WO2013094678A1 - Dispositif électronique, système de commande de source d'alimentation et unité de mesure de la durée de service - Google Patents

Dispositif électronique, système de commande de source d'alimentation et unité de mesure de la durée de service Download PDF

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Publication number
WO2013094678A1
WO2013094678A1 PCT/JP2012/083045 JP2012083045W WO2013094678A1 WO 2013094678 A1 WO2013094678 A1 WO 2013094678A1 JP 2012083045 W JP2012083045 W JP 2012083045W WO 2013094678 A1 WO2013094678 A1 WO 2013094678A1
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WIPO (PCT)
Prior art keywords
bump
solder bump
sensor element
electrode
solder
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PCT/JP2012/083045
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English (en)
Japanese (ja)
Inventor
右京強
高木寛二
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国立大学法人横浜国立大学
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Publication of WO2013094678A1 publication Critical patent/WO2013094678A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2817—Environmental-, stress-, or burn-in tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/70—Testing of connections between components and printed circuit boards
    • G01R31/71—Testing of solder joints

Definitions

  • the present invention relates to an electronic device for measuring the lifetime of an apparatus, a power supply system using the electronic apparatus, and a lifetime measuring unit used for determining the lifetime of the apparatus.
  • Patent Document 1 for a BGA (Ball Grid Array) package mounted on a motherboard, solder bumps that are easily damaged by deformation stress and solder bumps that are not easily damaged are selected, and the two types of bumps are fixed. An invention is described which passes a current of value. At this time, if the initial stage of cracking occurs in a solder bump that is susceptible to damage, the voltage generated in the solder bump that is cracked will be higher than the voltage generated in the other solder bump that is less susceptible to damage. The initial stage of cracks can be detected.
  • Patent Document 2 describes a configuration in which a large number of solder balls are used to attach a module substrate to a mother substrate, and a component is attached on the module substrate by using many solder balls.
  • Patent Document 3 describes a soldering life of a control component that is set shorter than that of a power supply component.
  • an example of changing the composition an example of changing the amount of solder, an example of changing the clearance, an example of making the solder itself easy to peel off, an example of adding thermal degradation by bringing it closer to a transistor, etc. Is described.
  • Patent Document 4 describes an invention in which a life curve is created at a solder connection portion and the relationship between the amount of strain and the life is obtained.
  • a life curve is created at a solder connection portion and the relationship between the amount of strain and the life is obtained.
  • an electronic component having a specific electrode configuration is soldered to the wiring board, and then a temperature cycle test is performed to generate repeated distortions in the solder connection portion, and the progress of cracks by cross-sectional observation, and A method for obtaining the lifetime from the data of the change in connection strength is described.
  • factors affecting the amount of strain include solder composition, electronic component shape, component electrode configuration, actual use conditions, and the like, and as a result, a life curve can be created.
  • an object of the present invention is to provide an electronic device that can measure that a temperature cycle assumed in advance has elapsed and can measure the lifetime of the device.
  • the electronic device is an electronic device including a first member, a second member, and a determination unit, wherein the first member is provided with a conduction portion, and one end of the first member.
  • a first electrode electrically connected to one end of the conducting portion is provided near the portion, and electrically connected to the other end of the conducting portion near the other end of the first member.
  • the second electrode is provided, the first electrode is provided with a first bump connected to the electrode, the second electrode is provided with a second bump connected to the electrode,
  • the first member is bonded to the second member by the first bump and the second bump, and the adhesive force of the portion bonded by the second bump is relatively larger than the adhesive force of the portion bonded by the first bump. Strongly, the first member and the second member have different deformation rates with respect to temperature.
  • the determination unit may determine that the conduction is severed.
  • the first member is installed on the second member (mother board provided with an electric circuit).
  • a first electrode and a plurality of second electrodes are formed on the back surface of the sensor element, joined to the substrate by a first bump and a plurality of second bumps, respectively, and the electrodes are electrically connected.
  • the sensor element functions as a resistor.
  • the deformation ratios (linear expansion coefficients) of the mother substrate and the sensor element with respect to temperature are different from each other, and the adhesive force of the part bonded by the second bump is relatively stronger than the adhesive force of the part bonded by the first bump. For this reason, stress concentrates on the first bump due to the temperature cycle, and is first broken.
