JP5665336B2 - 基板保持装置、及びそれを用いたリソグラフィー装置 - Google Patents

基板保持装置、及びそれを用いたリソグラフィー装置 Download PDF

Info

Publication number
JP5665336B2
JP5665336B2 JP2010063566A JP2010063566A JP5665336B2 JP 5665336 B2 JP5665336 B2 JP 5665336B2 JP 2010063566 A JP2010063566 A JP 2010063566A JP 2010063566 A JP2010063566 A JP 2010063566A JP 5665336 B2 JP5665336 B2 JP 5665336B2
Authority
JP
Japan
Prior art keywords
substrate
wafer
control unit
suction
main control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010063566A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011146663A5 (enExample
JP2011146663A (ja
Inventor
正俊 遠藤
正俊 遠藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2010063566A priority Critical patent/JP5665336B2/ja
Priority to US12/752,709 priority patent/US8472007B2/en
Publication of JP2011146663A publication Critical patent/JP2011146663A/ja
Priority to US13/901,331 priority patent/US9195129B2/en
Publication of JP2011146663A5 publication Critical patent/JP2011146663A5/ja
Application granted granted Critical
Publication of JP5665336B2 publication Critical patent/JP5665336B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/52—Details
    • G03B27/58—Baseboards, masking frames, or other holders for the sensitive material
    • G03B27/60—Baseboards, masking frames, or other holders for the sensitive material using a vacuum or fluid pressure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/52—Details
    • G03B27/58—Baseboards, masking frames, or other holders for the sensitive material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2010063566A 2009-04-06 2010-03-19 基板保持装置、及びそれを用いたリソグラフィー装置 Expired - Fee Related JP5665336B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010063566A JP5665336B2 (ja) 2009-04-06 2010-03-19 基板保持装置、及びそれを用いたリソグラフィー装置
US12/752,709 US8472007B2 (en) 2009-04-06 2010-04-01 Substrate holding device, lithography apparatus using same, and device manufacturing method
US13/901,331 US9195129B2 (en) 2009-04-06 2013-05-23 Substrate holding device, lithography apparatus using same, and device manufacturing method

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2009092458 2009-04-06
JP2009092458 2009-04-06
JP2009284545 2009-12-15
JP2009284545 2009-12-15
JP2010063566A JP5665336B2 (ja) 2009-04-06 2010-03-19 基板保持装置、及びそれを用いたリソグラフィー装置

Publications (3)

Publication Number Publication Date
JP2011146663A JP2011146663A (ja) 2011-07-28
JP2011146663A5 JP2011146663A5 (enExample) 2013-12-05
JP5665336B2 true JP5665336B2 (ja) 2015-02-04

Family

ID=43855107

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010063566A Expired - Fee Related JP5665336B2 (ja) 2009-04-06 2010-03-19 基板保持装置、及びそれを用いたリソグラフィー装置

Country Status (2)

Country Link
US (2) US8472007B2 (enExample)
JP (1) JP5665336B2 (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230176487A1 (en) * 2001-02-19 2023-06-08 Asml Netherlands B.V. Substrate support system, lithographic apparatus and method of exposing a substrate
JP5682106B2 (ja) * 2009-09-11 2015-03-11 株式会社ニコン 基板処理方法、及び基板処理装置
JP5908744B2 (ja) * 2012-02-24 2016-04-26 株式会社アドテックエンジニアリング 露光描画装置、プログラム及び露光描画方法
JP5908745B2 (ja) * 2012-02-24 2016-04-26 株式会社アドテックエンジニアリング 露光描画装置、プログラム及び露光描画方法
JP6308715B2 (ja) * 2012-09-27 2018-04-11 株式会社アドテックエンジニアリング 露光描画装置、移動制御方法およびプログラム
JP6535206B2 (ja) * 2014-05-08 2019-06-26 株式会社ブイ・テクノロジー 露光方法及び露光装置
NL2018051A (en) * 2016-02-08 2017-08-11 Asml Netherlands Bv Lithographic apparatus, method for unloading a substrate and method for loading a substrate
KR101958694B1 (ko) * 2016-03-03 2019-03-19 에이피시스템 주식회사 Ela 장치용 기판 지지모듈
JP6708455B2 (ja) 2016-03-25 2020-06-10 キヤノン株式会社 保持装置、保持方法、リソグラフィ装置、および物品の製造方法
JP6357187B2 (ja) 2016-03-31 2018-07-11 キヤノン株式会社 搬送装置、リソグラフィ装置、および物品の製造方法
JP6642225B2 (ja) * 2016-04-14 2020-02-05 富士通株式会社 ロボットハンド及びロボットハンドの制御プログラム
KR102556044B1 (ko) * 2016-05-16 2023-07-14 세메스 주식회사 기판 흡착 장치 및 방법
JP6706983B2 (ja) * 2016-07-12 2020-06-10 キヤノン株式会社 インプリント装置及び物品の製造方法
JP2018012178A (ja) * 2016-07-22 2018-01-25 株式会社ディスコ テーブル上面の検査方法
JP6940938B2 (ja) * 2016-09-20 2021-09-29 キヤノン株式会社 ステージ装置、リソグラフィ装置、および物品の製造方法
JP6917706B2 (ja) * 2016-12-27 2021-08-11 株式会社アルバック 吸着圧力分布の測定方法
JP6440757B2 (ja) * 2017-03-16 2018-12-19 キヤノン株式会社 基板搬送システム、リソグラフィ装置、および物品の製造方法
JP6960232B2 (ja) * 2017-03-24 2021-11-05 キヤノン株式会社 リソグラフィ装置、および物品製造方法
JP7193933B2 (ja) * 2018-06-22 2022-12-21 株式会社ディスコ 被加工物の搬送方法
KR102233467B1 (ko) * 2018-09-12 2021-03-31 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP2020096028A (ja) * 2018-12-11 2020-06-18 東京エレクトロン株式会社 検査装置、及び、検査方法
JP7133528B2 (ja) * 2019-10-03 2022-09-08 芝浦機械株式会社 延伸装置のクリップ移動速度計測装置及びクリップ移動速度計測方法
JP7414570B2 (ja) 2020-02-14 2024-01-16 キヤノン株式会社 保持装置、およびリソグラフィ装置
KR102765677B1 (ko) * 2020-04-29 2025-02-12 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
US11892778B2 (en) * 2021-07-07 2024-02-06 Changxin Memory Technologies, Inc. Device for adjusting wafer, reaction chamber, and method for adjusting wafer
JP7682744B2 (ja) * 2021-09-10 2025-05-26 キヤノン株式会社 保持装置、保持装置の吸着異常を判定する方法、リソグラフィー装置、及び、物品の製造方法
DE102021213421A1 (de) * 2021-11-29 2023-06-01 Festo Se & Co. Kg Ventilmodul und Verfahren zum Betreiben eines derartigen Ventilmoduls
CN116908217B (zh) * 2023-09-11 2023-11-17 中北大学 一种深孔测量与三维重建系统及其使用方法
CN117075448B (zh) * 2023-10-12 2023-12-29 无锡星微科技有限公司 纳米精度光刻气浮运动台
CN117712012B (zh) * 2024-02-06 2024-04-12 泓浒(苏州)半导体科技有限公司 基于伯努利原理的晶圆转运机械臂控制系统及方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3167090B2 (ja) * 1995-03-10 2001-05-14 キヤノン株式会社 基板受け渡し装置及び半導体製造装置
JPH1070069A (ja) 1996-08-28 1998-03-10 Canon Inc 半導体露光装置におけるごみ検出装置
JPH1070179A (ja) 1996-08-28 1998-03-10 Canon Inc 基板保持装置およびこれを用いた露光装置
JP4040423B2 (ja) 2002-10-16 2008-01-30 キヤノン株式会社 基板保持装置
JP2004163366A (ja) * 2002-11-15 2004-06-10 Nikon Corp 計測方法、基板保持方法、基板保持装置及び露光装置
JP2004273714A (ja) * 2003-03-07 2004-09-30 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP2006024683A (ja) * 2004-07-07 2006-01-26 Nikon Corp 搬送装置、露光装置、及び搬送方法
KR100689843B1 (ko) * 2006-01-03 2007-03-08 삼성전자주식회사 웨이퍼 스테이지 및 이를 이용한 웨이퍼 안착방법
US7582491B2 (en) * 2006-10-27 2009-09-01 Tokyo Electron Limited Method for diagnosing electrostatic chuck, vacuum processing apparatus, and storage medium
JP2008198754A (ja) 2007-02-13 2008-08-28 Canon Inc 露光装置

Also Published As

Publication number Publication date
US20110086298A1 (en) 2011-04-14
US9195129B2 (en) 2015-11-24
US8472007B2 (en) 2013-06-25
JP2011146663A (ja) 2011-07-28
US20130258309A1 (en) 2013-10-03

Similar Documents

Publication Publication Date Title
JP5665336B2 (ja) 基板保持装置、及びそれを用いたリソグラフィー装置
US20080068580A1 (en) Substrate-retaining unit
US20180174884A1 (en) Substrate holding method, substrate holding apparatus, exposure apparatus and exposure method
JP4625059B2 (ja) 支持構造体、リソグラフィ投影装置、ロボットおよびデバイス製造方法
US9575417B2 (en) Exposure apparatus including a mask holding device which holds a periphery area of a pattern area of the mask from above
US20160243707A1 (en) Conveying hand and lithography apparatus
JP3926805B2 (ja) 対象物を移送する装置及びその使用方法と該移送装置を含むリソグラフィ投影装置
JP6394965B2 (ja) 物体交換方法、物体交換システム、露光方法、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
TW201836059A (zh) 基板保持裝置、光刻裝置、物品之製造方法
JP4685041B2 (ja) ステージ装置、露光装置及びデバイス製造方法
US20050286202A1 (en) Electrostatic chuck, device manufacturing apparatus, and device manufacturing method
JP2007281073A (ja) 基板搬送装置
JP2005044882A (ja) 搬送装置及び露光装置
JP2001100169A (ja) 基板支持装置および基板処理装置
JP2010147294A (ja) 基板保持方法及び基板保持装置、それを用いた露光装置及びデバイスの製造方法
EP3990985B1 (en) Substrate handling system of a lithography apparatus and method thereof
JP2505915B2 (ja) 基板搬送装置
JP6362416B2 (ja) 保持装置、リソグラフィ装置、および物品の製造方法
JP7526762B2 (ja) フラットパネルツールにおいて基板を迅速にローディングするための方法
JP2017116889A (ja) 搬送装置及び方法、露光システム及び露光方法、並びにデバイス製造方法
JP6285636B2 (ja) 露光装置、露光方法及びデバイスの製造方法
JP2003289098A (ja) 基板処理装置、基板保持装置、露光方法及び露光装置
JP2009076587A (ja) 基板搬送装置、基板搬送方法、基板処理システム及び露光方法並びにデバイスの製造方法
JP2010147264A (ja) 物体保持装置、物体保持方法、露光方法、露光装置及び電子デバイスの製造方法
JP2014035399A (ja) 物体交換方法、物体交換システム、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130319

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20131021

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20131021

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20140226

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140227

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140304

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140507

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140610

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140808

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20141111

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20141209

R151 Written notification of patent or utility model registration

Ref document number: 5665336

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

LAPS Cancellation because of no payment of annual fees