JP5664664B2 - 接合方法、電子装置の製造方法、および電子部品 - Google Patents

接合方法、電子装置の製造方法、および電子部品 Download PDF

Info

Publication number
JP5664664B2
JP5664664B2 JP2012549868A JP2012549868A JP5664664B2 JP 5664664 B2 JP5664664 B2 JP 5664664B2 JP 2012549868 A JP2012549868 A JP 2012549868A JP 2012549868 A JP2012549868 A JP 2012549868A JP 5664664 B2 JP5664664 B2 JP 5664664B2
Authority
JP
Japan
Prior art keywords
metal
melting point
metal member
low melting
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012549868A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2012086745A1 (ja
Inventor
公介 中野
公介 中野
高岡　英清
英清 高岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2012549868A priority Critical patent/JP5664664B2/ja
Publication of JPWO2012086745A1 publication Critical patent/JPWO2012086745A1/ja
Application granted granted Critical
Publication of JP5664664B2 publication Critical patent/JP5664664B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0233—Sheets or foils
    • B23K35/0238—Sheets or foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Die Bonding (AREA)
JP2012549868A 2010-12-24 2011-12-22 接合方法、電子装置の製造方法、および電子部品 Active JP5664664B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012549868A JP5664664B2 (ja) 2010-12-24 2011-12-22 接合方法、電子装置の製造方法、および電子部品

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2010287782 2010-12-24
JP2010287782 2010-12-24
JP2011159922 2011-07-21
JP2011159922 2011-07-21
PCT/JP2011/079781 WO2012086745A1 (ja) 2010-12-24 2011-12-22 接合方法、接合構造、電子装置、電子装置の製造方法、および電子部品
JP2012549868A JP5664664B2 (ja) 2010-12-24 2011-12-22 接合方法、電子装置の製造方法、および電子部品

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014129244A Division JP5907215B2 (ja) 2010-12-24 2014-06-24 接合構造および電子装置

Publications (2)

Publication Number Publication Date
JPWO2012086745A1 JPWO2012086745A1 (ja) 2014-06-05
JP5664664B2 true JP5664664B2 (ja) 2015-02-04

Family

ID=46314012

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2012549868A Active JP5664664B2 (ja) 2010-12-24 2011-12-22 接合方法、電子装置の製造方法、および電子部品
JP2014129244A Active JP5907215B2 (ja) 2010-12-24 2014-06-24 接合構造および電子装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014129244A Active JP5907215B2 (ja) 2010-12-24 2014-06-24 接合構造および電子装置

Country Status (7)

Country Link
US (2) US9209527B2 (https=)
EP (1) EP2656955B1 (https=)
JP (2) JP5664664B2 (https=)
KR (1) KR101528515B1 (https=)
CN (1) CN103167926B (https=)
TW (1) TWI461252B (https=)
WO (1) WO2012086745A1 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105873713B (zh) * 2014-01-07 2018-07-10 株式会社村田制作所 结构材料接合方法、接合用片材和接合结构
JP6213666B2 (ja) * 2014-04-18 2017-10-18 株式会社村田製作所 被着体の接着分離方法
JP6287739B2 (ja) * 2014-09-30 2018-03-07 株式会社村田製作所 ステンドグラスの製造方法
CN105081500B (zh) * 2015-09-02 2017-02-22 哈尔滨工业大学 一种使用激光前向转印具有特定晶粒取向和数量薄膜诱发金属间化合物生长的方法
JP6332566B2 (ja) 2015-09-15 2018-05-30 株式会社村田製作所 接合用部材、接合用部材の製造方法、および、接合方法
JP6528852B2 (ja) 2015-09-28 2019-06-12 株式会社村田製作所 ヒートパイプ、放熱部品、ヒートパイプの製造方法
WO2017077824A1 (ja) * 2015-11-05 2017-05-11 株式会社村田製作所 接合用部材、および、接合用部材の製造方法
WO2017134974A1 (ja) * 2016-02-01 2017-08-10 株式会社村田製作所 接合材、それを用いた接合方法及び接合構造
JP6621068B2 (ja) * 2016-12-08 2019-12-18 パナソニックＩｐマネジメント株式会社 実装構造体
JP6355091B1 (ja) * 2017-03-07 2018-07-11 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた接合構造体
WO2018174066A1 (ja) * 2017-03-23 2018-09-27 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
DE102017206932A1 (de) * 2017-04-25 2018-10-25 Siemens Aktiengesellschaft Lotformteil zum Erzeugen einer Diffusionslötverbindung und Verfahren zum Erzeugen eines Lotformteils
JP6998557B2 (ja) * 2017-09-29 2022-01-18 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた接合構造体
CN108098172B (zh) * 2017-12-01 2020-03-27 北京工业大学 一种实现Cu/Sn/Cu界面可逆连接的方法
KR102574413B1 (ko) * 2018-12-10 2023-09-04 삼성전기주식회사 코일 전자 부품
US11581239B2 (en) * 2019-01-18 2023-02-14 Indium Corporation Lead-free solder paste as thermal interface material
KR102148297B1 (ko) * 2019-03-06 2020-08-26 성균관대학교산학협력단 이종 금속 재료 간의 접합을 위한 천이액상소결접합 방법
CN109822256B (zh) * 2019-03-15 2021-08-06 南昌大学 一种低熔点In-Sn-Bi合金钎料及制备方法
CN114173983A (zh) * 2019-07-26 2022-03-11 日本斯倍利亚社股份有限公司 预制焊料和使用该预制焊料形成的焊料接合体
DE112020004146T5 (de) * 2019-09-02 2022-05-25 Nihon Superior Co., Ltd. Lötpasten und lötstellen
CN113275787B (zh) * 2020-01-31 2023-05-30 铟泰公司 作为热界面材料的无铅焊料膏
WO2021177006A1 (ja) * 2020-03-06 2021-09-10 三菱電機株式会社 薄板状接合部材およびその製造方法、半導体装置およびその製造方法、ならびに、電力変換装置
JP6799701B1 (ja) * 2020-03-12 2020-12-16 有限会社 ナプラ 金属粒子

