JP5756174B2 - コアジャケットリボンワイヤ - Google Patents
コアジャケットリボンワイヤ Download PDFInfo
- Publication number
- JP5756174B2 JP5756174B2 JP2013520000A JP2013520000A JP5756174B2 JP 5756174 B2 JP5756174 B2 JP 5756174B2 JP 2013520000 A JP2013520000 A JP 2013520000A JP 2013520000 A JP2013520000 A JP 2013520000A JP 5756174 B2 JP5756174 B2 JP 5756174B2
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- JP
- Japan
- Prior art keywords
- wire
- bonding
- jacket
- metal
- core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000000463 material Substances 0.000 claims description 91
- 229910052751 metal Inorganic materials 0.000 claims description 43
- 239000002184 metal Substances 0.000 claims description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 238000002407 reforming Methods 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 239000011162 core material Substances 0.000 description 63
- 239000010410 layer Substances 0.000 description 23
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Chemical group [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229910052763 palladium Chemical group 0.000 description 2
- 239000005749 Copper compound Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- -1 aluminum compound Chemical class 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001880 copper compounds Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000009418 renovation Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Chemical group 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F45/00—Wire-working in the manufacture of other particular articles
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- H01L2924/2076—Diameter ranges equal to or larger than 100 microns
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Wire Bonding (AREA)
- Insulated Conductors (AREA)
- Laminated Bodies (AREA)
Description
次いで切断されることが必要とされ、その結果、切断バリが形成されるため、従来技術に係るサンドイッチ構造を有するリボンワイヤの切断バリが生成される。
Claims (5)
- 第1の材料から作製されたワイヤコアと、前記ワイヤコアを封入し、第2の材料から作製されたワイヤジャケットとを含む、ボンディングワイヤであって、前記第1の材料は銅、銅合金および銅を含む金属間相からなる群から選択される材料であり、前記第2の材料はアルミニウム、アルミニウム合金およびアルミニウムを含む金属間相からなる群から選択される材料であり、
前記ボンディングワイヤは0.8以下のアスペクト比を有し、
前記ワイヤジャケットの厚さが少なくとも250nmであり、
前記ワイヤジャケットの材料は、前記ボンディングワイヤの断面積に対して、5〜50%の面積を占め、
前記ボンディングワイヤは矩形の断面を有し、前記矩形の断面の幅が50〜400μm、前記矩形の断面の長さが400〜4,000μmであるボンディングワイヤ。 - 少なくとも1つの基板と、請求項1に記載のボンディングワイヤにより接続される1つのコンポーネントとを含む、サブアセンブリ。
- (i)第1の材料から作製されたワイヤコアと、前記ワイヤコアを封入し、第2の材料から作製されたワイヤジャケットとを含む円形ワイヤを提供する工程であって、前記第1の材料は第1の金属を含み、前記第2の材料は第2の金属を含み、前記第1の金属は前記第2の金属とは異なる、工程と、
(ii)前記円形ワイヤをリフォームする工程と、
を含む、請求項1に記載のボンディングワイヤを製造する方法。 - 前記円形ワイヤは平板圧延によりリフォームされる、請求項3に記載の方法。
- 前記円形ワイヤは引き抜き型により引き抜くことによってリフォームされる、請求項3に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010031993.7A DE102010031993B4 (de) | 2010-07-22 | 2010-07-22 | Verfahren zur Herstellung eines Bonddrahtes, Bonddraht und Baugruppe, die einen solchen Bonddraht aufweist. |
DE102010031993.7 | 2010-07-22 | ||
PCT/EP2011/003585 WO2012022404A2 (de) | 2010-07-22 | 2011-07-18 | Kern-mantel-bändchendraht |
Publications (2)
Publication Number | Publication Date |
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JP2013531393A JP2013531393A (ja) | 2013-08-01 |
JP5756174B2 true JP5756174B2 (ja) | 2015-07-29 |
Family
ID=44514611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2013520000A Expired - Fee Related JP5756174B2 (ja) | 2010-07-22 | 2011-07-18 | コアジャケットリボンワイヤ |
Country Status (7)
Country | Link |
---|---|
US (1) | US9236166B2 (ja) |
EP (2) | EP3425665B1 (ja) |
JP (1) | JP5756174B2 (ja) |
CN (1) | CN103038879B (ja) |
DE (1) | DE102010031993B4 (ja) |
MY (1) | MY154644A (ja) |
