JP5781824B2 - 熱膨張抑制部材および対熱膨張性部材 - Google Patents

熱膨張抑制部材および対熱膨張性部材 Download PDF

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Publication number
JP5781824B2
JP5781824B2 JP2011097851A JP2011097851A JP5781824B2 JP 5781824 B2 JP5781824 B2 JP 5781824B2 JP 2011097851 A JP2011097851 A JP 2011097851A JP 2011097851 A JP2011097851 A JP 2011097851A JP 5781824 B2 JP5781824 B2 JP 5781824B2
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Japan
Prior art keywords
metal
thermal expansion
linear expansion
expansion coefficient
thermally expandable
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JP2011097851A
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English (en)
Japanese (ja)
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JP2012056830A5 (https=
JP2012056830A (ja
Inventor
久保田　純
純 久保田
三浦　薫
薫 三浦
薮田　久人
久人 薮田
喜彦 松村
喜彦 松村
島川　祐一
祐一 島川
東　正樹
正樹 東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Kyoto University NUC
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Canon Inc
Kyoto University NUC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Canon Inc, Kyoto University NUC filed Critical Canon Inc
Priority to JP2011097851A priority Critical patent/JP5781824B2/ja
Priority to US13/205,272 priority patent/US8753749B2/en
Priority to CN201110226208.1A priority patent/CN102373032B/zh
Priority to EP11177212.5A priority patent/EP2418923B1/en
Publication of JP2012056830A publication Critical patent/JP2012056830A/ja
Priority to US14/262,012 priority patent/US10124558B2/en
Publication of JP2012056830A5 publication Critical patent/JP2012056830A5/ja
Application granted granted Critical
Publication of JP5781824B2 publication Critical patent/JP5781824B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/027—Thermal properties
    • B32B7/028—Heat-shrinkability
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G53/00—Compounds of nickel
    • C01G53/40—Complex oxides containing nickel and at least one other metal element
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/50—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/50—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds
    • C04B35/505—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds based on yttrium oxide
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/259—Ceramics or glasses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Ceramic Products (AREA)
JP2011097851A 2010-08-12 2011-04-26 熱膨張抑制部材および対熱膨張性部材 Active JP5781824B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011097851A JP5781824B2 (ja) 2010-08-12 2011-04-26 熱膨張抑制部材および対熱膨張性部材
US13/205,272 US8753749B2 (en) 2010-08-12 2011-08-08 Thermal expansion suppressing member and anti-thermally-expansive member
CN201110226208.1A CN102373032B (zh) 2010-08-12 2011-08-09 热膨胀抑制部件和抗热膨胀性部件
EP11177212.5A EP2418923B1 (en) 2010-08-12 2011-08-11 Thermal expansion suppressing member and anti-thermally-expansive member
US14/262,012 US10124558B2 (en) 2010-08-12 2014-04-25 Thermal expansion suppressing member and anti-thermally-expansive member

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010180885 2010-08-12
JP2010180885 2010-08-12
JP2011097851A JP5781824B2 (ja) 2010-08-12 2011-04-26 熱膨張抑制部材および対熱膨張性部材

Related Child Applications (1)

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JP2015142328A Division JP6038244B2 (ja) 2010-08-12 2015-07-16 熱膨張抑制部材および対熱膨張性部材

Publications (3)

Publication Number Publication Date
JP2012056830A JP2012056830A (ja) 2012-03-22
JP2012056830A5 JP2012056830A5 (https=) 2014-06-19
JP5781824B2 true JP5781824B2 (ja) 2015-09-24

Family

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Family Applications (1)

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JP2011097851A Active JP5781824B2 (ja) 2010-08-12 2011-04-26 熱膨張抑制部材および対熱膨張性部材

Country Status (4)