  • the determination unit can detect the breakage of the first bump by detecting the change in the resistance value. If the first bump is set to be broken at a temperature cycle assumed in advance, the determination unit can measure that the temperature cycle assumed in advance has elapsed, and can measure the life of the device. .
  • the second bump In order to increase the adhesive strength of the part bonded by the second bump, for example, it is conceivable to further provide an adhesive member around the part bonded by the second bump. Also, a plurality of second bumps are provided, and the distance between any one of the second bumps and the first bump is larger than the distance between any two adjacent second bumps among the plurality of second bumps. Even if the length is long, stress concentrates on the first bump side, so that the first bump can be broken first.
  • the second member may include a third bump and be electrically connected to the third member via the third bump.
  • the second member is an interposer
  • the third member is a mother substrate.
  • the linear expansion coefficient of the sensor element and the linear expansion coefficient of the object on which the sensor element is mounted can be set accurately and easily. Since there are a wide variety of materials for the mother board and the linear expansion coefficient, it is necessary to set the linear expansion coefficient of the sensor element each time according to the material of the mother board when the sensor element is directly mounted on the mother board. However, if the sensor element is mounted on the interposer after fixing the material of the interposer, it is not necessary to set the linear expansion coefficient each time. In order to prevent breakage of the third bump, it is desirable that the interposer and the mother substrate have the same deformation rate with respect to temperature.
  • the first member is divided into a trunk part and a plurality of leg parts, the first electrode is provided on each of the plurality of leg parts, and the second electrode is provided on the trunk part.
  • a plurality of leg portions provided with a first bump connected to the first electrode, and a body portion provided with a second bump connected to the second electrode. Is possible.
  • the sensor element may vary in posture (displacement, inclination) when bonded to the mother substrate or interposer, and may vary in the number of cycles until the first bump breaks.
  • the number of cycles may vary depending on variations in the shape (height and width) of the first bump and the second bump and material characteristics (linear expansion coefficient, Young's modulus, Poisson's ratio). Therefore, for example, when a plurality of the same sensor elements are provided, the number of cycles until the first bump in each sensor element breaks can be averaged to suppress variations.
  • the size of each bump, or the material of each bump is also possible to provide a plurality of sensor elements having different numbers of cycles until the first bump breaks.
  • the first bumps of the remaining sensor elements are detected by detecting the elapsed time until the first bumps of a plurality of (at least two) sensor elements break in order from the sensor element in which the first bumps are broken first. The elapsed time until breakage can be predicted, and the life of the device can be predicted.
  • an electronic device in which a control unit is connected to the life measurement unit may be provided with an interface that outputs the detection result of the control unit to the outside. For example, by checking the detection result at the time of equipment inspection or the like, it is possible to check the remaining life of the equipment and determine the necessity for parts replacement or the like.
  • the life measuring unit of the present invention can also be used as a power supply control system that is arranged on the power supply line and stops the power supply when the first bump is broken.
  • the device can be forcibly stopped before the device itself breaks down by breaking the power supply line due to predetermined thermal fatigue.
  • FIG. 7A is a perspective view of the life measuring unit 5 according to the application example 1, and FIG. 7B is a block diagram.
  • FIG. 10A is a partially transparent perspective view of a life measuring unit including a pressing body
  • FIG. 10B is a rear perspective view thereof.
  • It is a back surface perspective view of the sensor element 11 provided with the support mechanism.
  • It is a figure which shows the example which has one 1st bump and one 2nd bump.
  • It is the figure which showed the example of the integrated sensor element which integrated the several sensor element.
  • It is the figure which showed one of the modified examples of an integrated sensor element.
  • FIG. 1 is a block diagram showing a configuration of an electronic apparatus provided with a lifetime measuring unit of the present invention.
  • the electronic apparatus shown in FIG. 1 includes a life measurement unit 1, a control unit 3, and an interface 2.
  • the control unit 3 corresponds to a determination unit in claims, and is connected to the life measurement unit 1 and the interface 2.
  • the lifetime measuring unit 1 is installed in, for example, an ECU of an automobile, and is disposed in the vicinity of the capacitor 100, the coil 101, the heating element 102, or the like, and is disposed at a place where temperature cycle conditions are severe.
  • the life measuring unit 1 has a resistor function, and when a temperature cycle assumed in advance elapses, the resistor does not function electrically (is in an insulated state). The time until the resistor does not function electrically (number of temperature cycles) is set to be shorter than the lifetime of the device.
  • the control unit 3 has a built-in CPU and detects a state in which the life measurement unit 1 is not electrically functioning by detecting a resistance value of the life measurement unit 1.
  • the control unit 3 outputs the change of the resistance value to the interface 2 as it is or as a detection result obtained by performing a predetermined calculation.
  • the interface 2 is connected to a vehicle service plug or the like, for example, and can output the detection result at the time of vehicle inspection or the like. By confirming the detection result, the user can confirm that the life of the device is approaching, and can determine the necessity of replacement of the device.
  • FIG. 2 is a perspective view showing the basic configuration of the life measuring unit 1.
  • the life measuring unit 1 includes a sensor element 11 and a mother substrate 13.
  • the sensor element 11 corresponds to a first member of the claims.
  • the sensor element is provided with a conduction portion (not shown) including a first electrode and a second electrode (not shown).
  • a first solder bump 51 is provided on the first electrode, and a second solder bump 54 is provided on the second electrode.
  • the sensor element 11 is joined and electrically connected to the mother board 13 via the first solder bump 51 and the second solder bump 54. Therefore, in this example, the sensor element 11 corresponds to the first member of the claims, and the mother board 13 corresponds to the second member of the claims.
  • a wiring 81 is formed on the mother substrate 13 and is electrically connected to the control unit 3 (not shown) via the wiring 81.
  • FIG. 3 is a perspective view showing another form of the life measuring unit 1.
  • the lifetime measuring unit 1 in this embodiment includes a sensor element 11, an interposer 12, and a mother board 13.
  • the sensor element 11 is joined and electrically connected to the interposer 12.
  • the interposer 12 is joined to and electrically connected to the mother board 13.
  • the sensor element 11 corresponds to the first member of the claims
  • the interposer 12 corresponds to the second member of the claims
  • the mother substrate 13 corresponds to the third member of the claims.
  • Wiring 81 is formed on the mother board 13 provided with an electric circuit.
  • the interposer 12 and the sensor element 11 are electrically connected to the control unit 3 through the wiring 81.
  • the material of each part of the sensor element 11 and the interposer 12 can be considered as shown in FIG. 4 as an example, the material is not limited thereto.
  • FIG. 5A is a partially transparent perspective view of the sensor element 11 (through the main body of the sensor element 11), and FIG. 5B is a rear perspective view of the sensor element 11.
  • FIG. 6A is a partially transparent perspective view of the interposer 12 (through the main body of the interposer 12)
  • FIG. 6B is a rear perspective view of the interposer 12, and
  • FIG. It is a back surface perspective view of the interposer 12 at the time of removing a solder bump.
  • the rectangular parallelepiped sensor element 11 corresponds to a member of the present invention, and extends from one end in the longitudinal direction to the other end on a surface facing the interposer 12 (hereinafter referred to as a back surface of the sensor element 11).
  • a linear conductive portion 55 is provided.
  • a first electrode 511 is provided at one end of the conduction portion 55.
  • a first solder bump 51 is connected to the first electrode 511.
  • the other end portion of the conducting portion 55 branches in a T shape, and a plurality of electrodes (second electrode 531 and second electrode 541) are provided at the respective tip portions of the branched wiring.
  • a second solder bump 53 and a second solder bump 54 are connected to the second electrode 531 and the second electrode 541, respectively.
  • the rectangular parallelepiped-shaped interposer 12 corresponds to an intermediate member of the present invention, and a wiring 67 and a wiring 68 are provided on a surface facing the sensor element 11 (hereinafter referred to as a surface of the interposer 12).
  • An electrode 671 is formed on the wiring 67 at a position corresponding to the first solder bump 51 when the sensor element 11 is joined.
  • an electrode 672 and an electrode 683 are formed at positions corresponding to the second solder bump 53 and the second solder bump 54, respectively.
  • the interposer 12 is provided with a wiring 65 and a wiring 66 on the surface facing the mother substrate 13 (hereinafter referred to as the back surface of the interposer 12).
  • the wiring 65 is electrically connected to the wiring 67 through the through hole 70.
  • the wiring 66 is electrically connected to the wiring 68 through the through hole 69.
  • two electrodes 611 and an electrode 641 are formed at both ends in the short direction and one end in the longitudinal direction of the back surface of the interposer 12.
  • the third solder bump 61 is connected to the electrode 611, and the third solder bump 64 is connected to the electrode 641.