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002254195A (ja) * 2000-12-25 2002-09-10 Tdk Corp はんだ付け用組成物及びはんだ付け方法
JP2003094193A (ja) * 2002-06-18 2003-04-02 Matsushita Electric Ind Co Ltd 鉛フリー半田ペースト
JP2003211289A (ja) * 2002-01-21 2003-07-29 Fujitsu Ltd 導電性接合材料、それを用いた接合方法及び電子機器
US6602777B1 (en) * 2001-12-28 2003-08-05 National Central University Method for controlling the formation of intermetallic compounds in solder joints
JP2003332731A (ja) * 2002-05-09 2003-11-21 Murata Mfg Co Ltd Ｐｂフリー半田付け物品
JP2005288458A (ja) * 2004-03-31 2005-10-20 Toshiba Corp 接合体、半導体装置、接合方法、及び半導体装置の製造方法
WO2006075459A1 (ja) * 2005-01-11 2006-07-20 Murata Manufacturing Co., Ltd はんだペースト、及び電子装置
WO2007125861A1 (ja) * 2006-04-26 2007-11-08 Senju Metal Industry Co., Ltd. ソルダペースト
JP2010149185A (ja) * 2008-11-28 2010-07-08 Asahi Kasei E-Materials Corp 金属フィラー、はんだペースト、及び接続構造体

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6371361B1 (en) * 1996-02-09 2002-04-16 Matsushita Electric Industrial Co., Ltd. Soldering alloy, cream solder and soldering method
US5863493A (en) * 1996-12-16 1999-01-26 Ford Motor Company Lead-free solder compositions
ES2224609T3 (es) * 1998-03-26 2005-03-01 Nihon Superior Sha Co., Ltd Aleacion de soldadura exenta de plomo.
TWI248842B (en) 2000-06-12 2006-02-11 Hitachi Ltd Semiconductor device and semiconductor module
JP4271684B2 (ja) * 2003-10-24 2009-06-03 日鉱金属株式会社 ニッケル合金スパッタリングターゲット及びニッケル合金薄膜
US7064446B2 (en) * 2004-03-29 2006-06-20 Intel Corporation Under bump metallization layer to enable use of high tin content solder bumps
JP4344707B2 (ja) * 2005-02-24 2009-10-14 株式会社ルネサステクノロジ 半導体装置およびその製造方法
JP4501818B2 (ja) * 2005-09-02 2010-07-14 日立電線株式会社 銅合金材およびその製造方法
CN101512761A (zh) 2006-09-01 2009-08-19 株式会社村田制作所 电子部件装置及其制造方法与电子部件组件及其制造方法
JP5093235B2 (ja) 2007-06-04 2012-12-12 株式会社村田製作所 電子部品装置およびその製造方法
KR101406174B1 (ko) * 2007-06-18 2014-06-12 엠케이전자 주식회사 주석, 은 및 비스무스를 함유하는 무연솔더
WO2009051181A1 (ja) 2007-10-19 2009-04-23 Nihon Superior Sha Co., Ltd. 無鉛はんだ合金
CN101842506B (zh) * 2007-11-01 2012-08-22 古河电气工业株式会社 强度、弯曲加工性、抗应力松弛性能优异的铜合金材料及其制造方法
JP5169354B2 (ja) * 2008-03-18 2013-03-27 富士通株式会社 接合材料及びそれを用いた接合方法
WO2011027659A1 (ja) * 2009-09-03 2011-03-10 株式会社村田製作所 ソルダペースト、それを用いた接合方法、および接合構造
EP2641689B1 (en) * 2010-11-19 2016-06-29 Murata Manufacturing Co., Ltd. Electroconductive material, method of connection with same, and connected structure

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002254195A (ja) * 2000-12-25 2002-09-10 Tdk Corp はんだ付け用組成物及びはんだ付け方法
US6602777B1 (en) * 2001-12-28 2003-08-05 National Central University Method for controlling the formation of intermetallic compounds in solder joints
JP2003211289A (ja) * 2002-01-21 2003-07-29 Fujitsu Ltd 導電性接合材料、それを用いた接合方法及び電子機器
JP2003332731A (ja) * 2002-05-09 2003-11-21 Murata Mfg Co Ltd Ｐｂフリー半田付け物品
JP2003094193A (ja) * 2002-06-18 2003-04-02 Matsushita Electric Ind Co Ltd 鉛フリー半田ペースト
JP2005288458A (ja) * 2004-03-31 2005-10-20 Toshiba Corp 接合体、半導体装置、接合方法、及び半導体装置の製造方法
WO2006075459A1 (ja) * 2005-01-11 2006-07-20 Murata Manufacturing Co., Ltd はんだペースト、及び電子装置
WO2007125861A1 (ja) * 2006-04-26 2007-11-08 Senju Metal Industry Co., Ltd. ソルダペースト
JP2010149185A (ja) * 2008-11-28 2010-07-08 Asahi Kasei E-Materials Corp 金属フィラー、はんだペースト、及び接続構造体

Also Published As

Publication number Publication date
JP5907215B2 (ja) 2016-04-26
EP2656955A1 (en) 2013-10-30
US9209527B2 (en) 2015-12-08
US20160043480A1 (en) 2016-02-11
EP2656955B1 (en) 2021-08-04
TWI461252B (zh) 2014-11-21
US9614295B2 (en) 2017-04-04
CN103167926A (zh) 2013-06-19
CN103167926B (zh) 2016-03-09
KR101528515B1 (ko) 2015-06-12
KR20130077873A (ko) 2013-07-09
JPWO2012086745A1 (ja) 2014-06-05
US20130299236A1 (en) 2013-11-14
WO2012086745A1 (ja) 2012-06-28
JP2014223678A (ja) 2014-12-04
TW201233485A (en) 2012-08-16
EP2656955A4 (en) 2017-07-19

Similar Documents

Publication Publication Date Title
JP5664664B2 (ja) 接合方法、電子装置の製造方法、および電子部品
JP2014223678A5 (https=)
JP6912519B2 (ja) はんだ組成物
JP5943065B2 (ja) 接合方法、電子装置の製造方法、および電子部品
CN103561903B (zh) 无铅焊料合金
JP5045673B2 (ja) 機能部品用リッドとその製造方法
JP5943066B2 (ja) 接合方法および接合構造体の製造方法
JPWO2013132942A1 (ja) 接合方法、接合構造体およびその製造方法
JP2024526066A (ja) 混合はんだ合金粉末を用いた高信頼性鉛フリーはんだペースト
CN107530834A (zh) 混合合金焊料膏
JP2012200789A (ja) Ａｕ−Ｓｎ合金はんだ
KR101360142B1 (ko) 무연 솔더 조성물
JP2008221330A (ja) はんだ合金
TWI603803B (zh) Lead-free solder alloy
WO2016157971A1 (ja) はんだペースト

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140430

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140624

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20141111

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20141124

R150 Certificate of patent or registration of utility model

Ref document number: 5664664

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150