Country Link
US (2) US8753749B2 (https=)
EP (1) EP2418923B1 (https=)
JP (1) JP5781824B2 (https=)
CN (1) CN102373032B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5795187B2 (ja) 2010-08-12 2015-10-14 キヤノン株式会社 対熱膨張性樹脂および対熱膨張性金属
JP5781824B2 (ja) * 2010-08-12 2015-09-24 キヤノン株式会社 熱膨張抑制部材および対熱膨張性部材
WO2013147856A1 (en) * 2012-03-30 2013-10-03 Intel Corporation Process and material for preventing deleterious expansion of high aspect ratio copper filled through silicon vias (tsvs)
DE102012212898A1 (de) * 2012-07-24 2014-01-30 Carl Zeiss Smt Gmbh Spiegelanordnung für eine EUV-Projektionsbelichtungsanlage, Verfahren zum Betreiben derselben, sowie EUV-Projektionsbelichtungsanlage
WO2014030293A1 (ja) * 2012-08-21 2014-02-27 国立大学法人東京工業大学 負熱膨張性材料
JP6555473B2 (ja) * 2015-08-31 2019-08-07 国立大学法人東京工業大学 負熱膨張性材料、及び複合体
US10676371B2 (en) 2016-02-12 2020-06-09 National University Corporation Nagoya University Ruthenium oxide having a negative thermal expansion coefficient, and useable as a thermal expansion inhibitor
JP6998051B2 (ja) * 2018-06-08 2022-01-18 地方独立行政法人神奈川県立産業技術総合研究所 負熱膨張性材料、複合体、及び使用方法
CN110335854B (zh) * 2019-06-17 2020-12-11 中国科学院微电子研究所 一种强制对流微流道散热结构、制造方法及电子器件
JP7351477B2 (ja) 2019-07-23 2023-09-27 国立大学法人東京工業大学 樹脂組成物およびその樹脂成形体
CN111254388B (zh) * 2020-03-30 2022-06-10 昆山国显光电有限公司 掩膜外框和掩膜组件
JP7796390B2 (ja) * 2022-04-28 2026-01-09 国立大学法人東北大学 結晶体、相変化メモリ、結晶体の製造方法及び相変化メモリの製造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61175035A (ja) 1985-01-31 1986-08-06 株式会社日立製作所 樹脂と無機材料との複合体
US5694503A (en) 1996-09-09 1997-12-02 Lucent Technologies Inc. Article comprising a temperature compensated optical fiber refractive index grating
US20050191515A1 (en) 2000-07-20 2005-09-01 Shipley Company, L.L.C. Very low thermal expansion composite
US6518609B1 (en) * 2000-08-31 2003-02-11 University Of Maryland Niobium or vanadium substituted strontium titanate barrier intermediate a silicon underlayer and a functional metal oxide film
CN1255563C (zh) 2001-05-24 2006-05-10 弗莱氏金属公司 热界面材料和受热器构型
CA2547358C (en) 2001-05-24 2013-08-06 Fry's Metals, Inc. Thermal interface material and solder preforms
WO2005036661A1 (ja) * 2003-10-08 2005-04-21 National Institute Of Advanced Industrial Science And Technology 熱電変換材料接続用導電性ペースト
JP4379798B2 (ja) * 2004-05-19 2009-12-09 日立粉末冶金株式会社 金属−セラミックス焼結積層体の製造方法
JP4446064B2 (ja) * 2004-07-07 2010-04-07 独立行政法人産業技術総合研究所 熱電変換素子及び熱電変換モジュール
US7632480B2 (en) 2004-07-30 2009-12-15 Riken Thermal expansion inhibitor, zero thermal expansion material, negative thermal expansion material, method for inhibiting thermal expansion, and method for producing thermal expansion inhibitor
US20070135550A1 (en) 2005-12-14 2007-06-14 Nirupama Chakrapani Negative thermal expansion material filler for low CTE composites
JP2007194429A (ja) 2006-01-19 2007-08-02 Fujitsu Ltd 強磁性・強誘電性材料及び半導体装置
US8232621B2 (en) * 2006-07-28 2012-07-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2008260892A (ja) 2007-04-13 2008-10-30 Sekisui Chem Co Ltd 電子部品用接着剤
JP2010021429A (ja) 2008-07-11 2010-01-28 Murata Mfg Co Ltd 電子機器およびその製造方法
JP2010029990A (ja) * 2008-07-29 2010-02-12 National Institute Of Advanced Industrial & Technology 負熱膨張率材料および該負熱膨張率材料を含む複合材料
JPWO2010101153A1 (ja) 2009-03-04 2012-09-10 国立大学法人京都大学 Ａサイト秩序型ペロブスカイト酸化物
JP5781824B2 (ja) * 2010-08-12 2015-09-24 キヤノン株式会社 熱膨張抑制部材および対熱膨張性部材
JP5795187B2 (ja) 2010-08-12 2015-10-14 キヤノン株式会社 対熱膨張性樹脂および対熱膨張性金属
WO2014030293A1 (ja) 2012-08-21 2014-02-27 国立大学法人東京工業大学 負熱膨張性材料

Also Published As

Publication number Publication date
CN102373032A (zh) 2012-03-14
US10124558B2 (en) 2018-11-13
US8753749B2 (en) 2014-06-17
EP2418923B1 (en) 2019-01-23
CN102373032B (zh) 2014-08-06
US20120040196A1 (en) 2012-02-16
JP2012056830A (ja) 2012-03-22
EP2418923A1 (en) 2012-02-15
US20140234643A1 (en) 2014-08-21

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