JP5725700B2 - サブミクロン粒度を有するバルク金属構造体の製造法及びかかる方法により製造された構造体 - Google Patents

サブミクロン粒度を有するバルク金属構造体の製造法及びかかる方法により製造された構造体 Download PDF

Info

Publication number
JP5725700B2
JP5725700B2 JP2009232394A JP2009232394A JP5725700B2 JP 5725700 B2 JP5725700 B2 JP 5725700B2 JP 2009232394 A JP2009232394 A JP 2009232394A JP 2009232394 A JP2009232394 A JP 2009232394A JP 5725700 B2 JP5725700 B2 JP 5725700B2
Authority
JP
Japan
Prior art keywords
deposit
powder
substrate
particle size
submicron
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009232394A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010090477A5 (https=
JP2010090477A (ja
Inventor
エー. ミラー スティーヴン
エー. ミラー スティーヴン
クマー プラブハット
クマー プラブハット
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Materion Newton Inc
Original Assignee
HC Starck Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=41416078&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP5725700(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by HC Starck Inc filed Critical HC Starck Inc
Publication of JP2010090477A publication Critical patent/JP2010090477A/ja
Publication of JP2010090477A5 publication Critical patent/JP2010090477A5/ja
Application granted granted Critical
Publication of JP5725700B2 publication Critical patent/JP5725700B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00Coating starting from inorganic powder
    • C23C24/02Coating starting from inorganic powder by application of pressure only
    • C23C24/04Impact or kinetic deposition of particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/07Metallic powder characterised by particles having a nanoscale microstructure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/14Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas designed for spraying particulate materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/20Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by extruding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00Supplementary information concerning processes or compositions relating to powder metallurgy
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C2200/00Crystalline structure
    • C22C2200/04Nanocrystalline
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12014All metal or with adjacent metals having metal particles
    • Y10T428/12028Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Physical Vapour Deposition (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
JP2009232394A 2008-10-06 2009-10-06 サブミクロン粒度を有するバルク金属構造体の製造法及びかかる方法により製造された構造体 Active JP5725700B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/245,840 2008-10-06
US12/245,840 US8043655B2 (en) 2008-10-06 2008-10-06 Low-energy method of manufacturing bulk metallic structures with submicron grain sizes

Publications (3)

Publication Number Publication Date
JP2010090477A JP2010090477A (ja) 2010-04-22
JP2010090477A5 JP2010090477A5 (https=) 2012-09-27
JP5725700B2 true JP5725700B2 (ja) 2015-05-27

Family

ID=41416078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009232394A Active JP5725700B2 (ja) 2008-10-06 2009-10-06 サブミクロン粒度を有するバルク金属構造体の製造法及びかかる方法により製造された構造体

Country Status (10)

Country Link
US (1) US8043655B2 (https=)
EP (1) EP2172292B1 (https=)
JP (1) JP5725700B2 (https=)
KR (1) KR101456725B1 (https=)
CN (1) CN101713071B (https=)
BR (1) BRPI0904976A2 (https=)
CA (1) CA2681424A1 (https=)
MX (1) MX2009010724A (https=)
RU (1) RU2009136708A (https=)
ZA (1) ZA200906940B (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2006243448B2 (en) * 2005-05-05 2011-09-01 H.C. Starck Inc. Coating process for manufacture or reprocessing of sputter targets and X-ray anodes
JP5065248B2 (ja) 2005-05-05 2012-10-31 ハー.ツェー.スタルク ゲゼルシャフト ミット ベシュレンクテル ハフツング 基材表面の被覆法及び被覆製品
US7837929B2 (en) * 2005-10-20 2010-11-23 H.C. Starck Inc. Methods of making molybdenum titanium sputtering plates and targets
US20080078268A1 (en) * 2006-10-03 2008-04-03 H.C. Starck Inc. Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof
BRPI0718237A2 (pt) * 2006-11-07 2013-11-12 Starck H C Gmbh Método para revestir uma superfície de substrato e produto revestido
US20080145688A1 (en) 2006-12-13 2008-06-19 H.C. Starck Inc. Method of joining tantalum clade steel structures
US8197894B2 (en) 2007-05-04 2012-06-12 H.C. Starck Gmbh Methods of forming sputtering targets
US8246903B2 (en) 2008-09-09 2012-08-21 H.C. Starck Inc. Dynamic dehydriding of refractory metal powders
US8709335B1 (en) * 2009-10-20 2014-04-29 Hanergy Holding Group Ltd. Method of making a CIG target by cold spraying
US8449817B2 (en) 2010-06-30 2013-05-28 H.C. Stark, Inc. Molybdenum-containing targets comprising three metal elements
US8449818B2 (en) 2010-06-30 2013-05-28 H. C. Starck, Inc. Molybdenum containing targets
KR20160021299A (ko) 2011-05-10 2016-02-24 에이치. 씨. 스타아크 아이앤씨 멀티-블록 스퍼터링 타겟 및 이에 관한 제조방법 및 물품
US8703233B2 (en) 2011-09-29 2014-04-22 H.C. Starck Inc. Methods of manufacturing large-area sputtering targets by cold spray
US9334565B2 (en) 2012-05-09 2016-05-10 H.C. Starck Inc. Multi-block sputtering target with interface portions and associated methods and articles
WO2014073633A1 (ja) * 2012-11-12 2014-05-15 日立金属株式会社 コールドスプレー用粉末およびこれを用いたスパッタリングターゲットの製造方法
AU2015246650B2 (en) * 2014-04-15 2019-08-29 Commonwealth Scientific And Industrial Research Organisation Process for producing a preform using cold spray
CN106694872A (zh) * 2016-11-18 2017-05-24 华中科技大学 一种适用于零件与模具的复合增材制造方法
KR101971252B1 (ko) 2018-07-20 2019-04-22 장준하 파력 실험을 위한 수조 타입 물결파 발생장치
CN110508809B (zh) * 2019-08-29 2020-11-17 华中科技大学 一种增材制造与表面涂覆复合成形系统及方法
EP4686906A3 (en) 2021-05-31 2026-03-11 Composite Technology R & D Pty Limited Additively manufactured bomb casing
KR102866116B1 (ko) 2021-11-26 2025-09-30 삼성전자주식회사 반도체 패키지
US12370600B2 (en) 2022-01-08 2025-07-29 M4 Sciences, Llc Composite manufacturing methods using metal-polymer amalgamations
CN115338422A (zh) * 2022-06-29 2022-11-15 西北工业大学 一种提高毁伤后效压力的多层药型罩涂层的增材制造方法

