (ja) | インダクタ装置および高周波モジュール | |
JP2004266673A (ja) | 高周波電力増幅器 | |
JP2005217581A (ja) | 高周波電力増幅モジュール、高周波モジュール及び無線通信装置 | |
KR20040107991A (ko) | 용적 탄성파 공진기 듀플렉서 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20141007 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20150914 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150929 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20151124 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20151222 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160115 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5873446 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |