JP5757163B2 - 多層配線基板およびその製造方法、並びに半導体装置 - Google Patents

多層配線基板およびその製造方法、並びに半導体装置 Download PDF

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Publication number
JP5757163B2
JP5757163B2 JP2011124604A JP2011124604A JP5757163B2 JP 5757163 B2 JP5757163 B2 JP 5757163B2 JP 2011124604 A JP2011124604 A JP 2011124604A JP 2011124604 A JP2011124604 A JP 2011124604A JP 5757163 B2 JP5757163 B2 JP 5757163B2
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JP
Japan
Prior art keywords
layer
dielectric layer
forming
conductive layer
metal foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011124604A
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English (en)
Japanese (ja)
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JP2012253195A5 (enExample
JP2012253195A (ja
Inventor
修一 岡
修一 岡
周作 柳川
周作 柳川
研 足立
研 足立
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2011124604A priority Critical patent/JP5757163B2/ja
Priority to US13/480,925 priority patent/US9672983B2/en
Priority to CN201210167121.6A priority patent/CN102821545B/zh
Publication of JP2012253195A publication Critical patent/JP2012253195A/ja
Publication of JP2012253195A5 publication Critical patent/JP2012253195A5/ja
Application granted granted Critical
Publication of JP5757163B2 publication Critical patent/JP5757163B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H10W70/05—
    • H10W70/657—
    • H10W70/685—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H10W70/60—
    • H10W90/722—
    • H10W90/724—
    • H10W90/754—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ceramic Engineering (AREA)
JP2011124604A 2011-06-02 2011-06-02 多層配線基板およびその製造方法、並びに半導体装置 Expired - Fee Related JP5757163B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011124604A JP5757163B2 (ja) 2011-06-02 2011-06-02 多層配線基板およびその製造方法、並びに半導体装置
US13/480,925 US9672983B2 (en) 2011-06-02 2012-05-25 Peel resistant multilayer wiring board with thin film capacitor and manufacturing method thereof
CN201210167121.6A CN102821545B (zh) 2011-06-02 2012-05-25 多层布线板、其制造方法以及半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011124604A JP5757163B2 (ja) 2011-06-02 2011-06-02 多層配線基板およびその製造方法、並びに半導体装置

Publications (3)

Publication Number Publication Date
JP2012253195A JP2012253195A (ja) 2012-12-20
JP2012253195A5 JP2012253195A5 (enExample) 2014-07-10
JP5757163B2 true JP5757163B2 (ja) 2015-07-29

Family

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Family Applications (1)

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JP2011124604A Expired - Fee Related JP5757163B2 (ja) 2011-06-02 2011-06-02 多層配線基板およびその製造方法、並びに半導体装置

Country Status (3)

Country Link
US (1) US9672983B2 (enExample)
JP (1) JP5757163B2 (enExample)
CN (1) CN102821545B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012182437A (ja) * 2011-02-09 2012-09-20 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
MY175520A (en) * 2014-02-21 2020-07-01 Mitsui Mining & Smelting Co Ltd Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board
KR20160004090A (ko) * 2014-07-02 2016-01-12 삼성전기주식회사 박막 인덕터용 코일 유닛, 박막 인덕터용 코일 유닛의 제조방법, 박막 인덕터 및 박막 인덕터의 제조방법
JP2016219737A (ja) * 2015-05-26 2016-12-22 ソニー株式会社 電子機器
CN106658964A (zh) * 2015-10-28 2017-05-10 碁鼎科技秦皇岛有限公司 电路板及其制作方法
JP6512366B2 (ja) * 2016-04-20 2019-05-15 富士通株式会社 回路基板、回路基板の製造方法及び電子装置
WO2017183146A1 (ja) * 2016-04-21 2017-10-26 富士通株式会社 回路基板、回路基板の製造方法及び電子装置
KR101813374B1 (ko) * 2016-05-13 2017-12-28 삼성전기주식회사 박막 커패시터 및 그 제조방법
CN107613642B (zh) * 2017-08-31 2019-06-07 江苏普诺威电子股份有限公司 含阶梯槽埋容线路板的制作方法
JP7063019B2 (ja) * 2018-03-09 2022-05-09 Tdk株式会社 薄膜コンデンサの製造方法及び薄膜コンデンサ
JP6932289B2 (ja) * 2019-04-02 2021-09-08 三菱電機株式会社 複合プリント配線板およびその製造方法
CN114650662B (zh) * 2020-12-21 2025-10-10 中兴通讯股份有限公司 一种印制电路板及其制造方法
WO2025117214A1 (en) * 2023-11-29 2025-06-05 KYOCERA AVX Components Corporation Multilayer electronic component including at least one via connected to a capacitor outside its capacitive area

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100400184C (zh) * 2001-10-23 2008-07-09 大卫·W·申德尔 超声波印刷电路板换能器
ES2305428T3 (es) * 2003-07-21 2008-11-01 Abb Research Ltd. Electroceramica metalizada irradiada por laser.
US7056800B2 (en) * 2003-12-15 2006-06-06 Motorola, Inc. Printed circuit embedded capacitors
KR100619367B1 (ko) * 2004-08-26 2006-09-08 삼성전기주식회사 고유전율을 갖는 커패시터를 내장한 인쇄회로기판 및 그제조 방법
JP4028863B2 (ja) * 2004-09-10 2007-12-26 富士通株式会社 基板製造方法
JP3816508B2 (ja) 2004-11-04 2006-08-30 三井金属鉱業株式会社 キャパシタ層形成材及びそのキャパシタ層形成材を用いて得られる内蔵キャパシタ層を備えたプリント配線板
KR100867038B1 (ko) * 2005-03-02 2008-11-04 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조방법
WO2007046173A1 (ja) * 2005-10-18 2007-04-26 Murata Manufacturing Co., Ltd. 薄膜キャパシタ
JP4461386B2 (ja) * 2005-10-31 2010-05-12 Ｔｄｋ株式会社 薄膜デバイスおよびその製造方法
KR100793916B1 (ko) * 2006-04-05 2008-01-15 삼성전기주식회사 인쇄회로기판 내장형 커패시터의 제조방법
KR100878414B1 (ko) * 2006-10-27 2009-01-13 삼성전기주식회사 캐패시터 내장형 인쇄회로기판 및 제조방법
KR100881695B1 (ko) * 2007-08-17 2009-02-06 삼성전기주식회사 캐패시터 내장형 인쇄회로기판 및 그 제조 방법
JP4876173B2 (ja) * 2008-01-25 2012-02-15 イビデン株式会社 多層配線板およびその製造方法
JP5659592B2 (ja) * 2009-11-13 2015-01-28 ソニー株式会社 印刷回路基板の製造方法

Also Published As

Publication number Publication date
US20120307469A1 (en) 2012-12-06
US9672983B2 (en) 2017-06-06
CN102821545A (zh) 2012-12-12
CN102821545B (zh) 2018-02-02
JP2012253195A (ja) 2012-12-20

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