Family Cites Families (115)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3990784A (en) 1974-06-05 1976-11-09 Optical Coating Laboratory, Inc. Coated architectural glass system and method
US4011981A (en) 1975-03-27 1977-03-15 Olin Corporation Process for bonding titanium, tantalum, and alloys thereof
US4073427A (en) 1976-10-07 1978-02-14 Fansteel Inc. Lined equipment with triclad wall construction
US4140172A (en) 1976-12-23 1979-02-20 Fansteel Inc. Liners and tube supports for industrial and chemical process equipment
US4291104A (en) 1978-04-17 1981-09-22 Fansteel Inc. Brazed corrosion resistant lined equipment
US4202932A (en) 1978-07-21 1980-05-13 Xerox Corporation Magnetic recording medium
DE3130392C2 (de) 1981-07-31 1985-10-17 Hermann C. Starck Berlin, 1000 Berlin Verfahren zur Herstellung reiner agglomerierter Ventilmetallpulver für Elektrolytkondensatoren, deren Verwendung und Verfahren zur Herstellung von Sinteranoden
US4459062A (en) 1981-09-11 1984-07-10 Monsanto Company Clad metal joint closure
CA1202599A (en) 1982-06-10 1986-04-01 Michael G. Down Upgrading titanium, zirconium and hafnium powders by plasma processing
DE3309891A1 (de) 1983-03-18 1984-10-31 Hermann C. Starck Berlin, 1000 Berlin Verfahren zur herstellung von ventilmetallanoden fuer elektrolytkondensatoren
US4508563A (en) 1984-03-19 1985-04-02 Sprague Electric Company Reducing the oxygen content of tantalum
US4818629A (en) 1985-08-26 1989-04-04 Fansteel Inc. Joint construction for lined equipment
US4722756A (en) 1987-02-27 1988-02-02 Cabot Corp Method for deoxidizing tantalum material
US4731111A (en) 1987-03-16 1988-03-15 Gte Products Corporation Hydrometallurical process for producing finely divided spherical refractory metal based powders
JPS6415353A (en) * 1987-07-08 1989-01-19 Toshiba Corp Alloy for thermal spraying
US4915745A (en) 1988-09-22 1990-04-10 Atlantic Richfield Company Thin film solar cell and method of making
US5242481A (en) 1989-06-26 1993-09-07 Cabot Corporation Method of making powders and products of tantalum and niobium
US4964906A (en) 1989-09-26 1990-10-23 Fife James A Method for controlling the oxygen content of tantalum material
WO1991019016A1 (fr) 1990-05-19 1991-12-12 Institut Teoreticheskoi I Prikladnoi Mekhaniki Sibirskogo Otdelenia Akademii Nauk Sssr Procede et dispositif de revetement
US5091244A (en) 1990-08-10 1992-02-25 Viratec Thin Films, Inc. Electrically-conductive, light-attenuating antireflection coating
US5270858A (en) 1990-10-11 1993-12-14 Viratec Thin Films Inc D.C. reactively sputtered antireflection coatings
US5612254A (en) 1992-06-29 1997-03-18 Intel Corporation Methods of forming an interconnect on a semiconductor substrate
US5693203A (en) 1992-09-29 1997-12-02 Japan Energy Corporation Sputtering target assembly having solid-phase bonded interface
US5305946A (en) 1992-11-05 1994-04-26 Nooter Corporation Welding process for clad metals
US5679473A (en) 1993-04-01 1997-10-21 Asahi Komag Co., Ltd. Magnetic recording medium and method for its production
US6103392A (en) 1994-12-22 2000-08-15 Osram Sylvania Inc. Tungsten-copper composite powder
US5795626A (en) 1995-04-28 1998-08-18 Innovative Technology Inc. Coating or ablation applicator with a debris recovery attachment
US5993513A (en) 1996-04-05 1999-11-30 Cabot Corporation Method for controlling the oxygen content in valve metal materials
US5954856A (en) 1996-04-25 1999-09-21 Cabot Corporation Method of making tantalum metal powder with controlled size distribution and products made therefrom
US5859654A (en) 1996-10-31 1999-01-12 Hewlett-Packard Company Print head for ink-jet printing a method for making print heads
KR100522066B1 (ko) 1997-02-19 2005-10-18 하.체. 스타르크 게엠베하 탄탈 분말, 그의 제조 방법 및 그로부터 얻어진 소결 양극
US5972065A (en) 1997-07-10 1999-10-26 The Regents Of The University Of California Purification of tantalum by plasma arc melting
WO1999027579A1 (en) 1997-11-26 1999-06-03 Applied Materials, Inc. Damage-free sculptured coating deposition
US6911124B2 (en) 1998-09-24 2005-06-28 Applied Materials, Inc. Method of depositing a TaN seed layer
US6171363B1 (en) 1998-05-06 2001-01-09 H. C. Starck, Inc. Method for producing tantallum/niobium metal powders by the reduction of their oxides with gaseous magnesium
US6189663B1 (en) 1998-06-08 2001-02-20 General Motors Corporation Spray coatings for suspension damper rods
DE19847012A1 (de) 1998-10-13 2000-04-20 Starck H C Gmbh Co Kg Niobpulver und Verfahren zu dessen Herstellung