  • two electrodes 621 and 631 are formed on the wiring 66 at both ends in the short direction and the other end in the longitudinal direction of the back surface of the interposer 12.
  • a third solder bump 62 is connected to the electrode 621, and a third solder bump 63 is connected to the electrode 631.
  • the interposer 12 is mounted on the mother board 13 via these four third solder bumps 61, third solder bumps 62, third solder bumps 63, and third solder bumps 64.
  • the number and arrangement of solder bumps on the back surface of the interposer 12 are not limited to this example.
  • the first solder bump 51, the second solder bump 53, and the second solder bump 54 have a higher melting point than the third solder bump 61, the third solder bump 62, the third solder bump 63, and the third solder bump 64.
  • a copper material may be used as the solder bump of the high melting point material.
  • the life measuring unit is soldered in a reflow furnace when the interposer 12 is mounted on the mother board 13. At this time, if the first solder bump 51, the second solder bump 53, and the second solder bump 54 are high melting point materials, the first solder bump 51, the second solder bump 53, and the second solder bump due to the reflow heat during mounting. It is possible to prevent the solder bump 54 from being melted again and deformed.
  • the main body of the sensor element 11 is made of a semiconductor silicon or ceramic material.
  • the main body of the interposer 12 and the main body of the mother substrate 13 are made of a glass epoxy resin material. Therefore, the linear expansion coefficient of the sensor element 11 is lower than the linear expansion coefficient of the interposer 12.
  • the linear expansion coefficient of the interposer 12 is equivalent (same or similar value) to the linear expansion coefficient of the mother board 13.
  • the sensor element 11 and the interposer 12 have different deformation ratios with respect to temperature, and stress is generated in the solder bumps as connection points due to temperature changes.
  • the longer the pitch L between the bumps the larger the deformation amount due to the temperature change of the sensor element 11. Therefore, the stress increases as the pitch L between the bumps becomes longer.
  • the first solder bump Stress concentrates on the bump 51.
  • the first solder bump 51 is first broken by the temperature cycle.
  • the second solder bump 53 and the second solder bump 54 and the first solder bump 51 may be made of different materials. As an example, when SnCuAg is used as the material of the first solder bump and Cu is used as the material of the second solder bump, the first solder bump is ruptured first. Further, the size of the second solder bump 53 and the second solder bump 54 may be larger than that of the first solder bump 51. Alternatively, the second solder bump 53 and the second solder bump 54 are welded and joined to the sensor element 11 and the interposer 12 to make the structure harder to break than the first solder bump. It is also possible to break it.
  • the control unit 3 can detect the breakage of the first solder bump 51 by detecting a change in the resistance value. Therefore, if it sets so that the 1st solder bump 51 may fracture
  • the temperature cycle until the first solder bump 51 breaks depends on the pitch L between the solder bumps, the size of each solder bump, or the material of each bump.
  • the first solder bump 51 breaks in about 3650 cycles. Therefore, when it is assumed that the device is used once a day, the first solder bump 51 is set to break when about 10 years have passed, and electrical conduction is not possible. In addition, when the first solder bump 51 breaks before 10 years have elapsed, it can be determined that the device usage is severe.
  • the third solder bump 61, the third solder bump 62, the third solder bump 63, and the third solder bump 64 do not do. Therefore, the third solder bump 61, the third solder bump 62, the third solder bump 63, and the third solder bump 64 do not break before the first solder bump 51. Even if the linear expansion coefficient of the interposer 12 and the linear expansion coefficient of the mother substrate 13 are slightly different, the sizes of the third solder bumps 62, the third solder bumps 63, and the third solder bumps 64 are the same as the first solder bumps. If it is made larger than 51 or made of a material having high strength, it will not break before the first solder bump 51.
  • the interposer 12 is not an essential component in the present invention, but exists to accurately and easily set the linear expansion coefficient of the sensor element 11 and the linear expansion coefficient of the object on which the sensor element 11 is mounted. .
  • the mother substrate 13 There are various materials for the mother substrate 13, and the linear expansion coefficients are also various. If the sensor element 11 is directly mounted on the mother board 13, the linear expansion coefficient of the sensor element 11 is set every time according to the material of the mother board 13, and the first solder bump 51 is broken at a predetermined temperature cycle. It becomes necessary to change the positions of the first solder bumps 51 and the second solder bumps 53 and 54.
