JP5660076B2 - 半導体装置とその製造方法 - Google Patents

半導体装置とその製造方法 Download PDF

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Publication number
JP5660076B2
JP5660076B2 JP2012101297A JP2012101297A JP5660076B2 JP 5660076 B2 JP5660076 B2 JP 5660076B2 JP 2012101297 A JP2012101297 A JP 2012101297A JP 2012101297 A JP2012101297 A JP 2012101297A JP 5660076 B2 JP5660076 B2 JP 5660076B2
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JP
Japan
Prior art keywords
printed circuit
circuit board
flat cable
flat
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012101297A
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English (en)
Japanese (ja)
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JP2013229489A (ja
JP2013229489A5 (cg-RX-API-DMAC7.html
Inventor
太一 小原
太一 小原
玲 米山
玲 米山
浩之 岡部
浩之 岡部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2012101297A priority Critical patent/JP5660076B2/ja
Priority to US13/828,142 priority patent/US9125308B2/en
Priority to DE102013204565.4A priority patent/DE102013204565B4/de
Priority to CN201310147145.XA priority patent/CN103379735B/zh
Publication of JP2013229489A publication Critical patent/JP2013229489A/ja
Publication of JP2013229489A5 publication Critical patent/JP2013229489A5/ja
Application granted granted Critical
Publication of JP5660076B2 publication Critical patent/JP5660076B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45565—Single coating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10356—Cables
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Pressure Sensors (AREA)
JP2012101297A 2012-04-26 2012-04-26 半導体装置とその製造方法 Active JP5660076B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012101297A JP5660076B2 (ja) 2012-04-26 2012-04-26 半導体装置とその製造方法
US13/828,142 US9125308B2 (en) 2012-04-26 2013-03-14 Semiconductor device and method of manufacturing thereof
DE102013204565.4A DE102013204565B4 (de) 2012-04-26 2013-03-15 Halbleitervorrichtung und Verfahren zum Herstellen derselben
CN201310147145.XA CN103379735B (zh) 2012-04-26 2013-04-25 半导体装置及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012101297A JP5660076B2 (ja) 2012-04-26 2012-04-26 半導体装置とその製造方法

Publications (3)

Publication Number Publication Date
JP2013229489A JP2013229489A (ja) 2013-11-07
JP2013229489A5 JP2013229489A5 (cg-RX-API-DMAC7.html) 2014-10-09
JP5660076B2 true JP5660076B2 (ja) 2015-01-28

Family

ID=49323389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012101297A Active JP5660076B2 (ja) 2012-04-26 2012-04-26 半導体装置とその製造方法

Country Status (4)

Country Link
US (1) US9125308B2 (cg-RX-API-DMAC7.html)
JP (1) JP5660076B2 (cg-RX-API-DMAC7.html)
CN (1) CN103379735B (cg-RX-API-DMAC7.html)
DE (1) DE102013204565B4 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022127941A1 (de) * 2022-10-21 2024-05-02 Vega Grieshaber Kg Feldgerät und Verfahren zur kompakten Anordnung von elektronischen Baugruppen einer Elektronikschaltung

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4860075U (cg-RX-API-DMAC7.html) * 1971-11-12 1973-07-31
JPS5340476U (cg-RX-API-DMAC7.html) * 1976-09-10 1978-04-07
JPS5943593A (ja) 1982-09-06 1984-03-10 富士通株式会社 電子回路モジユ−ルの製造方法
DE8413336U1 (de) 1984-05-02 1984-08-23 Gossen Gmbh, 8520 Erlangen Flachbandkabel
JP2678327B2 (ja) * 1991-02-15 1997-11-17 住友金属鉱山株式会社 フレキシブル配線基板およびその製造方法
US5428190A (en) * 1993-07-02 1995-06-27 Sheldahl, Inc. Rigid-flex board with anisotropic interconnect and method of manufacture
JP3286104B2 (ja) * 1995-01-24 2002-05-27 ヒロセ電機株式会社 保持体付同軸セミリジッドケーブル組立体
JP3430192B2 (ja) * 1996-11-12 2003-07-28 株式会社日立産機システム インバータ装置
JPH10209594A (ja) * 1997-01-17 1998-08-07 Fuji Photo Optical Co Ltd フレキシブルプリント回路基板と硬質プリント回路基板との接続構造
KR100422089B1 (ko) 1999-04-22 2004-03-11 롬 가부시키가이샤 회로기판, 전지 팩 및 회로기판의 제조방법
JP3667176B2 (ja) * 1999-11-12 2005-07-06 平河ヒューテック株式会社 フラットケーブルおよびその製造方法
JP4667652B2 (ja) * 2001-06-12 2011-04-13 ローム株式会社 電池パック、およびその製造方法
JP4330294B2 (ja) 2001-08-10 2009-09-16 三菱電機株式会社 電力用半導体装置
JP2003100156A (ja) 2001-09-26 2003-04-04 Canon Inc ケーブル及び電子機器
JP2004297972A (ja) * 2003-03-28 2004-10-21 Toyota Industries Corp 半導体装置
JP4265394B2 (ja) * 2003-12-17 2009-05-20 株式会社日立製作所 電力変換装置
US7148428B2 (en) 2004-09-27 2006-12-12 Intel Corporation Flexible cable for high-speed interconnect
JP4673211B2 (ja) * 2005-12-27 2011-04-20 日立オートモティブシステムズ株式会社 電力変換装置
US20100202119A1 (en) 2007-09-21 2010-08-12 Mitsubishi Electric Corporation Structure for fixing flexible wiring board
JP2010105640A (ja) 2008-10-31 2010-05-13 Nsk Ltd 電動パワーステアリング装置
JP2010165914A (ja) 2009-01-16 2010-07-29 Toshiba Carrier Corp インバータ装置及びインバータ装置の製造方法
JP5153706B2 (ja) 2009-03-26 2013-02-27 京セラ株式会社 Ｅｃｕ用混成集積回路装置
JP5375408B2 (ja) * 2009-07-24 2013-12-25 住友電気工業株式会社 同軸線ハーネス
US9363894B2 (en) 2010-09-24 2016-06-07 Semiconductor Components Industries, Llc Circuit device
JP5579576B2 (ja) 2010-11-08 2014-08-27 サンドビック株式会社 無端ベルトの製造方法及び装着方法

Also Published As

Publication number Publication date
CN103379735B (zh) 2016-06-08
DE102013204565B4 (de) 2023-04-20
US20130286622A1 (en) 2013-10-31
US9125308B2 (en) 2015-09-01
CN103379735A (zh) 2013-10-30
JP2013229489A (ja) 2013-11-07
DE102013204565A1 (de) 2013-10-31

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