JPH02211646A - 超音波ワイヤボンディング法 - Google Patents

超音波ワイヤボンディング法

Info

Publication number
JPH02211646A
JPH02211646A JP1033322A JP3332289A JPH02211646A JP H02211646 A JPH02211646 A JP H02211646A JP 1033322 A JP1033322 A JP 1033322A JP 3332289 A JP3332289 A JP 3332289A JP H02211646 A JPH02211646 A JP H02211646A
Authority
JP
Japan
Prior art keywords
wire
bonding
section
ultrasonic wave
wedge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1033322A
Other languages
English (en)
Inventor
Tsutomu Sakatsu
務 坂津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP1033322A priority Critical patent/JPH02211646A/ja
Publication of JPH02211646A publication Critical patent/JPH02211646A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/745—Apparatus for manufacturing wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/438—Post-treatment of the connector
    • H01L2224/4383—Reworking
    • H01L2224/43847—Reworking with a mechanical process, e.g. with flattening of the connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45016—Cross-sectional shape being elliptic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/745—Apparatus for manufacturing wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は超音波振動によるボンディング法に関する。
〔従来技術〕
超音波ワイヤボンディング法において接合部の微細化（
高密度ワイヤボンディング技術と呼ばれる）を図る上で
問題となるのはワイヤの変形量（特に潰れ巾）、ウェッ
ジツール巾及び接合ずれである。このうちのいずれかを
小さくして行けば微細化が可能である。そこで従来は１
）小径のワイヤを使用する、２）高精度のワイヤボンダ
ーを使用する等の試みがなされている。
しかし１）の方法は接合（ワイヤ）強度の点で問題があ
り、また２）の方法はボンダーの精度向上に限界がある
。
〔発明が解決しようとする課題〕
本発明の目的は従来技術における以上のような欠点を除
去し、ワイヤ断面を楕円形に加工して潰れ巾を最小限に
抑えることにより、ワイヤ強度、ボンダー精度等の問題
なく接合部の微小化を可能にした超音波ワイヤボンディ
ング法を提供することである。
〔発明の構成・動作〕
本発明の超音波ワイヤボンディング法はワイヤ断面を楕
円形に圧延加工後、この楕円の長手方向を接合面に対し
ほゞ垂直に維持した状態で超音波振動によりボンディン
グを行なうことを特徴とするものである。
超音波ワイヤボンディング法においては最良の接合状態
を得るために、一般にワイヤの潰れ巾はワイヤ径の約１
．８倍（例えばワイヤ径２５μｍでは潰れ巾は約４５μ
ｍ）に制御している（第１図（ａ）、（ｂ）参照、図中
１ａはワイヤ、ｌ’ａは潰れたワイヤ、２はウェッジ、
３は接合面）。微細ピッチのワイヤボンディングを行な
うには前述のようにワイヤの潰れ巾を最小限にする必要
がある。本発明方法はこの潰れ巾をワイヤ断面の圧延加
工により最小限に抑えることにより、ワイヤ強度を低下
させることなく微細ピッチのワイヤボンディングを可能
にしたものである。
本発明方法を第２図によって説明すると、まず通常の断
面円形のワイヤを例えば第３図及び第４図に示すような
角柱状又はローラー状圧延治具４，５を用いてワイヤ断
面が楕円形になるように圧延加工した後、この楕円形ワ
イヤを、楕円の長手方向を接合面３に対してぼり垂直に
維持した状態で例えば下部に円弧状の凹み６を有するウ
ェッジ２′下に供給し、超音波ワイヤボンディングを行
なう〔第２図（ａ）〕。こうして断面楕円形のワイヤ１
ｂはウェッジ１′ｂによって凹みの形状に潰されると共
にウェッジの超音波振動によって微小ピッチで接合され
る〔第２図（ｂ）〕。なお第３図のような圧延治具の場
合は第５図（図中、７はクランプ、８はホーン）に示す
ように接合のタイミングと同期するようにクランプして
おくと便利である。また本発明で用いられるウェッジの
先端部の他の例としては第６図に示されるようなＭＩＣ
ＲＯ５ＩｌｌＩＳＳ社のモデル４０４４０がある。この
ようなウェッジ２′ではワイヤが横に傾いて供給されな
いように、先端部に楕円形のホール９が設けられ、ワイ
ヤが立ったま＼ウェッジ下に供給され、接合されるよう
になっている。
〔発明の作用効果〕
本発明方法は以上のように予め断面楕円形に加工したワ
イヤを楕円の長手方向をはゾ垂直に維持した状態で超音
波ボンディングを行一 なうので、ワイヤの潰れ巾が従来よりも小さく抑えられ
、従ってワイヤ強度、ボンダー精度等の問題なく高密度
ワイヤボンディングを行なうことができる。
【図面の簡単な説明】
第１図及び第２図は夫々従来及び本発明の超音波ワイヤ
ボンディング法の説明図、第３図及び第４図は夫々本発
明方法に使用される圧延治具の一例の使用状態図、第５
図は第３図の治具を使用し′た時の実施態様、第６図は
本発明ウェッジの先端部の一例の側面図を示す。 １ａ・・・断面円形のワイヤ　　１ｂ・・・断面楕円形
のワイヤ１’ａ、ｌ’ｂ・・・潰れたワイヤ　２・・・
従来のウェッジ２′・・・本発明の一例のウェッジ ４．５・・・圧延治具　　　　　６・・・円弧状凹み７
・・・クランプ　　　　　　８・・・ホーン９・・・ワ
イヤガイド用ホール

