JP5731899B2 - 半導体膜の作製方法、及び半導体装置の作製方法 - Google Patents
半導体膜の作製方法、及び半導体装置の作製方法 Download PDFInfo
- Publication number
- JP5731899B2 JP5731899B2 JP2011109717A JP2011109717A JP5731899B2 JP 5731899 B2 JP5731899 B2 JP 5731899B2 JP 2011109717 A JP2011109717 A JP 2011109717A JP 2011109717 A JP2011109717 A JP 2011109717A JP 5731899 B2 JP5731899 B2 JP 5731899B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- oxide semiconductor
- light
- semiconductor layer
- light transmission
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02565—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/02554—Oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thin Film Transistor (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011109717A JP5731899B2 (ja) | 2010-05-20 | 2011-05-16 | 半導体膜の作製方法、及び半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010116128 | 2010-05-20 | ||
| JP2010116128 | 2010-05-20 | ||
| JP2011109717A JP5731899B2 (ja) | 2010-05-20 | 2011-05-16 | 半導体膜の作製方法、及び半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012004550A JP2012004550A (ja) | 2012-01-05 |
| JP2012004550A5 JP2012004550A5 (enExample) | 2014-06-26 |
| JP5731899B2 true JP5731899B2 (ja) | 2015-06-10 |
Family
ID=44972821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011109717A Expired - Fee Related JP5731899B2 (ja) | 2010-05-20 | 2011-05-16 | 半導体膜の作製方法、及び半導体装置の作製方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20110287593A1 (enExample) |
| JP (1) | JP5731899B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9076825B2 (en) * | 2013-01-30 | 2015-07-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the semiconductor device |
| CN104900711B (zh) * | 2015-06-08 | 2019-11-05 | 京东方科技集团股份有限公司 | 薄膜晶体管及其制作方法以及阵列基板、显示装置 |
| CN113345919B (zh) * | 2021-05-25 | 2023-07-04 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及其制作方法 |
| US12408380B2 (en) | 2021-05-25 | 2025-09-02 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display panel including light-absorbing layer |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100294026B1 (ko) * | 1993-06-24 | 2001-09-17 | 야마자끼 순페이 | 전기광학장치 |
| US5545588A (en) * | 1995-05-05 | 1996-08-13 | Taiwan Semiconductor Manufacturing Company | Method of using disposable hard mask for gate critical dimension control |
| US5741741A (en) * | 1996-05-23 | 1998-04-21 | Vanguard International Semiconductor Corporation | Method for making planar metal interconnections and metal plugs on semiconductor substrates |
| US6010829A (en) * | 1996-05-31 | 2000-01-04 | Texas Instruments Incorporated | Polysilicon linewidth reduction using a BARC-poly etch process |
| US6136679A (en) * | 1999-03-05 | 2000-10-24 | Taiwan Semiconductor Manufacturing Company | Gate micro-patterning process |
| US6586339B1 (en) * | 1999-10-28 | 2003-07-01 | Advanced Micro Devices, Inc. | Silicon barrier layer to prevent resist poisoning |
| KR100825907B1 (ko) * | 2000-05-13 | 2008-04-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 제작방법 |
| US6583440B2 (en) * | 2000-11-30 | 2003-06-24 | Seiko Epson Corporation | Soi substrate, element substrate, semiconductor device, electro-optical apparatus, electronic equipment, method of manufacturing the soi substrate, method of manufacturing the element substrate, and method of manufacturing the electro-optical apparatus |
