JP5869560B2 - カソードユニット - Google Patents

カソードユニット Download PDF

Info

Publication number
JP5869560B2
JP5869560B2 JP2013511870A JP2013511870A JP5869560B2 JP 5869560 B2 JP5869560 B2 JP 5869560B2 JP 2013511870 A JP2013511870 A JP 2013511870A JP 2013511870 A JP2013511870 A JP 2013511870A JP 5869560 B2 JP5869560 B2 JP 5869560B2
Authority
JP
Japan
Prior art keywords
backing plate
base material
cathode unit
main surface
target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013511870A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2012147228A1 (ja
Inventor
哲宏 大野
哲宏 大野
重光 佐藤
重光 佐藤
弘樹 大空
弘樹 大空
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP2013511870A priority Critical patent/JP5869560B2/ja
Publication of JPWO2012147228A1 publication Critical patent/JPWO2012147228A1/ja
Application granted granted Critical
Publication of JP5869560B2 publication Critical patent/JP5869560B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP2013511870A 2011-04-26 2011-11-21 カソードユニット Active JP5869560B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013511870A JP5869560B2 (ja) 2011-04-26 2011-11-21 カソードユニット

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011098427 2011-04-26
JP2011098427 2011-04-26
PCT/JP2011/076759 WO2012147228A1 (ja) 2011-04-26 2011-11-21 カソードユニット
JP2013511870A JP5869560B2 (ja) 2011-04-26 2011-11-21 カソードユニット

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016001285A Division JP6069540B2 (ja) 2011-04-26 2016-01-06 カソードユニット

Publications (2)

Publication Number Publication Date
JPWO2012147228A1 JPWO2012147228A1 (ja) 2014-07-28
JP5869560B2 true JP5869560B2 (ja) 2016-02-24

Family

ID=47071766

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2013511870A Active JP5869560B2 (ja) 2011-04-26 2011-11-21 カソードユニット
JP2016001285A Active JP6069540B2 (ja) 2011-04-26 2016-01-06 カソードユニット

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2016001285A Active JP6069540B2 (ja) 2011-04-26 2016-01-06 カソードユニット

Country Status (5)

Country Link
JP (2) JP5869560B2 (ko)
KR (3) KR20170104160A (ko)
CN (2) CN103459653B (ko)
TW (1) TWI495745B (ko)
WO (1) WO2012147228A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190022767A (ko) 2017-06-28 2019-03-06 가부시키가이샤 아루박 스퍼터 장치
KR20190022768A (ko) 2017-06-29 2019-03-06 가부시키가이샤 아루박 성막 장치

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019210517A (ja) * 2018-06-05 2019-12-12 株式会社アルバック スパッタリング装置及び成膜方法
KR20210036064A (ko) 2019-09-25 2021-04-02 이현우 휴대용 보조배터리
KR20220095642A (ko) 2020-12-30 2022-07-07 전찬희 보조배터리발찌

