JP5849135B2 - 導電性パターンの形成方法及び導電性パターン - Google Patents
導電性パターンの形成方法及び導電性パターン Download PDFInfo
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- JP5849135B2 JP5849135B2 JP2014182524A JP2014182524A JP5849135B2 JP 5849135 B2 JP5849135 B2 JP 5849135B2 JP 2014182524 A JP2014182524 A JP 2014182524A JP 2014182524 A JP2014182524 A JP 2014182524A JP 5849135 B2 JP5849135 B2 JP 5849135B2
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- VANNPISTIUFMLH-UHFFFAOYSA-N glutaric anhydride Chemical compound O=C1CCCC(=O)O1 VANNPISTIUFMLH-UHFFFAOYSA-N 0.000 description 1
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- 229910017604 nitric acid Inorganic materials 0.000 description 1
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- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
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- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing Of Electric Cables (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Conductive Materials (AREA)
Description
120:溝
130:導電性インク組成物
140:導電性パターン
Claims (8)
- 基板上に深さ方向に沿って入口領域の幅が内部領域の幅より大きく形成される溝を形成する溝形成段階と、
前記溝の内部に導電性インク組成物を充填する充填段階と、
前記溝内部の導電性インク組成物に含まれる溶媒が揮発して、前記導電性インク組成物の体積が縮小されるように乾燥する乾燥段階とを含み、
前記充填段階と前記乾燥段階との間に、または前記乾燥段階を行った後に、基板に残留する導電性インク組成物を前記溝内に再充填する再充填段階をさらに含み、
前記再充填段階は、基板表面に残留したインクを溶解させるように、前記基板表面にエッチング液を塗布する段階をさらに含むことを特徴とする導電性パターンの形成方法。 - 前記溝は、横断面の形状が台形、三角形、異なる傾斜角を有する傾斜面が連続的に連結される多角形、楕円形、半円形状、内側面が凹形状、内側面が凸形状のうちの少なくともいずれか1つであることを特徴とする請求項1に記載の導電性パターンの形成方法。
- 前記溝の床面が膨らむように形成されることを特徴とする請求項2に記載の導電性パターンの形成方法。
- 前記基板の表面と前記溝の内側面との間の角度の和は、185゜〜340゜の範囲内でなされることを特徴とする請求項2に記載の導電性パターンの形成方法。
- 前記導電性インク組成物は、導電性金属組成物として金属プレートまたは金属ナノ粒子のうち、少なくともいずれか1つを含み、前記導電性インク組成物100重量%において、前記導電性金属組成物は、30重量%〜90重量%であることを特徴とする請求項1に記載の導電性パターンの形成方法。
- 前記導電性インク組成物は、導電性金属組成物として金属錯体化合物または金属前駆体のうち、少なくともいずれか1つを含み、前記導電性インク組成物100重量%において、前記導電性金属組成物は、1重量%〜30重量%であることを特徴とする請求項1に記載の導電性パターンの形成方法。
- 前記導電性インク組成物は、導電性金属組成物として銀ナノワイヤーまたは炭素ナノチューブのうち、少なくともいずれか1つを含み、前記導電性インク組成物100重量%において、前記導電性金属組成物は、1重量%〜5重量%であることを特徴とする請求項1に記載の導電性パターンの形成方法。
- 前記充填段階で充填される前記導電性インク組成物の溶媒比率を調節して、前記乾燥段階で乾燥後、前記溝に充填される導電性インク組成物の体積を調節することを特徴とする請求項1に記載の導電性パターンの形成方法。
Applications Claiming Priority (2)
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KR10-2013-0107309 | 2013-09-06 | ||
KR1020130107309A KR101656452B1 (ko) | 2013-09-06 | 2013-09-06 | 전도성 패턴 형성 방법 및 전도성 패턴 |
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JP2015053485A JP2015053485A (ja) | 2015-03-19 |
JP5849135B2 true JP5849135B2 (ja) | 2016-01-27 |
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US (1) | US9832882B2 (ja) |
JP (1) | JP5849135B2 (ja) |
KR (1) | KR101656452B1 (ja) |
CN (1) | CN104425085B (ja) |
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KR100922810B1 (ko) | 2007-12-11 | 2009-10-21 | 주식회사 잉크테크 | 흑화 전도성 패턴의 제조방법 |
KR102399741B1 (ko) * | 2015-05-22 | 2022-05-20 | 삼성전자주식회사 | 디스플레이 모듈 및 그 제조 방법 |
KR20170018718A (ko) | 2015-08-10 | 2017-02-20 | 삼성전자주식회사 | 비정질 합금을 이용한 투명 전극 및 그 제조 방법 |
KR102086431B1 (ko) * | 2015-09-01 | 2020-03-09 | 한국전기연구원 | 투명유연전극의 제조장치 및 제조방법 |
JP7060289B2 (ja) | 2016-05-23 | 2022-04-26 | デイレル、イヴァン アラウジョ | スーパーキャパシタの製造のための製造プロセス、および、細線スーパーキャパシタの製造のための製造プロセス |
CN106803513B (zh) | 2017-01-03 | 2019-07-12 | 上海天马微电子有限公司 | 一种触摸传感器及其制作方法、触摸显示面板 |
CN108897450B (zh) * | 2018-06-30 | 2021-12-03 | 广州国显科技有限公司 | 触控面板及其制作方法、显示装置 |
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CN109493734B (zh) * | 2018-10-26 | 2020-09-08 | 深圳市华星光电半导体显示技术有限公司 | 像素电极的制作方法、显示面板 |
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WO2023095921A1 (ja) * | 2021-11-29 | 2023-06-01 | Tdk株式会社 | 配線体、及び表示装置 |
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KR101879576B1 (ko) * | 2011-06-29 | 2018-07-18 | 동우 화인켐 주식회사 | 오프셋 인쇄용 요판 세정액 조성물 및 이를 이용한 세정방법 |
JP5895474B2 (ja) * | 2011-11-22 | 2016-03-30 | 東ソー株式会社 | 導電性インク組成物 |
KR101555015B1 (ko) | 2012-12-28 | 2015-09-22 | 주식회사 잉크테크 | 전도성 패턴의 형성방법 |
CN103268780B (zh) | 2013-05-30 | 2015-07-08 | 南昌欧菲光科技有限公司 | 透明导电膜 |
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