JP5823117B2 - 異方性導電フィルム、接合体、及び接合体の製造方法 - Google Patents

異方性導電フィルム、接合体、及び接合体の製造方法 Download PDF

Info

Publication number
JP5823117B2
JP5823117B2 JP2010256057A JP2010256057A JP5823117B2 JP 5823117 B2 JP5823117 B2 JP 5823117B2 JP 2010256057 A JP2010256057 A JP 2010256057A JP 2010256057 A JP2010256057 A JP 2010256057A JP 5823117 B2 JP5823117 B2 JP 5823117B2
Authority
JP
Japan
Prior art keywords
circuit member
anisotropic conductive
conductive film
film
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010256057A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011049184A (ja
Inventor
慎一 林
慎一 林
佐藤　伸一
伸一 佐藤
浩史 浜地
浩史 浜地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2010256057A priority Critical patent/JP5823117B2/ja
Publication of JP2011049184A publication Critical patent/JP2011049184A/ja
Priority to KR1020127017685A priority patent/KR101344965B1/ko
Priority to PCT/JP2011/074265 priority patent/WO2012066897A1/ja
Priority to CN2011800104715A priority patent/CN102782945A/zh
Priority to TW100139348A priority patent/TWI503394B/zh
Application granted granted Critical
Publication of JP5823117B2 publication Critical patent/JP5823117B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Combinations Of Printed Boards (AREA)
JP2010256057A 2010-11-16 2010-11-16 異方性導電フィルム、接合体、及び接合体の製造方法 Active JP5823117B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010256057A JP5823117B2 (ja) 2010-11-16 2010-11-16 異方性導電フィルム、接合体、及び接合体の製造方法
KR1020127017685A KR101344965B1 (ko) 2010-11-16 2011-10-21 이방성 도전 필름, 접합체, 및 접합체의 제조 방법
PCT/JP2011/074265 WO2012066897A1 (ja) 2010-11-16 2011-10-21 異方性導電フィルム、接合体、及び接合体の製造方法
CN2011800104715A CN102782945A (zh) 2010-11-16 2011-10-21 异向性导电膜、接合体以及接合体制造方法
TW100139348A TWI503394B (zh) 2010-11-16 2011-10-28 異方性導電膜、接合體、及接合體之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010256057A JP5823117B2 (ja) 2010-11-16 2010-11-16 異方性導電フィルム、接合体、及び接合体の製造方法

Publications (2)

Publication Number Publication Date
JP2011049184A JP2011049184A (ja) 2011-03-10
JP5823117B2 true JP5823117B2 (ja) 2015-11-25

Family

ID=43835282

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010256057A Active JP5823117B2 (ja) 2010-11-16 2010-11-16 異方性導電フィルム、接合体、及び接合体の製造方法

Country Status (5)

