JP5727892B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP5727892B2 JP5727892B2 JP2011180482A JP2011180482A JP5727892B2 JP 5727892 B2 JP5727892 B2 JP 5727892B2 JP 2011180482 A JP2011180482 A JP 2011180482A JP 2011180482 A JP2011180482 A JP 2011180482A JP 5727892 B2 JP5727892 B2 JP 5727892B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- oxide semiconductor
- transistor
- address signal
- semiconductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5685—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using storage elements comprising metal oxide memory material, e.g. perovskites
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/403—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/565—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using capacitive charge storage elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0004—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/003—Cell access
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0433—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and one or more separate select transistors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/08—Address circuits; Decoders; Word-line control circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Thin Film Transistor (AREA)
- Non-Volatile Memory (AREA)
- Dram (AREA)
- Semiconductor Memories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011180482A JP5727892B2 (ja) | 2010-08-26 | 2011-08-22 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010189665 | 2010-08-26 | ||
| JP2010189665 | 2010-08-26 | ||
| JP2011180482A JP5727892B2 (ja) | 2010-08-26 | 2011-08-22 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012069231A JP2012069231A (ja) | 2012-04-05 |
| JP2012069231A5 JP2012069231A5 (enExample) | 2014-07-24 |
| JP5727892B2 true JP5727892B2 (ja) | 2015-06-03 |
Family
ID=45697092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011180482A Active JP5727892B2 (ja) | 2010-08-26 | 2011-08-22 | 半導体装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8582349B2 (enExample) |
| JP (1) | JP5727892B2 (enExample) |
| KR (1) | KR101860568B1 (enExample) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101291395B1 (ko) | 2009-06-30 | 2013-07-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 제조 방법 |
| KR101913111B1 (ko) | 2009-12-18 | 2018-10-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| TWI590249B (zh) * | 2010-12-03 | 2017-07-01 | 半導體能源研究所股份有限公司 | 積體電路，其驅動方法，及半導體裝置 |
| JP5879165B2 (ja) * | 2011-03-30 | 2016-03-08 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| TWI570730B (zh) | 2011-05-20 | 2017-02-11 | 半導體能源研究所股份有限公司 | 半導體裝置 |
| JP5975907B2 (ja) * | 2012-04-11 | 2016-08-23 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR102479944B1 (ko) | 2012-04-13 | 2022-12-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR20130125717A (ko) * | 2012-05-09 | 2013-11-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 구동 방법 |
| JP6377317B2 (ja) * | 2012-05-30 | 2018-08-22 | 株式会社半導体エネルギー研究所 | プログラマブルロジックデバイス |
| JP6220597B2 (ja) * | 2012-08-10 | 2017-10-25 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US8519450B1 (en) * | 2012-08-17 | 2013-08-27 | International Business Machines Corporation | Graphene-based non-volatile memory |
| TWI709244B (zh) * | 2012-09-24 | 2020-11-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| DE102014208859B4 (de) * | 2013-05-20 | 2021-03-11 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung |
| JP6383616B2 (ja) * | 2013-09-25 | 2018-08-29 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US9246013B2 (en) | 2013-12-18 | 2016-01-26 | Intermolecular, Inc. | IGZO devices with composite channel layers and methods for forming the same |
| KR102325158B1 (ko) * | 2014-01-30 | 2021-11-10 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 전자 기기, 및 반도체 장치의 제작 방법 |
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| EP2911202B1 (en) | 2014-02-24 | 2019-02-20 | LG Display Co., Ltd. | Thin film transistor substrate and display using the same |
| US10325937B2 (en) | 2014-02-24 | 2019-06-18 | Lg Display Co., Ltd. | Thin film transistor substrate with intermediate insulating layer and display using the same |
| US10186528B2 (en) | 2014-02-24 | 2019-01-22 | Lg Display Co., Ltd. | Thin film transistor substrate and display using the same |
| US9214508B2 (en) | 2014-02-24 | 2015-12-15 | Lg Display Co., Ltd. | Thin film transistor substrate with intermediate insulating layer and display using the same |
| US10985196B2 (en) | 2014-02-24 | 2021-04-20 | Lg Display Co., Ltd. | Thin film transistor substrate with intermediate insulating layer and display using the same |
| EP2911200B1 (en) | 2014-02-24 | 2020-06-03 | LG Display Co., Ltd. | Thin film transistor substrate and display using the same |
| EP2911199B1 (en) | 2014-02-24 | 2020-05-06 | LG Display Co., Ltd. | Thin film transistor substrate and display using the same |
| US9349728B1 (en) | 2015-03-27 | 2016-05-24 | United Microelectronics Corp. | Semiconductor device and method for fabricating the same |
| TWI777164B (zh) | 2015-03-30 | 2022-09-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置的製造方法 |
| US9716852B2 (en) * | 2015-04-03 | 2017-07-25 | Semiconductor Energy Laboratory Co., Ltd. | Broadcast system |
| CN106158857B (zh) | 2015-04-21 | 2020-12-22 | 联华电子股份有限公司 | 半导体元件及其制作方法 |
| TWI628721B (zh) | 2015-07-08 | 2018-07-01 | 聯華電子股份有限公司 | 氧化物半導體元件及其製造方法 |
| CN106558620B (zh) * | 2015-09-29 | 2021-09-07 | 联华电子股份有限公司 | 半导体元件及其形成方法 |
| KR102605008B1 (ko) | 2018-01-24 | 2023-11-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 전자 부품, 및 전자 기기 |
| WO2020240331A1 (ja) | 2019-05-31 | 2020-12-03 | 株式会社半導体エネルギー研究所 | 半導体装置、および当該半導体装置を備えた無線通信装置 |
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| JP2012069231A (ja) | 2012-04-05 |
| KR20120027089A (ko) | 2012-03-21 |
| KR101860568B1 (ko) | 2018-05-23 |
| US8582349B2 (en) | 2013-11-12 |
| US20120051119A1 (en) | 2012-03-01 |
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