FR2785897B1 (fr) 1998-11-16 2000-12-08 Commissariat Energie Atomique Couche mince d'oxyde d'hafnium et procede de depot
US6328927B1 (en) 1998-12-24 2001-12-11 Praxair Technology, Inc. Method of making high-density, high-purity tungsten sputter targets
US6197082B1 (en) 1999-02-17 2001-03-06 H.C. Starck, Inc. Refining of tantalum and tantalum scrap with carbon
US6558447B1 (en) 1999-05-05 2003-05-06 H.C. Starck, Inc. Metal powders produced by the reduction of the oxides with gaseous magnesium
US6139913A (en) 1999-06-29 2000-10-31 National Center For Manufacturing Sciences Kinetic spray coating method and apparatus
JP2001020065A (ja) 1999-07-07 2001-01-23 Hitachi Metals Ltd スパッタリング用ターゲット及びその製造方法ならびに高融点金属粉末材料
US6261337B1 (en) 1999-08-19 2001-07-17 Prabhat Kumar Low oxygen refractory metal powder for powder metallurgy
US6521173B2 (en) 1999-08-19 2003-02-18 H.C. Starck, Inc. Low oxygen refractory metal powder for powder metallurgy
DE19942916A1 (de) * 1999-09-08 2001-03-15 Linde Gas Ag Herstellen von aufschäumbaren Metallkörpern und Metallschäumen
JP2001085378A (ja) 1999-09-13 2001-03-30 Sony Corp 半導体装置およびその製造方法
US6258402B1 (en) 1999-10-12 2001-07-10 Nakhleh Hussary Method for repairing spray-formed steel tooling
TW570987B (en) 1999-12-28 2004-01-11 Toshiba Corp Components for vacuum deposition apparatus and vacuum deposition apparatus therewith, and target apparatus
US6331233B1 (en) 2000-02-02 2001-12-18 Honeywell International Inc. Tantalum sputtering target with fine grains and uniform texture and method of manufacture
US7122069B2 (en) 2000-03-29 2006-10-17 Osram Sylvania Inc. Mo-Cu composite powder
US6502767B2 (en) 2000-05-03 2003-01-07 Asb Industries Advanced cold spray system
US20030023132A1 (en) 2000-05-31 2003-01-30 Melvin David B. Cyclic device for restructuring heart chamber geometry
JP2001347672A (ja) 2000-06-07 2001-12-18 Fuji Photo Film Co Ltd インクジェット記録ヘッドおよびインクジェット記録ヘッドの製造方法ならびにインクジェットプリンタ
WO2002027768A2 (en) 2000-09-27 2002-04-04 Nüp2 Incorporated Fabrication of semiconductor devices
US6498091B1 (en) 2000-11-01 2002-12-24 Applied Materials, Inc. Method of using a barrier sputter reactor to remove an underlying barrier layer
US6669782B1 (en) 2000-11-15 2003-12-30 Randhir P. S. Thakur Method and apparatus to control the formation of layers useful in integrated circuits
US6491208B2 (en) 2000-12-05 2002-12-10 Siemens Westinghouse Power Corporation Cold spray repair process
US6444259B1 (en) 2001-01-30 2002-09-03 Siemens Westinghouse Power Corporation Thermal barrier coating applied with cold spray technique
US7794554B2 (en) 2001-02-14 2010-09-14 H.C. Starck Inc. Rejuvenation of refractory metal products
CN1221684C (zh) 2001-02-14 2005-10-05 H·C·施塔克公司 高熔点金属制品的再生
EP1366203B1 (en) 2001-02-20 2006-09-13 H. C. Starck, Inc. Refractory metal plates with uniform texture and methods of making the same
US6915964B2 (en) 2001-04-24 2005-07-12 Innovative Technology, Inc. System and process for solid-state deposition and consolidation of high velocity powder particles using thermal plastic deformation
US6722584B2 (en) 2001-05-02 2004-04-20 Asb Industries, Inc. Cold spray system nozzle
US7053294B2 (en) 2001-07-13 2006-05-30 Midwest Research Institute Thin-film solar cell fabricated on a flexible metallic substrate
WO2003025244A2 (en) 2001-09-17 2003-03-27 Heraeus, Inc. Refurbishing spent sputtering targets
US7081148B2 (en) 2001-09-18 2006-07-25 Praxair S.T. Technology, Inc. Textured-grain-powder metallurgy tantalum sputter target
US6770154B2 (en) 2001-09-18 2004-08-03 Praxair S.T. Technology, Inc. Textured-grain-powder metallurgy tantalum sputter target
US6986471B1 (en) 2002-01-08 2006-01-17 Flame Spray Industries, Inc. Rotary plasma spray method and apparatus for applying a coating utilizing particle kinetics
US6861101B1 (en) 2002-01-08 2005-03-01 Flame Spray Industries, Inc. Plasma spray method for applying a coating utilizing particle kinetics
RU2333086C2 (ru) 2002-01-24 2008-09-10 Х.Ц. Щтарк, Инк. Очищенный лазерной обработкой и плавлением тугоплавкий металл и его сплав
US6627814B1 (en) 2002-03-22 2003-09-30 David H. Stark Hermetically sealed micro-device package with window
BE1014736A5 (fr) 2002-03-29 2004-03-02 Alloys For Technical Applic S Procede de fabrication et de recharge de cibles pour pulverisation cathodique.
US6896933B2 (en) 2002-04-05 2005-05-24 Delphi Technologies, Inc. Method of maintaining a non-obstructed interior opening in kinetic spray nozzles
US20030219542A1 (en) 2002-05-25 2003-11-27 Ewasyshyn Frank J. Method of forming dense coatings by powder spraying