  • the linear expansion coefficient may be set or the first solder bumps 51 and the second solder bumps 53 and 54 may be set each time. There is no need to change the position of.
  • the number of temperature cycles until the first solder bump 51 breaks may change due to variations in the posture (deviation, inclination) of the sensor element 11. Therefore, it is desirable that the numbers of the first solder bumps and the second solder bumps are different. For example, as shown in the above-described embodiment, by using two second solder bumps and the sensor element 11 having a three-point support structure, the sensor element 11 can be prevented from being tilted and the fracture accuracy can be improved. .
  • the number of cycles until the first solder bump breaks varies in the shape (height, width) and material characteristics (linear expansion coefficient, Young's modulus, Poisson's ratio) of the first solder bump and the second solder bump itself. May vary. Therefore, a plurality of the same sensor elements 11 can be provided in the interposer 12, and the number of cycles until the first solder bump 51 in each sensor element 11 is broken can be averaged by the control unit 3 to suppress variations. At this time, when the first solder bump 51 in one sensor element 11 breaks, the control unit 3 does not output the detection result to the interface 2 and in a plurality (for example, two or three) of sensor elements 11.
  • the control unit 3 can ignore the detection result of the sensor element 11.
  • FIG. 7A is a perspective view of the life measuring unit 5 according to the application example 1, and FIG. 7B is a block diagram. Note that the mother substrate is not shown in FIG. Moreover, the same number is attached
  • the life measurement unit 5 includes five sensor elements 11A, sensor elements 11B, sensor elements 11C, sensor elements 11D, and sensor elements 11E having different numbers of cycles until the first solder bumps 51 are broken. Yes. These sensor elements are mounted on an interposer 22 having a larger area than the interposer 12.
  • the life measurement unit 5 is also installed in, for example, an ECU of an automobile, and is disposed in the vicinity of the capacitor 100, the coil 101, the heating element 102, or the like.
  • each sensor element has a different pitch L between the bumps (see FIG. 5B)
  • the number of cycles until the first solder bump breaks is different.
  • the number of cycles until the first solder bump breaks can also be changed by using sensor elements having different bump sizes and different bump materials.
  • the first solder bumps 51 are broken in the order of the sensor element 11B, the sensor element 11C, the sensor element 11D, and the sensor element 11E.
  • the control unit 3 when the first solder bump 51 in one sensor element 11A breaks, the control unit 3 does not output a detection result to the interface 2 and a plurality of sensor elements (for example, the sensor element 11A and the sensor element 11A).
  • the detection result is output when the first solder bump 51 in the sensor element 11B) is broken or when the first solder bump 51 in all the sensor elements is broken.
  • the number of temperature cycles until the first solder bump 51 of the sensor element 11A breaks is 500
  • the number of temperature cycles until the first solder bump 51 of the sensor element 11B breaks is set to 750
  • the number of temperature cycles until the first solder bump 51 of 11C breaks is set to 1000
  • the number of temperature cycles until the first solder bump 51 of the sensor element 11D breaks is set to 1250
  • the first cycle of the sensor element 11E is set.
  • the number of temperature cycles until the solder bump 51 breaks is set to 1500. In this way, the number of temperature cycles until the first solder bump 51 of each sensor element breaks is changed linearly.
  • control unit 3 detects the number of cycles (elapsed time) when the first solder bumps 51 of a plurality of (at least two) sensor elements are actually broken, and performs first approximation of the remaining sensor elements by linear approximation. The number of cycles until the bump 51 breaks is predicted.
  • the lifetime of the sensor element 11E (the number of cycles until the first solder bump 51 of the sensor element 11E breaks) is set to be shorter than the lifetime of the device, the first solder bump of at least two sensor elements. When 51 breaks, the remaining life of the device can be predicted.
  • FIG. 8 is a graph in which the vertical axis represents the number of temperature cycles and the horizontal axis represents the years of equipment use.
  • the straight line (A) indicates that, in a certain device, when the first solder bump of the sensor element 11A reaches the temperature cycle number 500 after 4 years from the start of use of the device, the first solder bump of the sensor element 11B breaks.
  • the temperature cycle number reaches 750 and breaks after 6 years from the start of use of the device, and the first solder bump of the sensor element 11C reaches 1000 cycles and breaks after 8 years from the start of use of the device. Is the case.