Claims (1)

    【特許請求の範囲】
  1. １、ワイヤ断面を楕円形に圧延加工後、この楕円の長手
    方向を接合面に対しほゞ垂直に維持した状態で超音波振
    動によりボンディングを行なうことを特徴とする超音波
    ワイヤボンディング法。
JP1033322A 1989-02-10 1989-02-10 超音波ワイヤボンディング法 Pending JPH02211646A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1033322A JPH02211646A (ja) 1989-02-10 1989-02-10 超音波ワイヤボンディング法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1033322A JPH02211646A (ja) 1989-02-10 1989-02-10 超音波ワイヤボンディング法

Publications (1)

Publication Number Publication Date
JPH02211646A true JPH02211646A (ja) 1990-08-22

Family

ID=12383324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1033322A Pending JPH02211646A (ja) 1989-02-10 1989-02-10 超音波ワイヤボンディング法

Country Status (1)

Country Link
JP (1) JPH02211646A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005067040A1 (en) * 2004-01-06 2005-07-21 Philips Intellectual Property & Standards Gmbh Electrical component with bond wire
WO2012022404A2 (de) * 2010-07-22 2012-02-23 W.C. Heraeus Gmbh & Co. Kg Kern-mantel-bändchendraht

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005067040A1 (en) * 2004-01-06 2005-07-21 Philips Intellectual Property & Standards Gmbh Electrical component with bond wire
WO2012022404A2 (de) * 2010-07-22 2012-02-23 W.C. Heraeus Gmbh & Co. Kg Kern-mantel-bändchendraht
WO2012022404A3 (de) * 2010-07-22 2012-06-28 W.C. Heraeus Gmbh & Co. Kg Kern-mantel-bändchendraht
CN103038879A (zh) * 2010-07-22 2013-04-10 贺利氏材料科技公司 线芯-护套带状线
JP2013531393A (ja) * 2010-07-22 2013-08-01 ヘレウス マテリアルズ テクノロジー ゲーエムベーハー ウント カンパニー カーゲー コアジャケットリボンワイヤ
CN103038879B (zh) * 2010-07-22 2015-11-25 贺利氏材料科技公司 线芯-护套带状线
US9236166B2 (en) 2010-07-22 2016-01-12 Heraeus Deutschland GmbH & Co. KG Core-jacket bonding wire
EP3425665A1 (de) * 2010-07-22 2019-01-09 Heraeus Deutschland GmbH & Co KG Verfahren zur herstellung eines bonddrahtes

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