JP5764761B2 - 電子装置、電源制御システム、および寿命測定ユニット - Google Patents

電子装置、電源制御システム、および寿命測定ユニット Download PDF

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Publication number
JP5764761B2
JP5764761B2 JP2011281467A JP2011281467A JP5764761B2 JP 5764761 B2 JP5764761 B2 JP 5764761B2 JP 2011281467 A JP2011281467 A JP 2011281467A JP 2011281467 A JP2011281467 A JP 2011281467A JP 5764761 B2 JP5764761 B2 JP 5764761B2
Authority
JP
Japan
Prior art keywords
sensor element
bump
solder bump
electrode
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011281467A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013130519A (ja
Inventor
強 右京
強 右京
寛二 高木
寛二 高木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokohama National University NUC
Nidec Mobility Corp
Original Assignee
Omron Automotive Electronics Co Ltd
Yokohama National University NUC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Automotive Electronics Co Ltd, Yokohama National University NUC filed Critical Omron Automotive Electronics Co Ltd
Priority to JP2011281467A priority Critical patent/JP5764761B2/ja
Priority to PCT/JP2012/083045 priority patent/WO2013094678A1/fr
Publication of JP2013130519A publication Critical patent/JP2013130519A/ja
Application granted granted Critical
Publication of JP5764761B2 publication Critical patent/JP5764761B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2817—Environmental-, stress-, or burn-in tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/70—Testing of connections between components and printed circuit boards
    • G01R31/71—Testing of solder joints

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
JP2011281467A 2011-12-22 2011-12-22 電子装置、電源制御システム、および寿命測定ユニット Expired - Fee Related JP5764761B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011281467A JP5764761B2 (ja) 2011-12-22 2011-12-22 電子装置、電源制御システム、および寿命測定ユニット
PCT/JP2012/083045 WO2013094678A1 (fr) 2011-12-22 2012-12-20 Dispositif électronique, système de commande de source d'alimentation et unité de mesure de la durée de service

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011281467A JP5764761B2 (ja) 2011-12-22 2011-12-22 電子装置、電源制御システム、および寿命測定ユニット

Publications (2)

Publication Number Publication Date
JP2013130519A JP2013130519A (ja) 2013-07-04
JP5764761B2 true JP5764761B2 (ja) 2015-08-19

Family

ID=48668558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011281467A Expired - Fee Related JP5764761B2 (ja) 2011-12-22 2011-12-22 電子装置、電源制御システム、および寿命測定ユニット

Country Status (2)

Country Link
JP (1) JP5764761B2 (fr)
WO (1) WO2013094678A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016100361A (ja) * 2014-11-18 2016-05-30 株式会社日立製作所 寿命予測機能を備えた回路基板及びはんだ接続寿命予測方法
JP6573039B2 (ja) * 2016-12-20 2019-09-11 三菱電機株式会社 故障予測素子及びこれを用いた回路基板
JP2019138843A (ja) * 2018-02-14 2019-08-22 リンテック株式会社 歪み検出デバイス

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3092644B2 (ja) * 1993-05-19 2000-09-25 東芝ライテック株式会社 電源装置
JP2003101215A (ja) * 2001-09-19 2003-04-04 Ricoh Co Ltd ハンダ接合部余命予測装置およびハンダ接合部余命予測システム
JP4179234B2 (ja) * 2004-06-17 2008-11-12 株式会社デンソー 半導体装置
JP4825235B2 (ja) * 2008-04-25 2011-11-30 三菱電機株式会社 接続異常検知装置およびその装置を用いた車載用電子機器
JP5355149B2 (ja) * 2009-03-02 2013-11-27 株式会社東芝 電子機器および、電子機器を用いた電子部品の接続不良検出方法

Also Published As

Publication number Publication date
WO2013094678A1 (fr) 2013-06-27
JP2013130519A (ja) 2013-07-04

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