| JP4655368B2 (ja) * | 2000-12-12 | 2011-03-23 | 日本電気株式会社 | 移動体端末 |
| US6533907B2 (en) * | 2001-01-19 | 2003-03-18 | Symmorphix, Inc. | Method of producing amorphous silicon for hard mask and waveguide applications |
| DE10138648A1 (de) * | 2001-08-07 | 2003-03-06 | Infineon Technologies Ag | Verfahren zum parallelen Herstellen eines MOS-Transistors und eines Bipolartransistors |
| JP4090716B2 (ja) * | 2001-09-10 | 2008-05-28 | 雅司 川崎 | 薄膜トランジスタおよびマトリクス表示装置 |
| TWI273637B (en) * | 2002-05-17 | 2007-02-11 | Semiconductor Energy Lab | Manufacturing method of semiconductor device |
| US6680258B1 (en) * | 2002-10-02 | 2004-01-20 | Promos Technologies, Inc. | Method of forming an opening through an insulating layer of a semiconductor device |
| US7078351B2 (en) * | 2003-02-10 | 2006-07-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist intensive patterning and processing |
| JP4114064B2 (ja) * | 2003-05-27 | 2008-07-09 | 信越化学工業株式会社 | 珪素含有高分子化合物、レジスト材料及びパターン形成方法 |
| US7262463B2 (en) * | 2003-07-25 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | Transistor including a deposited channel region having a doped portion |
| US8637340B2 (en) * | 2004-11-30 | 2014-01-28 | Solexel, Inc. | Patterning of silicon oxide layers using pulsed laser ablation |
| KR100711890B1 (ko) * | 2005-07-28 | 2007-04-25 | 삼성에스디아이 주식회사 | 유기 발광표시장치 및 그의 제조방법 |
| JP4963021B2 (ja) * | 2005-09-06 | 2012-06-27 | 独立行政法人産業技術総合研究所 | 半導体構造 |
| JP5037808B2 (ja) * | 2005-10-20 | 2012-10-03 | キヤノン株式会社 | アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置 |
| WO2007058329A1 (en) * | 2005-11-15 | 2007-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US7867907B2 (en) * | 2006-10-17 | 2011-01-11 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| KR100867633B1 (ko) * | 2007-02-13 | 2008-11-10 | 삼성전자주식회사 | 티타늄 알루미늄 질화막의 형성 방법 및 이를 이용한상변화 메모리 소자의 형성 방법 |
| TWI358832B (en) * | 2007-02-26 | 2012-02-21 | Au Optronics Corp | Semiconductor device and manufacturing method ther |
| KR101345378B1 (ko) * | 2007-05-17 | 2013-12-24 | 삼성전자주식회사 | ZnO 계 박막 트랜지스터 및 그 제조방법 |
| JP5458367B2 (ja) * | 2007-07-09 | 2014-04-02 | Nltテクノロジー株式会社 | 薄膜トランジスタ及びその製造方法 |
| JP2009033004A (ja) * | 2007-07-30 | 2009-02-12 | Fujifilm Corp | 薄膜素子とその製造方法、半導体装置 |
| JP2009105218A (ja) * | 2007-10-23 | 2009-05-14 | Toshiba Corp | パターン形成方法 |
| US8384077B2 (en) * | 2007-12-13 | 2013-02-26 | Idemitsu Kosan Co., Ltd | Field effect transistor using oxide semicondutor and method for manufacturing the same |
| JP2010080552A (ja) * | 2008-09-24 | 2010-04-08 | Brother Ind Ltd | トランジスタの製造方法 |
| CN102509736B (zh) * | 2008-10-24 | 2015-08-19 | 株式会社半导体能源研究所 | 半导体器件和用于制造该半导体器件的方法 |
| US8080443B2 (en) * | 2008-10-27 | 2011-12-20 | Sandisk 3D Llc | Method of making pillars using photoresist spacer mask |
| CN102054668B (zh) * | 2009-10-28 | 2012-02-22 | 中国科学院微电子研究所 | 电子束正性光刻胶Zep 520掩蔽介质刻蚀的方法 |
| US8766252B2 (en) * | 2010-07-02 | 2014-07-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising an oxide semiconductor |
-
2011
- 2011-05-13 US US13/107,057 patent/US20110287593A1/en not_active Abandoned
- 2011-05-16 JP JP2011109717A patent/JP5731899B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012004550A (ja) | 2012-01-05 |
| US20110287593A1 (en) | 2011-11-24 |
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