JP5728341B2 - 排気トラップ - Google Patents

排気トラップ Download PDF

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Publication number
JP5728341B2
JP5728341B2 JP2011199622A JP2011199622A JP5728341B2 JP 5728341 B2 JP5728341 B2 JP 5728341B2 JP 2011199622 A JP2011199622 A JP 2011199622A JP 2011199622 A JP2011199622 A JP 2011199622A JP 5728341 B2 JP5728341 B2 JP 5728341B2
Authority
JP
Japan
Prior art keywords
gas
exhaust
small
diameter hole
baffle plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011199622A
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English (en)
Japanese (ja)
Other versions
JP2013062362A5 (https=
JP2013062362A (ja
Inventor
悟 小池
悟 小池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2011199622A priority Critical patent/JP5728341B2/ja
Priority to KR1020120097249A priority patent/KR101538830B1/ko
Priority to US13/608,695 priority patent/US20130061969A1/en
Priority to CN201210335345.3A priority patent/CN102989238B/zh
Priority to TW101133232A priority patent/TWI551721B/zh
Publication of JP2013062362A publication Critical patent/JP2013062362A/ja
Publication of JP2013062362A5 publication Critical patent/JP2013062362A5/ja
Application granted granted Critical
Publication of JP5728341B2 publication Critical patent/JP5728341B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D45/00—Separating dispersed particles from gases or vapours by gravity, inertia, or centrifugal forces
    • B01D45/04—Separating dispersed particles from gases or vapours by gravity, inertia, or centrifugal forces by utilising inertia
    • B01D45/08—Separating dispersed particles from gases or vapours by gravity, inertia, or centrifugal forces by utilising inertia by impingement against baffle separators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
    • B01D46/10—Particle separators, e.g. dust precipitators, using filter plates, sheets or pads having plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D50/00—Combinations of methods or devices for separating particles from gases or vapours
    • B01D50/20—Combinations of devices covered by groups B01D45/00 and B01D46/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2011199622A 2011-09-13 2011-09-13 排気トラップ Expired - Fee Related JP5728341B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011199622A JP5728341B2 (ja) 2011-09-13 2011-09-13 排気トラップ
KR1020120097249A KR101538830B1 (ko) 2011-09-13 2012-09-03 배기 트랩
US13/608,695 US20130061969A1 (en) 2011-09-13 2012-09-10 Exhaust trap
CN201210335345.3A CN102989238B (zh) 2011-09-13 2012-09-11 排气捕集器
TW101133232A TWI551721B (zh) 2011-09-13 2012-09-12 排氣阱

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011199622A JP5728341B2 (ja) 2011-09-13 2011-09-13 排気トラップ

Publications (3)

Publication Number Publication Date
JP2013062362A JP2013062362A (ja) 2013-04-04
JP2013062362A5 JP2013062362A5 (https=) 2014-04-17
JP5728341B2 true JP5728341B2 (ja) 2015-06-03

Family

ID=47828749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011199622A Expired - Fee Related JP5728341B2 (ja) 2011-09-13 2011-09-13 排気トラップ

Country Status (5)

Country Link
US (1) US20130061969A1 (https=)
JP (1) JP5728341B2 (https=)
KR (1) KR101538830B1 (https=)
CN (1) CN102989238B (https=)
TW (1) TWI551721B (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103752122B (zh) * 2014-02-11 2015-11-11 江苏佳有环保科技有限公司 漆气氧化洗涤塔装置
JP6468884B2 (ja) 2014-04-21 2019-02-13 東京エレクトロン株式会社 排気システム
US10927457B2 (en) * 2015-03-04 2021-02-23 Toshiba Memory Corporation Semiconductor manufacturing apparatus
TWI624554B (zh) * 2015-08-21 2018-05-21 弗里松股份有限公司 蒸發源
MY190445A (en) 2015-08-21 2022-04-21 Flisom Ag Homogeneous linear evaporation source
RU2724260C1 (ru) 2016-10-14 2020-06-22 АйЭйчАй КОРПОРЕЙШН Устройство для отбора повторным нагреванием для газофазного процесса
TWI665019B (zh) * 2017-02-15 2019-07-11 Scientech Corporation 基板處理裝置
KR102330646B1 (ko) * 2017-03-22 2021-11-23 스미스 아날리티컬 엘엘씨 증류 프로브 및 유체를 샘플링하고 조절하기 위한 방법
JP7258274B2 (ja) * 2018-12-25 2023-04-17 株式会社レゾナック フィルタ装置、化学気相成長装置およびＳｉＣエピタキシャルウェハの製造方法
KR102209205B1 (ko) * 2019-08-21 2021-02-01 주식회사 미래보 반도체 공정용 유로방향 전환식 반응부산물 포집장치
US11282491B2 (en) * 2019-12-17 2022-03-22 Emerson Process Management Regulator Technologies, Inc. Plates and plate assemblies for noise attenuators and other devices and methods making the same
US11562726B2 (en) 2019-12-17 2023-01-24 Emerson Process Management Regulator Technologies, Inc. Plates and plate assemblies for noise attenuators and other devices and methods making the same
TWI889744B (zh) * 2020-01-29 2025-07-11 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 污染物捕集系統、及擋板堆疊
JP2021186785A (ja) * 2020-06-03 2021-12-13 東京エレクトロン株式会社 トラップ装置及び基板処理装置
US11992835B2 (en) 2020-08-04 2024-05-28 Universal Analyzers Inc. Distillation probes and methods for sampling and conditioning a fluid
KR102442234B1 (ko) * 2021-02-09 2022-09-13 주식회사 저스템 기류 균일화 장치를 구비한 efem
TW202303865A (zh) 2021-05-28 2023-01-16 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 污染物捕集系統、及擋板堆疊
CN113818012B (zh) * 2021-11-25 2022-04-01 新美光(苏州)半导体科技有限公司 一种化学气相沉积装置