DE10224780A1 (de) 2002-06-04 2003-12-18 Linde Ag Verfahren und Vorrichtung zum Kaltgasspritzen
DE10224777A1 (de) 2002-06-04 2003-12-18 Linde Ag Verfahren und Vorrichtung zum Kaltgasspritzen
US6759085B2 (en) 2002-06-17 2004-07-06 Sulzer Metco (Us) Inc. Method and apparatus for low pressure cold spraying
US7128988B2 (en) 2002-08-29 2006-10-31 Lambeth Systems Magnetic material structures, devices and methods
JP4883546B2 (ja) 2002-09-20 2012-02-22 Jx日鉱日石金属株式会社 タンタルスパッタリングターゲットの製造方法
US7108893B2 (en) 2002-09-23 2006-09-19 Delphi Technologies, Inc. Spray system with combined kinetic spray and thermal spray ability
US20040065546A1 (en) 2002-10-04 2004-04-08 Michaluk Christopher A. Method to recover spent components of a sputter target
CA2444917A1 (en) 2002-10-18 2004-04-18 United Technologies Corporation Cold sprayed copper for rocket engine applications
US6749002B2 (en) 2002-10-21 2004-06-15 Ford Motor Company Method of spray joining articles
DE10253794B4 (de) 2002-11-19 2005-03-17 Hühne, Erwin Dieter Niedertemperatur Hochgeschwindigkeits-Flammspritzsystem
TW571342B (en) 2002-12-18 2004-01-11 Au Optronics Corp Method of forming a thin film transistor
US7067197B2 (en) 2003-01-07 2006-06-27 Cabot Corporation Powder metallurgy sputtering targets and methods of producing same
ES2371070T3 (es) 2003-02-24 2011-12-27 Tekna Plasma Systems Inc. Procedimiento para fabricar un blanco de pulverización catódica.
JP4008388B2 (ja) 2003-06-30 2007-11-14 シャープ株式会社 半導体キャリア用フィルムおよびそれを用いた半導体装置、液晶モジュール
US7170915B2 (en) 2003-07-23 2007-01-30 Intel Corporation Anti-reflective (AR) coating for high index gain media
US7208230B2 (en) 2003-08-29 2007-04-24 General Electric Company Optical reflector for reducing radiation heat transfer to hot engine parts
US7128948B2 (en) 2003-10-20 2006-10-31 The Boeing Company Sprayed preforms for forming structural members
US20070172378A1 (en) 2004-01-30 2007-07-26 Nippon Tungsten Co., Ltd. Tungsten based sintered compact and method for production thereof
US6905728B1 (en) 2004-03-22 2005-06-14 Honeywell International, Inc. Cold gas-dynamic spray repair on gas turbine engine components
US20050220995A1 (en) 2004-04-06 2005-10-06 Yiping Hu Cold gas-dynamic spraying of wear resistant alloys on turbine blades
US20060021870A1 (en) 2004-07-27 2006-02-02 Applied Materials, Inc. Profile detection and refurbishment of deposition targets
US20060045785A1 (en) 2004-08-30 2006-03-02 Yiping Hu Method for repairing titanium alloy components
US20060042728A1 (en) 2004-08-31 2006-03-02 Brad Lemon Molybdenum sputtering targets
WO2006032522A1 (de) * 2004-09-25 2006-03-30 Abb Technology Ag Verfahren zur herstellung einer abbrandfesten beschichtung, sowie entsprechende schirmung für vakuumschaltkammern
US20060090593A1 (en) 2004-11-03 2006-05-04 Junhai Liu Cold spray formation of thin metal coatings
US20060121187A1 (en) 2004-12-03 2006-06-08 Haynes Jeffrey D Vacuum cold spray process
US7479299B2 (en) 2005-01-26 2009-01-20 Honeywell International Inc. Methods of forming high strength coatings
US7399335B2 (en) 2005-03-22 2008-07-15 H.C. Starck Inc. Method of preparing primary refractory metal
JP5065248B2 (ja) 2005-05-05 2012-10-31 ハー.ツェー.スタルク ゲゼルシャフト ミット ベシュレンクテル ハフツング 基材表面の被覆法及び被覆製品
US20060251872A1 (en) 2005-05-05 2006-11-09 Wang Jenn Y Conductive barrier layer, especially an alloy of ruthenium and tantalum and sputter deposition thereof
AU2006243448B2 (en) 2005-05-05 2011-09-01 H.C. Starck Inc. Coating process for manufacture or reprocessing of sputter targets and X-ray anodes
US20060289139A1 (en) * 2005-06-24 2006-12-28 Fushan Zhang Retention and drainage in the manufacture of paper
JP4795157B2 (ja) * 2005-10-24 2011-10-19 新日本製鐵株式会社 コールドスプレー装置
US20080078268A1 (en) 2006-10-03 2008-04-03 H.C. Starck Inc. Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof
BRPI0718237A2 (pt) 2006-11-07 2013-11-12 Starck H C Gmbh Método para revestir uma superfície de substrato e produto revestido
US20080145688A1 (en) 2006-12-13 2008-06-19 H.C. Starck Inc. Method of joining tantalum clade steel structures
WO2008081585A1 (ja) * 2007-01-05 2008-07-10 Kabushiki Kaisha Toshiba スパッタリングターゲットとその製造方法
US8784729B2 (en) 2007-01-16 2014-07-22 H.C. Starck Inc. High density refractory metals and alloys sputtering targets
US8197894B2 (en) 2007-05-04 2012-06-12 H.C. Starck Gmbh Methods of forming sputtering targets
US8246903B2 (en) 2008-09-09 2012-08-21 H.C. Starck Inc. Dynamic dehydriding of refractory metal powders