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59143067A (ja) * 1983-02-02 1984-08-16 Matsushita Electric Ind Co Ltd スパツタリング装置
US6224718B1 (en) * 1999-07-14 2001-05-01 Veeco Instruments, Inc. Target assembly for ion beam sputter deposition with multiple paddles each having targets on both sides
JP2003147519A (ja) * 2001-11-05 2003-05-21 Anelva Corp スパッタリング装置
JP2004292871A (ja) * 2003-03-26 2004-10-21 Japan Aviation Electronics Industry Ltd イオンビームスパッタ装置
JP2006233240A (ja) * 2005-02-22 2006-09-07 Canon Inc スパッタ用カソード及びスパッタ装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4175030A (en) * 1977-12-08 1979-11-20 Battelle Development Corporation Two-sided planar magnetron sputtering apparatus
GB2051877B (en) * 1979-04-09 1983-03-02 Vac Tec Syst Magnetically enhanced sputtering device and method
JPH0734236A (ja) * 1993-07-19 1995-02-03 Canon Inc 直流スパッタリング装置およびスパッタリング方法
JP2002030430A (ja) * 2000-07-17 2002-01-31 Sony Corp スパッタ装置
JP4071520B2 (ja) * 2002-03-29 2008-04-02 キヤノンアネルバ株式会社 スパッタリング装置
JP2003328119A (ja) 2002-05-14 2003-11-19 Ulvac Japan Ltd スパッタカソード
CN1439740A (zh) * 2002-05-22 2003-09-03 甘肃工业大学 双面溅射的平面磁控溅射阴极
JP4246547B2 (ja) * 2003-05-23 2009-04-02 株式会社アルバック スパッタリング装置、及びスパッタリング方法
KR101275924B1 (ko) * 2006-05-22 2013-06-14 엘지디스플레이 주식회사 스퍼터링 장치, 그 구동 방법 및 이를 이용한 패널 제조방법
JP5265149B2 (ja) * 2006-07-21 2013-08-14 アプライド マテリアルズ インコーポレイテッド マルチカソード設計用冷却暗部シールド
WO2009025258A1 (ja) 2007-08-20 2009-02-26 Ulvac, Inc. スパッタリング方法及びスパッタリング装置
TWI518194B (zh) * 2007-08-20 2016-01-21 Ulvac Inc Sputtering method
WO2010038271A1 (ja) * 2008-09-30 2010-04-08 キヤノンアネルバ株式会社 スパッタリング装置および薄膜形成方法
TW201038759A (en) * 2009-04-30 2010-11-01 Hon Hai Prec Ind Co Ltd Magnetron sputtering apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59143067A (ja) * 1983-02-02 1984-08-16 Matsushita Electric Ind Co Ltd スパツタリング装置
US6224718B1 (en) * 1999-07-14 2001-05-01 Veeco Instruments, Inc. Target assembly for ion beam sputter deposition with multiple paddles each having targets on both sides
JP2003147519A (ja) * 2001-11-05 2003-05-21 Anelva Corp スパッタリング装置
JP2004292871A (ja) * 2003-03-26 2004-10-21 Japan Aviation Electronics Industry Ltd イオンビームスパッタ装置
JP2006233240A (ja) * 2005-02-22 2006-09-07 Canon Inc スパッタ用カソード及びスパッタ装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190022767A (ko) 2017-06-28 2019-03-06 가부시키가이샤 아루박 스퍼터 장치
US11473188B2 (en) 2017-06-28 2022-10-18 Ulvac, Inc. Sputtering apparatus
KR20190022768A (ko) 2017-06-29 2019-03-06 가부시키가이샤 아루박 성막 장치
US11842887B2 (en) 2017-06-29 2023-12-12 Ulvac, Inc. Film formation apparatus

Also Published As

Publication number Publication date
JP6069540B2 (ja) 2017-02-01
TWI495745B (zh) 2015-08-11
WO2012147228A1 (ja) 2012-11-01
JPWO2012147228A1 (ja) 2014-07-28
JP2016041855A (ja) 2016-03-31
TW201243076A (en) 2012-11-01
KR20160008660A (ko) 2016-01-22
CN103459653A (zh) 2013-12-18
KR20130133015A (ko) 2013-12-05
CN103459653B (zh) 2016-05-04
CN105671500A (zh) 2016-06-15
KR20170104160A (ko) 2017-09-14
CN105671500B (zh) 2018-10-12

Similar Documents

Publication Publication Date Title
JP6069540B2 (ja) カソードユニット
JP5960384B2 (ja) 静電チャック用基板及び静電チャック
JP7426773B2 (ja) 物理的気相堆積処理システムのターゲットの冷却
JP2002220661A (ja) スパッタリング装置に用いられるバッキングプレートおよびスパッタリング方法
KR20180011151A (ko) 마그네트론 스퍼터링 장치
JP5721817B2 (ja) カソード
TW202219298A (zh) 濺鍍裝置
JP5721815B2 (ja) ターゲット及びターゲットの製造方法
JP2007051337A (ja) スパッタ電極及びスパッタ電極を備えたスパッタリング装置
JP2004270019A (ja) 分割スパッタリングターゲット
JP4698055B2 (ja) 高周波マグネトロンスパッタリング装置
JP7044887B2 (ja) スパッタリング装置
JP6624585B2 (ja) スパッタリングターゲット−バッキングプレート接合体
JP6328089B2 (ja) プラズマスパッタ装置
JP7362327B2 (ja) ターゲット構造体及び成膜装置
JP2011089146A (ja) スパッタリング装置およびスパッタリング方法
JP4877058B2 (ja) 対向ターゲットスパッタ装置及び方法
TW201437397A (zh) 物理蒸氣沉積系統

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140826

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150424

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150622

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150901

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150911

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20151208

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160107

R150 Certificate of patent or registration of utility model

Ref document number: 5869560

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250