JP5797717B2 - 白色熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材 - Google Patents

白色熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材 Download PDF

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JP5797717B2
JP5797717B2 JP2013215603A JP2013215603A JP5797717B2 JP 5797717 B2 JP5797717 B2 JP 5797717B2 JP 2013215603 A JP2013215603 A JP 2013215603A JP 2013215603 A JP2013215603 A JP 2013215603A JP 5797717 B2 JP5797717 B2 JP 5797717B2
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glass substrate
resin composition
silicone resin
thermosetting resin
pigment
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Japanese (ja)
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JP2015078293A (ja
Inventor
權雄 劉
權雄 劉
富康 ▲黄▼
富康 ▲黄▼
智軒 ▲黄▼
智軒 ▲黄▼
昌始 杉田
昌始 杉田
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台湾太陽油▲墨▼股▲分▼有限公司
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Priority to JP2013215603A priority Critical patent/JP5797717B2/ja
Priority to KR1020140137637A priority patent/KR102270109B1/ko
Priority to CN201410545616.7A priority patent/CN104559189B/zh
Priority to TW103135683A priority patent/TWI624509B/zh
Publication of JP2015078293A publication Critical patent/JP2015078293A/ja
Priority to HK15106943.8A priority patent/HK1206377A1/zh
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42Block-or graft-polymers containing polysiloxane sequences
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/30Sulfur-, selenium- or tellurium-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/04Ingredients treated with organic substances
    • C08K9/06Ingredients treated with organic substances with silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10Block- or graft-copolymers containing polysiloxane sequences
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2237Oxides; Hydroxides of metals of titanium
    • C08K2003/2241Titanium dioxide

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
JP2013215603A 2013-10-16 2013-10-16 白色熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材 Active JP5797717B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013215603A JP5797717B2 (ja) 2013-10-16 2013-10-16 白色熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材
KR1020140137637A KR102270109B1 (ko) 2013-10-16 2014-10-13 백색 열경화성 수지 조성물, 그의 경화물 및 그것을 사용한 디스플레이용 부재
CN201410545616.7A CN104559189B (zh) 2013-10-16 2014-10-15 白色热硬化性树脂组成物、其硬化物、及使用其的显示器用构件
TW103135683A TWI624509B (zh) 2013-10-16 2014-10-15 White thermosetting resin composition, cured product thereof, and display member using the same
HK15106943.8A HK1206377A1 (zh) 2013-10-16 2015-07-21 白色熱硬化性樹脂組成物、其硬化物、及使用其的顯示器用構件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013215603A JP5797717B2 (ja) 2013-10-16 2013-10-16 白色熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材

Publications (2)

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JP2015078293A JP2015078293A (ja) 2015-04-23
JP5797717B2 true JP5797717B2 (ja) 2015-10-21

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JP2013215603A Active JP5797717B2 (ja) 2013-10-16 2013-10-16 白色熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材

Country Status (5)

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JP (1) JP5797717B2 (zh)
KR (1) KR102270109B1 (zh)
CN (1) CN104559189B (zh)
HK (1) HK1206377A1 (zh)
TW (1) TWI624509B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6705970B2 (ja) * 2015-12-28 2020-06-03 山陽色素株式会社 金属酸化物用分散剤、これを用いた金属酸化物分散体及びシリコーン重合体組成物並びにこれらの製造方法
JP6860200B2 (ja) * 2017-03-27 2021-04-14 オート化学工業株式会社 硬化性組成物
CN107523259B (zh) * 2017-10-12 2020-08-11 济南大学 一种α-570偶联剂改性的有机硅密封胶的制备
JP7254500B2 (ja) * 2018-12-18 2023-04-10 KeePer技研株式会社 スマートフォンの表示画面の表面改質方法
KR102525839B1 (ko) * 2022-01-12 2023-04-27 주식회사 공정 교면 방수제 및 이를 이용하는 교면 방수공법

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* Cited by examiner, † Cited by third party
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JPH06102774B2 (ja) * 1986-01-21 1994-12-14 ゼネラル・エレクトリック・カンパニイ 半透明薄板材料及びその製造方法
JPH09316397A (ja) * 1996-03-25 1997-12-09 Asahi Glass Co Ltd 被膜形成用組成物およびその製造方法
KR100276803B1 (ko) * 1996-12-13 2001-01-15 이마이 기요스케 실리콘 에멀젼 코팅재 조성물과 그것의 제조방법
JP2007246888A (ja) * 2006-02-17 2007-09-27 Chugoku Marine Paints Ltd 硬化性オルガノポリシロキサン組成物
JP2008094956A (ja) * 2006-10-12 2008-04-24 Shin Etsu Chem Co Ltd シリコーンコーティング組成物、その製造方法及び被覆物品
JP4678415B2 (ja) * 2008-03-18 2011-04-27 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース
JP2010018786A (ja) * 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP2010106243A (ja) * 2008-09-30 2010-05-13 Shin-Etsu Chemical Co Ltd 光半導体装置用シリコーン樹脂組成物
JP2010278411A (ja) 2009-04-28 2010-12-09 Hitachi Chem Co Ltd 白色コート剤、これを用いた光半導体素子搭載用基板及び光半導体装置
JP2011032392A (ja) * 2009-08-03 2011-02-17 Shin-Etsu Chemical Co Ltd 光半導体装置用シリコーン樹脂組成物
JP2011052115A (ja) * 2009-09-02 2011-03-17 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP2012041428A (ja) * 2010-08-18 2012-03-01 Shin-Etsu Chemical Co Ltd シリコーン樹脂組成物及び光半導体ケース
JP2012102177A (ja) 2010-11-08 2012-05-31 Yokohama Rubber Co Ltd:The 硬化性樹脂組成物
JP5728961B2 (ja) * 2011-01-17 2015-06-03 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP5728960B2 (ja) * 2011-01-17 2015-06-03 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP5821316B2 (ja) * 2011-06-21 2015-11-24 三菱化学株式会社 半導体発光装置用樹脂パッケージの製造方法及び該半導体発光装置用樹脂パッケージを有してなる半導体発光装置の製造方法
JP5837385B2 (ja) * 2011-10-04 2015-12-24 株式会社カネカ 熱硬化性樹脂組成物およびそれを用いた発光ダイオード用のパッケージ
JP5729270B2 (ja) * 2011-11-21 2015-06-03 信越化学工業株式会社 Ledリフレクターとして有用な白色熱硬化性シリコーン樹脂組成物及び該組成物を用いた光半導体装置
JP5814175B2 (ja) * 2012-04-16 2015-11-17 信越化学工業株式会社 Ledのリフレクター用熱硬化性シリコーン樹脂組成物並びにこれを用いたled用リフレクター及び光半導体装置
JP5756054B2 (ja) * 2012-04-16 2015-07-29 信越化学工業株式会社 Ledのリフレクター用熱硬化性樹脂組成物並びにこれを用いたled用リフレクター及び光半導体装置

Also Published As

Publication number Publication date
TW201518414A (zh) 2015-05-16
KR102270109B1 (ko) 2021-06-29
KR20150044390A (ko) 2015-04-24
CN104559189A (zh) 2015-04-29
TWI624509B (zh) 2018-05-21
JP2015078293A (ja) 2015-04-23
HK1206377A1 (zh) 2016-01-08
CN104559189B (zh) 2019-06-11

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