JP5816394B1 - Itoスパッタリングターゲット材およびその製造方法 - Google Patents

Itoスパッタリングターゲット材およびその製造方法 Download PDF

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JP5816394B1
JP5816394B1 JP2015526439A JP2015526439A JP5816394B1 JP 5816394 B1 JP5816394 B1 JP 5816394B1 JP 2015526439 A JP2015526439 A JP 2015526439A JP 2015526439 A JP2015526439 A JP 2015526439A JP 5816394 B1 JP5816394 B1 JP 5816394B1
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ito
sintered body
firing
powder
temperature
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JPWO2015125588A1 (ja
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享祐 寺村
享祐 寺村
朋哉 武内
朋哉 武内
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Mitsui Mining and Smelting Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
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    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/62605Treating the starting powders individually or as mixtures
    • C04B35/62695Granulation or pelletising
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • C23C14/086Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3286Gallium oxides, gallates, indium oxides, indates, thallium oxides, thallates or oxide forming salts thereof, e.g. zinc gallate
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    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3293Tin oxides, stannates or oxide forming salts thereof, e.g. indium tin oxide [ITO]
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    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/50Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
    • C04B2235/54Particle size related information
    • C04B2235/5409Particle size related information expressed by specific surface values
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    • C04B2235/604Pressing at temperatures other than sintering temperatures
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    • C04B2235/656Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
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    • C04B2235/65Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658Atmosphere during thermal treatment
    • C04B2235/6583Oxygen containing atmosphere, e.g. with changing oxygen pressures
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74Physical characteristics
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    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74Physical characteristics
    • C04B2235/78Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures
    • C04B2235/786Micrometer sized grains, i.e. from 1 to 100 micron
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/80Phases present in the sintered or melt-cast ceramic products other than the main phase
    • C04B2235/85Intergranular or grain boundary phases

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  • Chemical & Material Sciences (AREA)
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  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Structural Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Compositions Of Oxide Ceramics (AREA)
JP2015526439A 2014-02-18 2015-01-30 Itoスパッタリングターゲット材およびその製造方法 Active JP5816394B1 (ja)

Priority Applications (1)

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JP2015526439A JP5816394B1 (ja) 2014-02-18 2015-01-30 Itoスパッタリングターゲット材およびその製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014028543 2014-02-18
JP2014028543 2014-02-18
JP2015526439A JP5816394B1 (ja) 2014-02-18 2015-01-30 Itoスパッタリングターゲット材およびその製造方法
PCT/JP2015/052688 WO2015125588A1 (ja) 2014-02-18 2015-01-30 Itoスパッタリングターゲット材およびその製造方法

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JP5816394B1 true JP5816394B1 (ja) 2015-11-18
JPWO2015125588A1 JPWO2015125588A1 (ja) 2017-03-30

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JP (1) JP5816394B1 (zh)
KR (1) KR101583693B1 (zh)
CN (2) CN107253855A (zh)
TW (1) TWI522332B (zh)
WO (1) WO2015125588A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016072441A1 (ja) * 2014-11-07 2016-05-12 Jx金属株式会社 Itoスパッタリングターゲット及びその製造方法並びにito透明導電膜及びito透明導電膜の製造方法
WO2016174877A1 (ja) * 2015-04-30 2016-11-03 三井金属鉱業株式会社 Itoスパッタリングターゲット材
CN107236934A (zh) * 2016-03-28 2017-10-10 Jx金属株式会社 圆筒型溅射靶及其制造方法
JP6756283B2 (ja) * 2016-04-12 2020-09-16 三菱マテリアル株式会社 円筒型スパッタリングターゲット
JP2018178251A (ja) * 2017-04-07 2018-11-15 三菱マテリアル株式会社 円筒型スパッタリングターゲット及びその製造方法
CN113149614A (zh) * 2021-05-28 2021-07-23 通威太阳能(合肥)有限公司 一种烧结体、靶材及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07166341A (ja) * 1993-12-14 1995-06-27 Hitachi Metals Ltd インジウム・スズ酸化物膜用スパッタリング用ターゲットおよびその製造方法
JP2007231381A (ja) * 2006-03-01 2007-09-13 Tosoh Corp Itoスパッタリングターゲットおよびその製造方法
WO2009020091A1 (ja) * 2007-08-06 2009-02-12 Mitsui Mining & Smelting Co., Ltd. Ito焼結体およびitoスパッタリングターゲット
JP2010150611A (ja) * 2008-12-25 2010-07-08 Tosoh Corp 透明導電膜用焼結体及びスパッタリングターゲット並びにその製造方法
JP2011080116A (ja) * 2009-10-07 2011-04-21 Mitsui Mining & Smelting Co Ltd Itoスパッタリングターゲットおよびその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4961672B2 (ja) 2004-03-05 2012-06-27 東ソー株式会社 円筒形スパッタリングターゲット並びにセラミックス焼結体及びその製造方法
JP2012126937A (ja) 2010-12-13 2012-07-05 Sumitomo Metal Mining Co Ltd Itoスパッタリングターゲットとその製造方法
CN102718499B (zh) * 2012-07-10 2014-02-26 国家钽铌特种金属材料工程技术研究中心 一种含In4Sn3O12相ITO溅射靶的制造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07166341A (ja) * 1993-12-14 1995-06-27 Hitachi Metals Ltd インジウム・スズ酸化物膜用スパッタリング用ターゲットおよびその製造方法
JP2007231381A (ja) * 2006-03-01 2007-09-13 Tosoh Corp Itoスパッタリングターゲットおよびその製造方法
WO2009020091A1 (ja) * 2007-08-06 2009-02-12 Mitsui Mining & Smelting Co., Ltd. Ito焼結体およびitoスパッタリングターゲット
JP2010150611A (ja) * 2008-12-25 2010-07-08 Tosoh Corp 透明導電膜用焼結体及びスパッタリングターゲット並びにその製造方法
JP2011080116A (ja) * 2009-10-07 2011-04-21 Mitsui Mining & Smelting Co Ltd Itoスパッタリングターゲットおよびその製造方法

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Publication number Publication date
TWI522332B (zh) 2016-02-21
JPWO2015125588A1 (ja) 2017-03-30
WO2015125588A1 (ja) 2015-08-27
KR101583693B1 (ko) 2016-01-08
CN107253855A (zh) 2017-10-17
KR20150139623A (ko) 2015-12-11
CN105308002A (zh) 2016-02-03
TW201534572A (zh) 2015-09-16

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