JP5750632B2 - 基板へのシート貼付装置 - Google Patents
基板へのシート貼付装置 Download PDFInfo
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- JP5750632B2 JP5750632B2 JP2010166499A JP2010166499A JP5750632B2 JP 5750632 B2 JP5750632 B2 JP 5750632B2 JP 2010166499 A JP2010166499 A JP 2010166499A JP 2010166499 A JP2010166499 A JP 2010166499A JP 5750632 B2 JP5750632 B2 JP 5750632B2
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- 239000000758 substrate Substances 0.000 title claims description 35
- 239000000853 adhesive Substances 0.000 claims description 115
- 230000001070 adhesive effect Effects 0.000 claims description 115
- 230000002093 peripheral effect Effects 0.000 claims description 48
- 238000010438 heat treatment Methods 0.000 claims description 18
- 238000005520 cutting process Methods 0.000 claims description 14
- 238000003825 pressing Methods 0.000 claims description 10
- 238000004804 winding Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 88
- 230000007246 mechanism Effects 0.000 description 36
- 239000003463 adsorbent Substances 0.000 description 6
- 238000003860 storage Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Images
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010166499A JP5750632B2 (ja) | 2010-07-23 | 2010-07-23 | 基板へのシート貼付装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010166499A JP5750632B2 (ja) | 2010-07-23 | 2010-07-23 | 基板へのシート貼付装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012028591A JP2012028591A (ja) | 2012-02-09 |
JP2012028591A5 JP2012028591A5 (enrdf_load_stackoverflow) | 2013-12-19 |
JP5750632B2 true JP5750632B2 (ja) | 2015-07-22 |
Family
ID=45781165
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2010166499A Active JP5750632B2 (ja) | 2010-07-23 | 2010-07-23 | 基板へのシート貼付装置 |
Country Status (1)
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JP (1) | JP5750632B2 (enrdf_load_stackoverflow) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6027324B2 (ja) * | 2012-03-15 | 2016-11-16 | リンテック株式会社 | シート貼付装置およびシート貼付方法 |
JP5937404B2 (ja) * | 2012-04-04 | 2016-06-22 | 日東電工株式会社 | 保護テープ剥離方法および保護テープ剥離装置 |
JP6006048B2 (ja) * | 2012-08-31 | 2016-10-12 | リンテック株式会社 | シート貼付装置及び貼付方法 |
JP6672099B2 (ja) * | 2016-07-25 | 2020-03-25 | 株式会社ディスコ | 加工装置 |
TWI685905B (zh) * | 2017-07-12 | 2020-02-21 | 日商新川股份有限公司 | 接合裝置和接合方法 |
JP7157527B2 (ja) * | 2017-12-18 | 2022-10-20 | 株式会社ディスコ | 拡張装置 |
JP7292889B2 (ja) * | 2019-02-01 | 2023-06-19 | 株式会社エム・シー・ケー | 剥離装置及び剥離方法 |
JP7599982B2 (ja) * | 2021-02-09 | 2024-12-16 | 株式会社ディスコ | シート貼着装置 |
CN113548511B (zh) * | 2021-06-05 | 2023-06-06 | 山东华滋自动化技术股份有限公司 | 一种微针眼贴加工设备及其加工方法 |
CN119626974B (zh) * | 2025-02-13 | 2025-06-20 | 深圳市汉诺精密科技有限公司 | 一种xy双驱平台 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3714813B2 (ja) * | 1999-01-21 | 2005-11-09 | 株式会社 日立インダストリイズ | フィルム貼付方法 |
JP2009194064A (ja) * | 2008-02-13 | 2009-08-27 | Takatori Corp | 基板への接着フィルム貼付け装置及び貼付け方法 |
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2010
- 2010-07-23 JP JP2010166499A patent/JP5750632B2/ja active Active
Also Published As
Publication number | Publication date |
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JP2012028591A (ja) | 2012-02-09 |
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