  • the first solder bump of the sensor element 11D reaches the temperature cycle number 1250 in 10 years from the start of use of the device and breaks, and the first solder bump of the sensor element 11E is 12 from the start of use of the device. It can be predicted that the number of temperature cycles will reach 1500 per year and break. In other words, it can be determined that the remaining life of the device is 4 years when the first solder bump of the sensor element 11C is broken.
  • the straight line (B) is obtained by performing linear approximation in the same manner at the time when the first solder bumps of the sensor element 11A, the sensor element 11B, and the sensor element 11C break for another device of the same type.
  • the solder bump of the sensor element 11C is broken in six years from the start of use of the device.
  • the first solder bump of the sensor element 11D reaches the temperature cycle number 1250 in 8 years from the start of use of the device and breaks, and the first solder bump of the sensor element 11E breaks in 9 years from the start of use of the device. Predictable. In other words, when the first solder bump of the sensor element 11C is broken, it can be determined that the remaining life of the device is 3 years.
  • FIG. 9 is a perspective view of the life measuring unit 7 according to the application example 2.
  • FIG. The life measurement unit 7 according to the application example 2 is different from the life measurement unit 5 of the application example 1 shown in FIG. 9 in the arrangement of each sensor element, and each sensor element is mounted on the interposer 23 having a smaller area than the interposer 22. Has been.
  • Other configurations are the same as those of the life measurement unit 5 of the application example 1 shown in FIG.
  • the next largest sensor element 11B and the smallest sensor element 11E are arranged in the vicinity of the largest sensor element 11A.
  • the sensor element 11E is disposed by being rotated 90 degrees from the other sensor elements as viewed from the upper surface of the lifetime measuring unit 7.
  • a sensor element 11C is disposed on the opposite side of the sensor element 11B, and a sensor element 11D is disposed on the opposite side of the sensor element 11E.
  • the life measuring unit 7 according to the application example 2 has the best area occupation efficiency, and the area occupied by the life measuring unit on the mother board can be reduced.
  • FIG. 10A is a partially transparent perspective view of the life measuring unit having a pressing body (through the sensor element 11 and the main body of the interposer 12), and FIG. 10B is a rear perspective view. It is.
  • a leaf spring 93 which is a pressing body, is disposed in the central portion of the sensor element 11 in the longitudinal direction along the short side direction.
  • the leaf spring 93 is fixed to the interposer 12 by bosses 95 at both ends.
  • the leaf spring 93 presses the sensor element 11 in the direction opposite to the interposer 12 from the back side of the sensor element 11.
  • the first solder bump 51 immediately after the initial crack is generated in the first solder bump 51, the first solder bump 51 can be forcibly broken by the pressure of the leaf spring 93. Therefore, the number of cycles until the first solder bump 51 breaks can be made uniform.
  • FIG. 11 is a rear perspective view of the sensor element 11 having a support mechanism.
  • four support bumps 91 for gap adjustment are provided on the back surface of the sensor element 11 as a support mechanism for the sensor element 11.
  • the solder bump 91 uses a material having a higher melting point than the first solder bump 51, the second solder bump 53, and the second solder bump 54. Therefore, when the interposer 12 is mounted on the mother board 13, the amount of deformation is smaller than that of the first solder bump 51, the second solder bump 53, and the second solder bump 54 due to the reflow heat, and the inclination of the sensor element 11 is further increased. Can be suppressed. Further, not only the support mechanism shown in FIG. 11 but also the sensor element 11 can be supported using a columnar member (boss) or the like.
  • an adhesive (corresponding to a bonding member in claims) may be installed between the sensor element and the interposer to fix the sensor element.
  • an adhesive having a low viscosity is used so that the stress due to the difference in thermal expansion between the sensor element and the interposer is not greatly affected.
  • the life measuring unit having one first solder bump and a plurality of second solder bumps has been described.
  • an example in which there is one first solder bump and one second solder bump is also conceivable.
  • the second solder bump is fixed using the adhesive 101 so that the first solder bump is first broken.
  • 13 (A) and 13 (B) show an integrated sensor element 15 in which a plurality of sensor elements are integrated instead of the sensor element 11 shown in FIGS. 5 (A) and 5 (B). It is the figure which showed the example of.
  • the integrated sensor element 15 is divided into a trunk portion 151 and a plurality of leg portions 152 (a leg portion 152A, a leg portion 152B, and a leg portion 152C, respectively).
  • the body 151 has three second solder bumps, that is, a second solder bump 54A, a second solder bump 54B, and a second solder bump 54C.