WO (1) | WO2012022404A2 (ja) |
Families Citing this family (9)
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EP3557609A1 (en) * | 2012-05-07 | 2019-10-23 | Heraeus Deutschland GmbH & Co KG | Method of manufacturing an aluminium coated copper ribbon and a device using the same |
DK2662891T3 (da) * | 2012-05-07 | 2020-07-13 | Heraeus Deutschland Gmbh & Co Kg | Fremgangsmåde til fremstilling af en aluminiumsovertrukket kobberbindingsledning |
DE102013200308A1 (de) * | 2013-01-11 | 2014-07-17 | Infineon Technologies Ag | Bonddraht und Verfahren zur Herstellung einer Bondverbindung |
EP2808873A1 (de) * | 2013-05-28 | 2014-12-03 | Nexans | Elektrisch leitfähiger Draht und Verfahren zu seiner Herstellung |
WO2016005068A1 (en) * | 2014-07-11 | 2016-01-14 | Heraeus Deutschland GmbH & Co. KG | Process for manufacturing of a thick copper wire for bonding applications |
CN104128385A (zh) * | 2014-07-23 | 2014-11-05 | 贵州钢绳股份有限公司 | 钢丝组合式矫直方法及其装置 |
DE102019119348B4 (de) * | 2019-07-17 | 2022-09-15 | Inovan Gmbh & Co. Kg | Beschichtetes Trägerband und Verwendung desselben zum Bonden einer Leistungselektronik |
EP4009025A1 (de) | 2020-12-07 | 2022-06-08 | Siemens Aktiengesellschaft | Bondverbindungsmittel aufweisend einen kern und umhüllenden mantel |
DE102022208367A1 (de) | 2022-08-11 | 2024-02-22 | Zf Friedrichshafen Ag | Leistungsmodul |
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DE102006025868A1 (de) * | 2006-06-02 | 2007-12-06 | Robert Bosch Gmbh | Bonddraht und Bondverbindung mit einem Bonddraht |
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DE102006060899A1 (de) * | 2006-12-20 | 2008-07-10 | Micro-Systems-Engineering Gmbh & Co. Kg | Anschlussdraht, Verfahren zur Herstellung eines solchen und Baugruppe |
DE102007041229A1 (de) * | 2007-08-31 | 2009-03-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Schaltungsanordnung und ein Verfahren zum Verkapseln derselben |
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DE102008054077B4 (de) | 2008-10-31 | 2021-04-01 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | Verfahren und Vorrichtung zur Herstellung von Bonddrähten auf der Grundlage mikroelektronischer Herstellungstechniken |
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2010
- 2010-07-22 DE DE102010031993.7A patent/DE102010031993B4/de not_active Expired - Fee Related
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2011
- 2011-07-18 US US13/811,419 patent/US9236166B2/en not_active Expired - Fee Related
- 2011-07-18 WO PCT/EP2011/003585 patent/WO2012022404A2/de active Application Filing
- 2011-07-18 MY MYPI2013000123A patent/MY154644A/en unknown
- 2011-07-18 JP JP2013520000A patent/JP5756174B2/ja not_active Expired - Fee Related
- 2011-07-18 CN CN201180035829.XA patent/CN103038879B/zh active Active
- 2011-07-18 EP EP18187935.4A patent/EP3425665B1/de active Active
- 2011-07-18 EP EP11749078.9A patent/EP2596528A2/de not_active Withdrawn
Also Published As
Publication number | Publication date |
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CN103038879B (zh) | 2015-11-25 |
US20130213689A1 (en) | 2013-08-22 |
EP2596528A2 (de) | 2013-05-29 |
MY154644A (en) | 2015-07-15 |
JP2013531393A (ja) | 2013-08-01 |
EP3425665B1 (de) | 2022-04-20 |
WO2012022404A3 (de) | 2012-06-28 |
DE102010031993A1 (de) | 2012-01-26 |
US9236166B2 (en) | 2016-01-12 |
DE102010031993B4 (de) | 2015-03-12 |
WO2012022404A8 (de) | 2012-08-30 |
WO2012022404A2 (de) | 2012-02-23 |
CN103038879A (zh) | 2013-04-10 |
EP3425665A1 (de) | 2019-01-09 |
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