JP5788166B2 - 接続端子構造及びその製造方法、並びにソケット - Google Patents

接続端子構造及びその製造方法、並びにソケット Download PDF

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Publication number
JP5788166B2
JP5788166B2 JP2010246400A JP2010246400A JP5788166B2 JP 5788166 B2 JP5788166 B2 JP 5788166B2 JP 2010246400 A JP2010246400 A JP 2010246400A JP 2010246400 A JP2010246400 A JP 2010246400A JP 5788166 B2 JP5788166 B2 JP 5788166B2
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JP
Japan
Prior art keywords
connection terminal
substrate
connection
pad
socket
Prior art date
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Expired - Fee Related
Application number
JP2010246400A
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English (en)
Japanese (ja)
Other versions
JP2012099352A (ja
JP2012099352A5 (enExample
Inventor
堀川　泰愛
泰愛 堀川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2010246400A priority Critical patent/JP5788166B2/ja
Priority to US13/285,139 priority patent/US8770987B2/en
Publication of JP2012099352A publication Critical patent/JP2012099352A/ja
Publication of JP2012099352A5 publication Critical patent/JP2012099352A5/ja
Application granted granted Critical
Publication of JP5788166B2 publication Critical patent/JP5788166B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts

Landscapes

  • Connecting Device With Holders (AREA)
JP2010246400A 2010-11-02 2010-11-02 接続端子構造及びその製造方法、並びにソケット Expired - Fee Related JP5788166B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010246400A JP5788166B2 (ja) 2010-11-02 2010-11-02 接続端子構造及びその製造方法、並びにソケット
US13/285,139 US8770987B2 (en) 2010-11-02 2011-10-31 Connecting terminal structure, manufacturing method of the same and socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010246400A JP5788166B2 (ja) 2010-11-02 2010-11-02 接続端子構造及びその製造方法、並びにソケット

Publications (3)

Publication Number Publication Date
JP2012099352A JP2012099352A (ja) 2012-05-24
JP2012099352A5 JP2012099352A5 (enExample) 2013-10-31
JP5788166B2 true JP5788166B2 (ja) 2015-09-30

Family

ID=45997241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010246400A Expired - Fee Related JP5788166B2 (ja) 2010-11-02 2010-11-02 接続端子構造及びその製造方法、並びにソケット

Country Status (2)

Country Link
US (1) US8770987B2 (enExample)
JP (1) JP5788166B2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6046392B2 (ja) * 2012-06-22 2016-12-14 新光電気工業株式会社 接続端子構造、インターポーザ、及びソケット
JP2014165210A (ja) * 2013-02-21 2014-09-08 Fujitsu Component Ltd モジュール基板
JP6032212B2 (ja) * 2013-03-19 2016-11-24 株式会社村田製作所 積層電子部品およびその実装構造体
DE102013213497A1 (de) * 2013-05-24 2014-11-27 Continental Teves Ag & Co. Ohg Verfahren zur Fertigung eines Kontaktelements, Kontaktelement sowie dessen Verwendung
KR102400529B1 (ko) 2015-10-26 2022-05-20 삼성전자주식회사 금속 케이스를 구비한 전자기기 및 이에 사용되는 금속 케이스
JP2018174017A (ja) * 2017-03-31 2018-11-08 タイコエレクトロニクスジャパン合同会社 ソケット
JP7215206B2 (ja) * 2019-02-19 2023-01-31 富士電機株式会社 半導体装置の製造方法
CN110726918B (zh) * 2019-09-25 2022-04-05 苏州韬盛电子科技有限公司 阻抗匹配结构的半导体芯片测试同轴插座及其制备方法
CN110838634A (zh) * 2019-10-25 2020-02-25 富士康(昆山)电脑接插件有限公司 电连接器
JP7644366B2 (ja) 2022-07-12 2025-03-12 山一電機株式会社 コンタクトピン及び検査用ソケット
JP7590659B2 (ja) 2022-07-12 2024-11-27 山一電機株式会社 コンタクトピン及び検査用ソケット
US12429497B2 (en) * 2022-12-19 2025-09-30 Renesas Electronics Corporation Manufacturing method of semiconductor device and test socket for use in the same

Family Cites Families (16)

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Publication number Priority date Publication date Assignee Title
JPS61168945A (ja) * 1985-01-23 1986-07-30 Hitachi Ltd 半導体装置用ソケツト
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JPH04116539A (ja) 1990-09-07 1992-04-17 Canon Inc 磁気記憶部付フィルムを用いるカメラ
US5772451A (en) * 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
KR100394205B1 (ko) * 1994-11-15 2003-08-06 폼팩터, 인크. 시험된 반도체 장치 및 시험된 반도체 장치의 제조방법
JP2856706B2 (ja) 1996-05-22 1999-02-10 新潟日本電気株式会社 Ｃｐｕソケット
US6210176B1 (en) * 1999-11-18 2001-04-03 Hon Hai Precision Ind. Co., Ltd. Land grid array connector
JP2002231401A (ja) * 2001-01-31 2002-08-16 Molex Inc ソケットコネクタ
US6730134B2 (en) 2001-07-02 2004-05-04 Intercon Systems, Inc. Interposer assembly
US6884087B2 (en) * 2003-09-24 2005-04-26 Intel Corporation Socket with multiple contact pad area socket contacts
US6923656B2 (en) * 2003-10-14 2005-08-02 Sun Microsystems, Inc. Land grid array socket with diverse contacts
US7204701B1 (en) * 2004-03-08 2007-04-17 Sun Microsystems, Inc. Method and apparatus for reducing capacitively coupled radio frequency energy between a semiconductor device and an adjacent metal structure
US6935867B1 (en) * 2004-05-24 2005-08-30 Alps Electric Co., Ltd. Connection unit between substrated and component and method for fabricating connection unit
US7118401B2 (en) * 2004-06-02 2006-10-10 Hon Hai Precision Ind. Co., Ltd Electrical connector with continuous support member
US7833036B2 (en) * 2005-10-31 2010-11-16 Kabushiki Kaisha Nihon Micronics Electrical connecting apparatus
JP2008096390A (ja) 2006-10-16 2008-04-24 Sharp Corp コンタクトプローブユニット、及び検査用ソケット

Also Published As

Publication number Publication date
US20120108108A1 (en) 2012-05-03
US8770987B2 (en) 2014-07-08
JP2012099352A (ja) 2012-05-24

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