  • Three first solder bumps that is, a first solder bump 51A, a first solder bump 51B, and a first solder bump 51C, exist at the ends of the leg 152A, leg 152B, and leg 152C, respectively.
  • the three second solder bumps are coupled to each other by the electrode and the conductive portion 55. Further, the second solder bump 54A and the first solder bump 51A are coupled to each other by the electrode and the conductive portion 55, and the second solder bump 54B and the first solder bump 51B are coupled to each other by the electrode and the conductive portion 55, The second solder bump 54 ⁇ / b> C and the first solder bump 51 ⁇ / b> C are coupled to each other by the electrode and the conductive portion 55.
  • the integrated sensor element 15 is fixed to the interposer 12 (not shown) by the adhesive 101.
  • the adhesive 101 has a function of making the adhesive force on the second solder bump side stronger than the adhesive force on the first solder bump side and concentrating stress on the first solder bump side. Further, the adhesive 101 prevents the solder bumps from being remelted and deformed by reflow heat during mounting when the life measuring unit is mounted on the mother board.
  • the three first solder bumps are individually broken. Then, when all of the three first solder bumps are broken, it can be determined that the predetermined life has been reached.
  • the pitch between the three first solder bumps and the second solder bump is the same. 7 or a lifetime measuring unit that can be used in the same manner as in the example of FIG.
  • FIG. 14 (A) and FIG. 14 (B) are diagrams showing one modified example of the integrated sensor element.
  • the integrated sensor element 16 is divided into a body portion 161 and a plurality of leg portions 162 (a leg portion 162A, a leg portion 162B, and a leg portion 162C, respectively).
  • the body portion 161 includes three second solder bumps, that is, a second solder bump 54A, a second solder bump 54B, and a second solder bump 54C.
  • Three first solder bumps of the first solder bump 51A, the first solder bump 51B, and the first solder bump 51C are present at the ends of the leg portion 162A, the leg portion 162B, and the leg portion 162C, respectively.
  • the integrated sensor element 16 is divided into three conductive portions 55 (conductive portions 55A, conductive portions 55B, and conductive portions 55C, respectively).
  • the conduction part 55A connects the first solder bump 51A and the second solder bump 54A
  • the conduction part 55B connects the first solder bump 51B and the second solder bump 54B
  • the conduction part 55C connects the first solder bump 51C and the second solder bump 54B.
  • the solder bump 54C is connected.
  • This integrated sensor element 16 can independently detect the breakage of each of the three first solder bumps. Therefore, various judgment criteria can be provided such that the determination that the predetermined life has been reached is made when one of the first solder bumps is broken, or is made when two first solder bumps are broken.
  • the integrated sensor element 16 has a protrusion 163A and a protrusion that protrude from the back surface of the leg 162A and the end of the leg 162C (near the first solder bump) in the same direction as the convex direction of the first solder bump.
  • a portion 163C is provided.
  • a protrusion 164 that protrudes in the same direction as the convex direction of the second solder bump is provided at the end of the body 161 (in the vicinity of the second solder bump).
  • FIGS. 15A and 15B are diagrams showing another modification of the integrated sensor element 16.
  • only one second solder bump 51B is provided, and all three first solder bumps are connected to the second solder bump 51B.
  • the interposer 12 (not shown) and the integrated sensor element 16 are fixed using the adhesive 101, the second solder bump 51B side is stable, and there is one second solder bump. Even so, it can serve as a sensor element.
  • a metal plate 56 made of a material different from that of the sensor element can be attached to the surface side (side without the solder bump).
  • Various materials can be assumed for the metal plate 56.
  • the sensor element is made of semiconductor silicon and the metal plate 56 is made of copper is taken as an example.
  • the copper metal plate 56 is more easily contracted than the sensor element made of semiconductor silicon, and the sensor element is subjected to distortion stress.
  • the copper metal plate 56 is more easily expanded than the sensor element made of semiconductor silicon, and the sensor element is subjected to distortion stress.
  • the first solder bump when a metal plate made of a material different from that of the sensor element is attached, the first solder bump can be forcibly broken by the distortion stress immediately after the initial crack is generated in the first solder bump. Therefore, the number of cycles until the first solder bump breaks can be made uniform.
  • a life measurement unit as a power supply control system in which a power supply line to a device is stopped by disposing the life measurement unit on the power line of the device and breaking the first solder bump 51.