Also Published As

Publication number Publication date
KR20100039259A (ko) 2010-04-15
BRPI0904976A2 (pt) 2010-11-03
EP2172292A1 (en) 2010-04-07
CN101713071A (zh) 2010-05-26
JP2010090477A (ja) 2010-04-22
KR101456725B1 (ko) 2014-10-31
US8043655B2 (en) 2011-10-25
US20100086800A1 (en) 2010-04-08
ZA200906940B (en) 2011-06-29
EP2172292B1 (en) 2012-07-11
CN101713071B (zh) 2014-05-07
CA2681424A1 (en) 2010-04-06
MX2009010724A (es) 2010-10-05
RU2009136708A (ru) 2011-04-10

Similar Documents

Publication Publication Date Title
JP5725700B2 (ja) サブミクロン粒度を有するバルク金属構造体の製造法及びかかる方法により製造された構造体
EP2065480B1 (en) Molybdenum tubular sputtering targets with uniform grain size and texture
JP5450872B2 (ja) スパッタリングターゲットを再生させる方法
US8088232B2 (en) Molybdenum tubular sputtering targets with uniform grain size and texture
CN104759830B (zh) 生产性能增强的金属材料的方法
Qiu et al. A hybrid approach to improve microstructure and mechanical properties of cold spray additively manufactured A380 aluminum composites
Hall et al. Preparation of aluminum coatings containing homogenous nanocrystalline microstructures using the cold spray process
Maier et al. A novel approach for manufacturing oxide dispersion strengthened (ODS) steel cladding tubes using cold spray technology
WO2005079209A2 (en) Nanocrystalline material layers using cold spray
CN103572088B (zh) 具有纳米晶组织的钛基多孔烧结复合材料及其制备方法
CN103215528A (zh) 镁基金属玻璃薄膜及其制备方法和应用
US7895872B2 (en) Method of producing nanocrystalline monolithic articles
Kim et al. Solid-state cold spray additive manufacturing of pure tantalum with extraordinary high-temperature mechanical properties
Kim et al. Effect of nanopowder preparation method on the sintering behavior and microstructure of MoW alloy
US20060278308A1 (en) Method of consolidating precipitation-hardenable alloys to form consolidated articles with ultra-fine grain microstructures
Hasegawa et al. Texture evolution of nickel coatings fabricated by aerosol deposition
Wang et al. Sintering Behavior of Tungsten Heavy Alloy Products Made by Plasma Spray Forming
To et al. Microstructural changes at the ultra-precision raster milled surface of Zn-Al based alloy
Blednova et al. Influence of mechanical activation and mechanical alloying on the structure, phase state of the Fe-Ni-Co-Al-Nb powder composition and on high-entropy coatings based on it
Watazu et al. Noncombustible magnesium alloy processed by rotary-die equal channel angular pressing method
BYAKOVA et al. THE ROLE OF TECHNOLOGICAL PROCESS IN STRUCTURAL PERFORMANCES OF QUASI-CRYSTALLINE Al-Fe-Cr ALLOY.
Canakci et al. Sytentesis of Al-B4C composite coating on low carbon steel by mechanical alloying method
GOKMESE et al. Improvements of dry sliding wear behaviour and mechanical properties in 2014 Al alloy by age-hardening
Wang et al. PM HIP: Near-Net-Shape Refractory Metal Products Produced by Plasma Spray Forming

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20101227

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20101228

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120808

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120808

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130924

RD13 Notification of appointment of power of sub attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7433

Effective date: 20131004

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20131004

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20131224

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20140127

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140509

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20140519

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20140606

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150331

R150 Certificate of patent or registration of utility model

Ref document number: 5725700

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250