Country Link
JP (1) JP5823117B2 (ko)
KR (1) KR101344965B1 (ko)
CN (1) CN102782945A (ko)
TW (1) TWI503394B (ko)
WO (1) WO2012066897A1 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5685473B2 (ja) * 2011-04-06 2015-03-18 デクセリアルズ株式会社 異方性導電フィルム、接合体の製造方法、及び接合体
JP5672201B2 (ja) 2011-09-07 2015-02-18 デクセリアルズ株式会社 異方性導電フィルム及び接続構造体の製造方法
CN103131226B (zh) * 2013-01-23 2017-08-01 长兴材料工业股份有限公司 涂料组合物及其用途
JP5956362B2 (ja) * 2013-02-19 2016-07-27 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
JP5975930B2 (ja) * 2013-04-16 2016-08-23 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
JP6330346B2 (ja) * 2014-01-29 2018-05-30 日立化成株式会社 接着剤組成物、接着剤組成物を用いた電子部材、及び半導体装置の製造方法
CN107001865B (zh) * 2014-11-12 2020-08-21 迪睿合株式会社 光固化类各向异性导电粘接剂、连接体的制造方法及电子部件的连接方法
JP2017098077A (ja) * 2015-11-24 2017-06-01 デクセリアルズ株式会社 異方性導電フィルム、及び接続方法
JP7234032B2 (ja) * 2019-05-15 2023-03-07 デクセリアルズ株式会社 接着フィルムの製造方法、接着フィルム、及び接続体の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5247968B2 (ja) * 2003-12-02 2013-07-24 日立化成株式会社 回路接続材料、及びこれを用いた回路部材の接続構造
CN1918708B (zh) * 2004-02-06 2013-07-17 株式会社半导体能源研究所 半导体装置
CN100531528C (zh) * 2004-05-27 2009-08-19 揖斐电株式会社 多层印刷配线板
JP2007112949A (ja) * 2005-10-24 2007-05-10 Sumitomo Electric Ind Ltd 異方導電性接着剤
JP5181220B2 (ja) * 2007-04-19 2013-04-10 日立化成株式会社 回路接続用接着フィルム、接続構造体及びその製造方法
JP2008291199A (ja) * 2007-04-23 2008-12-04 Hitachi Chem Co Ltd 回路接続材料およびそれを用いた接続構造体
JP5131109B2 (ja) * 2007-09-20 2013-01-30 東レ株式会社 電子部品用接着剤組成物およびそれを用いた電子部品用接着剤シート
JP2009194359A (ja) * 2008-01-16 2009-08-27 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路部材の接続構造及び回路部材の接続方法
WO2010004793A1 (ja) * 2008-07-11 2010-01-14 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電フィルム
JP2011198779A (ja) * 2008-07-22 2011-10-06 Sharp Corp 電子回路装置、その製造方法及び表示装置

Also Published As

Publication number Publication date
CN102782945A (zh) 2012-11-14
WO2012066897A1 (ja) 2012-05-24
KR20120106789A (ko) 2012-09-26
TW201221613A (en) 2012-06-01
KR101344965B1 (ko) 2013-12-24
JP2011049184A (ja) 2011-03-10
TWI503394B (zh) 2015-10-11

Similar Documents

Publication Publication Date Title
JP5823117B2 (ja) 異方性導電フィルム、接合体、及び接合体の製造方法
JP5685473B2 (ja) 異方性導電フィルム、接合体の製造方法、及び接合体
JP5226562B2 (ja) 異方性導電フィルム、並びに、接合体及びその製造方法
KR101085722B1 (ko) 접속 필름, 및 접합체 및 그 제조 방법
JP5833809B2 (ja) 異方性導電フィルム、接合体及び接続方法
KR101383933B1 (ko) 접착제 조성물 및 그의 용도, 및 회로 부재의 접속 구조체 및 그의 제조 방법
JP7347576B2 (ja) 接着剤フィルム
JP2009096851A (ja) 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法
KR101994507B1 (ko) 이방성 도전 재료를 사용한 접속 방법 및 이방성 도전 접합체
KR102114802B1 (ko) 이방성 도전 필름, 접속 방법 및 접합체
JP5956362B2 (ja) 異方性導電フィルム、接続方法、及び接合体
JP5052050B2 (ja) 電極接続用接着剤及びこれを用いた微細電極の接続構造
JP5816456B2 (ja) 異方性導電接続材料、フィルム積層体、接続方法及び接続構造体
JP5315031B2 (ja) 異方性導電フィルム、並びに、接合体及びその製造方法
KR20120022580A (ko) 실장체의 제조 방법, 접속 방법 및 이방성 도전막
JP2015135949A (ja) 実装体の製造方法、及び異方性導電フィルム
WO2011132578A1 (ja) 異方性導電フィルム、接合体及び接続方法
JP6442628B2 (ja) 異方性導電フィルム、並びに、接合体の製造方法及び接合体
WO2016052130A1 (ja) 異方性導電フィルム、及び接続方法
JP6027812B2 (ja) 回路接続材料
JP4240460B2 (ja) 接着剤、接着剤の製造方法及び電気装置
JP6280017B2 (ja) 異方性導電フィルム、並びに、接続方法及び接合体
JP5966069B2 (ja) 異方性導電フィルム、接合体及び接続方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130904

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140812

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140912

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20141021

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150116

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150130

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20150204

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20150220

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150827

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20151007

R150 Certificate of patent or registration of utility model

Ref document number: 5823117

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250