  • the power supply line can be broken by predetermined thermal fatigue to forcibly stop the device itself before it fails.
  • the life measurement unit is installed in the ECU of the automobile has been shown.
  • it can also be used for other devices (for example, other products such as a power generation device, a server, and a power supply system). .
  • solder is used as a bump for supporting a sensor element or an interposer
  • an object other than solder such as conductive rubber
  • the life measurement unit, the control unit, and the interface are used as one package, and the detection result is output to the outside via the interface.
  • the life measurement unit is configured as a package including only the life measurement unit.
  • the unit may be directly connected to an external control unit (for example, ECU), and the external control unit may detect the breakage of the first solder bump 51 of the sensor element.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)

Abstract

L'invention concerne un dispositif électronique capable de déterminer qu'un cycle de température présupposé a été traversé et de mesurer la durée de service d'un dispositif. Une unité de détermination de la durée de vie (1) comprend un élément de détection (11), une cale intermédiaire (12) et une carte-mère (13). L'élément de détection (11) est attaché à la cale intermédiaire (12) et relié électriquement avec celle-ci. La cale intermédiaire (12) est liée à la carte-mère (13) et reliée électriquement avec celle-ci. L'élément de détection (11) et la cale intermédiaire (12) présentent des coefficients d'expansion linéaire différents ; par conséquent, une contrainte se produit au niveau des bosses de soudure qui sont des points de connexion. La distance entre une première bosse de soudure (51) et une deuxième bosse de soudure (53) ou une deuxième bosse de soudure (54) disposée à une partie d'extrémité de l'élément de détection (11) dans le sens de la largeur est supérieure à la distance entre la deuxième bosse de soudure (53) et la deuxième bosse de soudure (54) ; par conséquent, la contrainte est concentrée au niveau de la première bosse de soudure (51). Si la première bosse de soudure (51) est conçue pour se rompre dans un cycle de température présupposé, il est alors possible de déterminer si le cycle de température présupposé a été traversé et la durée de service d'un dispositif peut être mesurée.
PCT/JP2012/083045 2011-12-22 2012-12-20 Dispositif électronique, système de commande de source d'alimentation et unité de mesure de la durée de service WO2013094678A1 (fr)

Applications Claiming Priority (2)

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JP2011281467A JP5764761B2 (ja) 2011-12-22 2011-12-22 電子装置、電源制御システム、および寿命測定ユニット
JP2011-281467 2011-12-22

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JP2016100361A (ja) * 2014-11-18 2016-05-30 株式会社日立製作所 寿命予測機能を備えた回路基板及びはんだ接続寿命予測方法
CN110089203B (zh) * 2016-12-20 2022-03-29 三菱电机株式会社 故障预测元件及使用该故障预测元件的电路基板
JP2019138843A (ja) * 2018-02-14 2019-08-22 リンテック株式会社 歪み検出デバイス

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3092644B2 (ja) * 1993-05-19 2000-09-25 東芝ライテック株式会社 電源装置
JP2003101215A (ja) * 2001-09-19 2003-04-04 Ricoh Co Ltd ハンダ接合部余命予測装置およびハンダ接合部余命予測システム
JP2006005163A (ja) * 2004-06-17 2006-01-05 Denso Corp 半導体装置及びその実装検査方法
JP2009264959A (ja) * 2008-04-25 2009-11-12 Mitsubishi Electric Corp 接続異常検知装置およびその装置を用いた車載用電子機器
JP2010205821A (ja) * 2009-03-02 2010-09-16 Toshiba Corp 電子機器および、電子機器を用いた電子部品の接続不良検出方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3092644B2 (ja) * 1993-05-19 2000-09-25 東芝ライテック株式会社 電源装置
JP2003101215A (ja) * 2001-09-19 2003-04-04 Ricoh Co Ltd ハンダ接合部余命予測装置およびハンダ接合部余命予測システム
JP2006005163A (ja) * 2004-06-17 2006-01-05 Denso Corp 半導体装置及びその実装検査方法
JP2009264959A (ja) * 2008-04-25 2009-11-12 Mitsubishi Electric Corp 接続異常検知装置およびその装置を用いた車載用電子機器
JP2010205821A (ja) * 2009-03-02 2010-09-16 Toshiba Corp 電子機器および、電子機器を用いた電子部品の接続不良検出方法

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