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1186067A (en) * 1915-09-28 1916-06-06 William A Rawlings Muffler.
US1632325A (en) * 1924-05-26 1927-06-14 Int Precipitation Co Gas scrubber
GB268163A (en) * 1926-05-03 1927-03-31 Vilbiss Co Improvements in apparatus for cleansing air and gases
US1857348A (en) * 1928-05-14 1932-05-10 Bokenkroger William Filter for gaseous substances
US3224171A (en) * 1963-08-16 1965-12-21 Hyman D Bowman Exhaust filter for internal combustion engines
US3572391A (en) * 1969-07-10 1971-03-23 Hirsch Abraham A Flow uniformizing baffling for closed process vessels
US3606738A (en) * 1969-12-02 1971-09-21 Ben Kraus Jr Fluid separator
US4065918A (en) * 1973-02-12 1978-01-03 Ethyl Corporation Exhaust systems
US4506513A (en) * 1983-06-17 1985-03-26 Max John K Cold trap
US4488887A (en) * 1983-10-17 1984-12-18 R. J. Reynolds Tobacco Company Cold trap
DK166260C (da) * 1990-06-08 1993-08-30 Haldor Topsoe As Fremgangsmaade til fjernelse af sure, gasformige bestanddele i roeg- og spildgas ved behandling med ammoniak
JPH05160029A (ja) * 1991-12-02 1993-06-25 Hitachi Ltd 成膜装置およびその排気トラップ
US5422081A (en) * 1992-11-25 1995-06-06 Tokyo Electron Kabushiki Kaisha Trap device for vapor phase reaction apparatus
JPH07193008A (ja) * 1993-12-27 1995-07-28 Toshiba Corp 半導体化学気相成長システム
JP3540064B2 (ja) * 1995-09-04 2004-07-07 株式会社アルバック ドライ真空ポンプ前段用のトラップ
JPH1054356A (ja) * 1996-08-14 1998-02-24 Ebara Corp 析出物除去用トラップ
JP3991375B2 (ja) * 1996-11-13 2007-10-17 東京エレクトロン株式会社 トラップ装置
US6156107A (en) * 1996-11-13 2000-12-05 Tokyo Electron Limited Trap apparatus
JPH11300153A (ja) * 1998-04-24 1999-11-02 Dainippon Screen Mfg Co Ltd 昇華成分除去ユニットおよびそれを備えた熱処理装置
JP2000045073A (ja) * 1998-07-29 2000-02-15 Kokusai Electric Co Ltd 排気トラップ及び処理装置
JP2000256856A (ja) * 1999-03-11 2000-09-19 Tokyo Electron Ltd 処理装置及び処理装置用真空排気システム及び減圧ｃｖｄ装置及び減圧ｃｖｄ装置用真空排気システム及びトラップ装置
US6206971B1 (en) * 1999-03-29 2001-03-27 Applied Materials, Inc. Integrated temperature controlled exhaust and cold trap assembly
US6173735B1 (en) * 1999-04-29 2001-01-16 Perry Equipment Corporation Method and apparatus for regulating gas flow
JP4642379B2 (ja) * 2004-05-12 2011-03-02 東京エレクトロン株式会社 排気捕集装置
JP4911980B2 (ja) * 2006-02-02 2012-04-04 東京エレクトロン株式会社 減圧処理装置
JP5036354B2 (ja) * 2006-04-04 2012-09-26 東京エレクトロン株式会社 成膜装置の排気系構造、成膜装置、および排ガスの処理方法
JP5128168B2 (ja) * 2006-04-24 2013-01-23 三菱電線工業株式会社 排気装置
US7866345B2 (en) * 2007-09-28 2011-01-11 Circor Instrumentation Technologies, Inc. Non-clogging flow restriction for pressure based flow control devices
JP5696348B2 (ja) * 2008-08-09 2015-04-08 東京エレクトロン株式会社 金属回収方法、金属回収装置、排気系及びこれを用いた成膜装置
CN201470229U (zh) * 2009-09-01 2010-05-19 中国石油集团西部钻探工程有限公司吐哈钻井工艺研究院 环保抑尘器
CN201589723U (zh) * 2009-12-15 2010-09-22 东莞市环境保护监测站 粒子采样用分级冲撞器

Also Published As

Publication number Publication date
TWI551721B (zh) 2016-10-01
TW201329282A (zh) 2013-07-16
CN102989238B (zh) 2015-06-03
US20130061969A1 (en) 2013-03-14
CN102989238A (zh) 2013-03-27
KR101538830B1 (ko) 2015-07-22
JP2013062362A (ja) 2013-04-04
KR20130029011A (ko) 2013-03-21

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